CDHV
www.vishay.com
Vishay Techno
Thick Film Chip Dividers, High Voltage
FEATURES
• High voltage up to 3000 V
• Typical resistance ratios of 250:1 to a maximum
resistance ratio of 500:1
• Flow solderable
• Tape and reel packaging available
• Termination style: 3-sided wraparound termination or
single termination flip chip available
• Suitable for solderable, epoxy bondable, or wire bondable
applications
• Termination material: solder-coated nickel barrier or
solder coated non-magnetic terminations standard; gold,
palladium silver, platinum gold, platinum silver or platinum
palladium gold terminations available
• Multiple styles, termination materials and configurations,
allow wide design flexibility
• Epoxy bondable or
terminations available
wire
bondable
non-magnetic
Available
Available
LINKS TO ADDITIONAL RESOURCES
D
D
3
3
3D Models
Footprints
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts
with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details
STANDARD ELECTRICAL SPECIFICATIONS
GLOBAL
MODEL
CDHV 2512
CASE
SIZE
2512
POWER RATING
P
70 °C
W
1
MAXIMUM
WORKING
VOLTAGE
(1)
V
3000
RESISTANCE
RANGE
(2)
Ω
20M to 20G
TOLERANCE
(3)
±%
1, 2, 5, 10, 20
TEMPERATURE
COEFFICIENT
(4)
(-55 °C to +155 °C)
± ppm/°C
100
TCR TRACKING
± ppm/°C
50 (typical)
Notes
(1)
Continuous working voltage shall be
P
x
R
or maximum working voltage, whichever is less
(2)
Resistance values below 1 GΩ are calibrated at 100 V , and values of 1 GΩ and above are calibrated at 1000 V . Calibration at other
DC
DC
voltages available upon request
(3)
Contact factory for tighter tolerances
(4)
Reference only: not for all values specified. Consult factory for your value
VOLTAGE AND TEMPERATURE COEFFICIENTS OF RESISTANCE CHART TYPICAL
RESISTANCE (Ω)
20M
150M
800M
Note
• Contact factory for other ratios
RATIO (TYPICAL)
250:1
300:1
500:1
VCR (ppm/V)
10
10
10
TCR (ppm/°C) -55 °C to +155 °C
100
150
200
Revision: 17-Jul-2020
Document Number: 68020
1
For technical questions, contact:
te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CDHV
www.vishay.com
Vishay Techno
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: CDHVAF20M0J2500GFB (preferred part number format)
C
GLOBAL
MODEL
D
TERM
STYLE
H
V
TERM
MATERIAL
A
F
2
0
M
0
J
2
5
0
0
G
F
B
RESISTANCE
VALUE (R
1
)
TOLERANCE
RATIO
(R
1
+ R
2
) / R
2
RATIO
TOLERANCE
G
=±2%
H
=±3%
J
=±5%
SOLDER
TERMINATION
E
= Sn100
F
= Sn95/Ag5,
HSD
N
= no solder
S
= Sn62 /
Pb36 / Ag2,
HSD
T
= Sn90 / Pb10
PACKAGING
B
= bulk
F
=T/R
(full reel)
1
=T/R
(1000 pcs)
5
=T/R
(500 pcs)
T
=T/R
(250 pcs min.)
