Type CD Low Resistance Precision Chip Resistors
Page 1 of 2
Type CD Low Resistance Precision Chip Resistors utilize the proven Caddock
Micronox
®
resistance films to achieve the unique low resistance range in this
family. The special performance features of the Type CD Low Resistance
Precision Film Resistor include:
•
Style FC
- Flip Chip version for surface mount applications.
Style WB
- Wire Bond version for hybrid applications with metallized
back surface for solder down heat sinking of the chip, includes bondable
termination pedestals to receive aluminum wire bonds.
Resistance as low as 0.010 ohm at ±1%.
Pedestal terminals in this design provide an ultra low resistance
connection pad which maintains the precision 0.010Ω ±1% at the point
of customer Kelvin connection to the resistor chip. The pedestal terminal
with its copper core also provides heat spreading which enhances the
high power handling capability.
Low Resistance Chip down to 0.010Ω at ±1% with unique Pedestal Terminal Design
for Current Sense in Hybrid and SMT Applications
•
•
•
•
•
Thermal resistance is provided to optimize high power designs when
utilizing higher thermal conductivity circuit board substrates such as IMS
or Alumina.
High pulse handling and overload capability.
Low inductance provides excellent high frequency and pulse response.
is a surface mount version with solderable pedestal terminals for
flip chip
soldering.
Power Capability Information
Max. Chip
Temperature
Style FC - Flip Chip Version
Resistance
Model
CD2015FC
CD2520FC
Min.
0.010
Ω
0.010
Ω
Max.
0.20
Ω
0.20
Ω
General Applications High Power Applications
Thermal Resistance -
R
θJC
Power Rating
Film (J) to Solder Pad (C)
at 70° C
(see note 2)
(see note 1)
1.0 Watt
1.5 Watts
12.0°C/Watt
9.0°C/Watt
Dimensions in inches and (millimeters)
A
B
C
D
Comments
150°C
150°C
.200
±.012
(5.08
±.30
.250
±.012
(6.35
±.30)
.150
±.012
(3.81
±.30)
.200
±.012
(5.08
±.30)
.063
±.006
(1.60
±.15)
.063
±.006
(1.60
±.15
.062 min.
(1.57 min.)
.078 min.
(1.98 min.)
Solderable Pedestal
Solderable Pedestal
Style FC Derating Curve For General Applications
100
RATED LOAD, %
80
60
40
20
0
25
70
100
150
AMBIENT TEMPERATURE,
o
C
Note 1: General Applications -
The power rating for
general applications is based upon 0.5 sq. in. (300
mm
2
) of termination pad or trace area (2 oz. copper)
connected to each end of the resistor. Maximum chip
temperature is 150°C. Use Derating Curve to derate
appropriately for the maximum ambient temperature
and for the temperature limitations of the adjacent
materials.
CD2015FC Standard Resistance Values:
Tolerance CD2015FC ±1% Standard.
0.010
Ω
0.015
Ω
0.020
Ω
0.025
Ω
0.030
Ω
0.033
Ω
0.040
Ω
0.050
Ω
0.075
Ω
0.10
Ω
0.20
Ω
CD2520FC Standard Resistance Values:
Tolerance CD2520FC ±1% Standard.
0.010
Ω
0.015
Ω
0.020
Ω
0.025
Ω
0.030
Ω
0.033
Ω
0.040
Ω
0.050
Ω
0.075
Ω
0.10
Ω
0.20
Ω
Note 2: Thermal Resistance -
In High Power Applications where the circuit board material
provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of
the chip resistor is useful to establish the maximum power capability of the chip resistor in the
application. The film temperature is measured at the center of the resistor element and solder
pad temperature at the center of the solderable pedestal (point X in the recommended circuit
layout shown below). Maximum temperature of the chip resistor (at the center of chip) should
not exceed 150°C through the temperature range of the application
.
Custom resistance values and non-standard tolerances
can be manufactured for high quantity applications.
Please contact Caddock Applications Engineering.
Recommended Circuit Board Layout
(current and sense connections):
Fig. 1A:
Recommended Kelvin layout.
C = Current connection
S = Sense connection
C
C
Note: Actual width of current trace is based on
magnitude of current. Point of connection should
be in the area shown.
X
S
S
X
e-mail: caddock@caddock.com • web: www.caddock.com
For Caddock Distributors listed by country see caddock.com/contact/dist.html
© 2003-2017 Caddock Electronics, Inc.
ELECTRONICS, INC.
Sales and Applications Engineering
17271 North Umpqua Hwy.
Roseburg, Oregon 97470-9422
Phone: (541) 496-0700
Fax: (541) 496-0408
28_IL117.0717
Type CD Low Resistance Precision Chip Resistors
Page 2 of 2
Style WB - Wire Bond Version
Resistance
Model
CD2015WBA
CD2520WBA
is a hybrid mountable version with copper pedestal terminals and an aluminum surface layer for wire
bonding. The back surface of these devices is metallized for solder attachment of the chip resistor to a heat sinking substrate.
Power Capability Information
Thermal Resistance
R
θJC
Film (J) to Solder Pad (C)
(see note 3)
8.33°C/Watt
5.00°C/Watt
Max. Chip
Temperature
Dimensions in inches and (millimeters)
A
.200
±.012
(5.08
±.30)
.250
±.012
(6.35
±.30)
B
.150
±.012
(3.81
±.30)
.200
±.012
(5.08
±.30)
C
.061
±.005
(1.55
±.13)
.061
±.005
(1.55
±.13)
D
.062 min.
(1.57 min.)
.078 min.
(1.98 min.)
Comments
Terminals have an Aluminum surface layer for
wire bonding. Aluminum wire to be used for bonding.
Terminals have an Aluminum surface layer for
wire bonding. Aluminum wire to be used for bonding.
Min.
0.010
Ω
0.010
Ω
Max.
0.20
Ω
0.20
Ω
150°C
150°C
Note 3: Thermal Resistance -
In High Power Applications where the circuit board material
provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of
the chip resistor is useful to establish the maximum power capability of the chip resistor in the
application. The film temperature is measured at the center of the resistor element and the
solder pad temperature is measured at the soldered interface with the circuit board. Maximum
temperature of the chip resistor (at the center of chip) should not exceed 150°C through the
temperature range of the application.
CD2015WBA
Standard Resistance Values:
Tolerance CD2015WBA ±1% Standard.
0.010
Ω
0.015
Ω
0.020
Ω
0.025
Ω
0.030
Ω
0.033
Ω
0.040
Ω
0.050
Ω
0.075
Ω
0.10
Ω
0.20
Ω
Location for Sense (Potential) Connection:
Note: The sense connection for each
pedestal is positioned inboard of the current
connection (single or multiple current wires).
Film Temperature
Measuring Point
Sense Wire
Current Wire
Sense Wire
Current Wire
Solder pad, soldered
interface with circuit board.
Circuit board: IMS, Ceramic (Alumina) , or other.
WB Resistor mounting
CD2520WBA
Standard Resistance Values:
Tolerance CD2520WBA ±1% Standard.
0.010
Ω
0.015
Ω
0.020
Ω
0.025
Ω
0.030
Ω
0.033
Ω
0.040
Ω
0.050
Ω
0.075
Ω
0.10
Ω
0.20
Ω
Custom resistance values and non-standard tolerances
can be manufactured for high quantity applications.
Please contact Caddock Applications Engineering.
General Information for Type CD - Style FC and Style WB - Chip Resistors
Specifications:
Temperature Coefficient:
TC referenced to
+25°C,
∆R
taken at +150°C.
0.050 ohm to 0.20 ohm, 0 to +100 ppm/°C.
0.010 ohm to 0.049 ohm, 0 to +200 ppm/°C.
Inductance:
Less than 5 nH typical.
Load Life:
1000 hours at rated power, based
upon 150°C max. chip temperature,
∆R
± (0.5% + 0.0005 ohm).
Momentary Overload:
1.5 times rated
power, for 5 seconds,
∆R
± (0.5% + 0.0005
ohm).
Operating Temperature:
-55°C to +150°C.
Measurement Note:
All measurements
are taken using Kelvin connections per the
recommended connection locations.
A
D
Solder attachment notes:
During soldering of the Type CD Resistor
the soldering temperature profile must not
cause the pedestal terminals of this device
to exceed 220°C.
Style FC - Flip Chip version
resistors
have a bare ceramic back surface. The
recommended solder for flip chip solder
attachment is 62Sn / 36Pb / 2Ag.
Style WB - Wire Bond version
resistors
have a metallized back surface for
soldering to a substrate or a heat sink.
The recommended solder is
62Sn / 36Pb / 2Ag.
Packaging information:
Style FC,
flip chip resistors, are shipped with the bare
ceramic side up in the pocket, with the solderable pedestals
facing down.
Style WB,
wire bondable resistors, are shipped with the
wire bondable pedestals facing up in the pocket.
The illustration shows the orientation of the CD2015 chip
resistors in the tape. The CD2520 chip resistors are rotated 90°
from what is shown in the illustration.
7” dia.
(178 mm)
12mm
0.473”
Ao
Bo
Ko signifies tape thickness and dimension
.512” arbor hole
(13mm)
Size 2015
Ao
Size 2520
0.189” (4.80mm) 0.271” (6.88mm)
0.209” (5.31mm) 0.216” (5.49mm)
0.087” (2.21mm) 0.066” (1.68mm)
Ordering
Information:
B
Bo
Physical Size
2015 = 0.200” x 0.150”
2520 = 0.250” x 0.200”
Ko
Carrier Tape and pocket dimensions:
Tape is 12mm Carrier Tape (8mm pitch)
CD 2520 FC - 0.10 - 1%
Type CD
Style:
FC or WBA
Resistor Value (Ω)
See charts for availability
Tolerance:
±1%
0.010
Ω
and above.
Full reel quantities:
1000 pieces per reel for CD2015 and CD2520
C
Quantities of less than 250 will be shipped in tape without reel
and without tape leader at the option of Caddock.
Dimensions in inches and (millimeters)
Tape dimensions and materials will be consistent with EIA-481-1.
Reels will be marked with a label containing Caddock logo, part
number, resistor value, tolerance, packaging date, and quantity.
e-mail: caddock@caddock.com • web: www.caddock.com
For Caddock Distributors listed by country see caddock.com/contact/dist.html
© 2003-2017 Caddock Electronics, Inc.
ELECTRONICS, INC.
Sales and Applications Engineering
17271 North Umpqua Hwy.
Roseburg, Oregon 97470-9422
Phone: (541) 496-0700
Fax: (541) 496-0408
28_IL117.0717