W
=
waffle tray
F
= nickel barrier
CDHV
=
A
=
M = MΩ
CDHV2512 3-sided
G
= non-magnetic
G = GΩ
A
= palladium
B
= top
20M0
= 20 MΩ
silver
only
800M
= 800 MΩ
B
= platinum gold
1G00
= 1 GΩ
C
= gold
D
= platinum
silver
E
= platinum
palladium gold
3 digit
F
=±1%
significant
G
=±2%
J
= ± 5 % figure, followed
K
= ± 10 % by a multiplier
0500
= 50:1
M
= ± 20 %
2500
= 250:1
3000
= 300:1
5000
= 500:1
Historical Part Numbering: CDHV2512AF2005J2500Ge2 (will continue to be accepted)
CDHV2512
HISTORICAL
MODEL
A
TERM
STYLE
F
TERM
MATERIAL
2005
RESISTANCE
VALUE (R
1
)
J
TOLERANCE
2500
RATIO
(R
1
+ R
2
) / R
2
G
RATIO
TOLERANCE
e2
SOLDER
TERMINATION
Note
• For additional information on packaging, refer to the “Surface Mount Resistor Packaging” document (www.vishay.com/doc?31543)
MATERIAL SPECIFICATIONS
Resistive element
Encapsulation
Substrate
Termination
Solder finish
Ruthenium oxide
Glass
96 % alumina
Solder-coated nickel barrier or solder coated non-magnetic terminations standard.
Gold, palladium silver, platinum gold, platinum silver, platinum palladium gold terminations available.
Pure tin or tin / lead solder alloys standard. Tin / silver or tin / lead / silver solder alloys available.
ENVIRONMENTAL SPECIFICATIONS
Operating temperature
Life
-55 °C to +155 °C
Less than 0.5 % change when tested at full rated power
Note
• Reference only: not for all values specified. Consult factory for your size and value
Revision: 17-Jul-2020
Document Number: 68020
2
For technical questions, contact:
te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CDHV
www.vishay.com
Vishay Techno
DIMENSIONS
in inches (millimeters)
B
B
L
A
C
T
B
W
T
B
C
A
W
Style
A
A
C
B
Style
B
A
E
A
W
Style
A Bottom
(3-sided wraparound)
TERMINATION
Style A
(3-sided wraparound)
Style B
(top only)
LENGTH (L)
± 0.006 (0.152)
0.250
WIDTH (W)
± 0.006 (0.152)
0.126
THICKNESS (T)
± 0.005 (0.127)
0.025
A ± 0.005
0.025
B ± 0.005
0.025
C ± 0.005
0.040
E ± 0.005
0.046
0.240
0.126
0.025
0.025
0.025
0.040
-
DERATING CURVE
Rated Power in %
120
100
80
60
40
20
0
-55
-25
0
25
50
75 100 125 155 175
70
Ambient Temperature in °C
Note
• Reference only: not for all values specified. Consult factory for your specific value
Revision: 17-Jul-2020
Document Number: 68020
3
For technical questions, contact:
te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CDHV
www.vishay.com
Vishay Techno
TERMINATION
STYLE
3-sided (wraparound)
Top only (flip chip)
3-sided (wraparound)
Top only (flip chip)
Top only (flip chip)
Top only (flip chip)
TERMINATION STYLE /
MATERIAL CODE
AF
BF
AG
BG
BE
BC
BA
Top only (flip chip)
BB
BD
N
SOLDER TERMINATION
CODE
E or T (standard);
F or S (optional)
(1)
E or T (standard);
F or S (optional)
(1)
N (standard);
F or S (optional)
(2)
N
TYPE
Solderable
Solderable
Epoxy bondable /
solderable
Wire bondable /
epoxy bondable
Epoxy bondable
TERMINATION
MATERIAL
Nickel barrier
Non-magnetic
Platinum palladium gold
Gold
Palladium silver
(3)
Platinum gold
Platinum silver
Notes
(1)
Standard solder plating for the nickel barrier and non-magnetic parts is solder terminations E or T. Hot solder dipped terminations F or S are
also available
(2)
Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring
solderable mounting
(3)
While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.
If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then
the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for
solderability and/or solder joint issues
SCHEMATIC
Pin 2
R
2
R
1
1
R
1
3
Pin
3
V
IN
R
2
V
OUT
2
Pin 1
2
Revision: 17-Jul-2020
Document Number: 68020
4
For technical questions, contact:
te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
© 2019 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 01-Jan-2019
1
Document Number: 91000
DSP 与 ARM 处理器
