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CH0402-383RFF

RESISTOR, THIN FILM, 0.05 W, 1 %, 100 ppm, 383 ohm, SURFACE MOUNT, 0402, CHIP, GREEN

器件类别:无源元件    电阻器   

厂商名称:Vishay(威世)

厂商官网:http://www.vishay.com

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
Objectid
1731248073
包装说明
SMT, 0402
Reach Compliance Code
compliant
Country Of Origin
France
ECCN代码
EAR99
YTEOL
8.25
构造
Chip
JESD-609代码
e2
制造商序列号
CH
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
155 °C
最低工作温度
-55 °C
封装高度
0.5 mm
封装长度
1 mm
封装形状
RECTANGULAR PACKAGE
封装形式
SMT
封装宽度
0.6 mm
包装方法
WAFFLE PACK
额定功率耗散 (P)
0.05 W
电阻
383 Ω
电阻器类型
FIXED RESISTOR
系列
CH
尺寸代码
0402
表面贴装
YES
技术
THIN FILM
温度系数
100 ppm/°C
端子面层
Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier
端子形状
ONE SURFACE
容差
1%
工作电压
37 V
文档预览
CH
www.vishay.com
Vishay Sfernice
High Frequency 50 GHz Thin Film Chip Resistor
FEATURES
• Operating frequency 50 GHz
• Thin film microwave resistors
• SMD wraparound or flip chip resistor
• Small size, down to 20 mils by 16 mils
• Edged trimmed block resistors
• Pure alumina substrate (99.5 %)
• Ohmic range: 10R to 500R
• Design kits available
• Small internal reactance (LC down to 1 × 10
-24
)
• Tolerance 1 %, 2 %, 5 %, 10 %
• TCR: 100 ppm/°C in (- 55 °C, + 155 °C) temperature range
Those miniaturized components are designed in such a way
that their internal reactance is very small. When correctly
mounted and utilized, they function as almost pure resistors
on a very large range of frequency, up to 50 GHz.
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
CH02016
CH0402
CH0603
SIZE
02016
0402
0603
RESISTANCE
RANGE
10 to 500
10 to 500
10 to 500
RATED POWER
Pn
W
0.030
0.050
0.125
LIMITING
ELEMENT
VOLTAGE
V
30
37
50
TOLERANCE
±%
1, 2, 5, 10
1, 2, 5, 10
1, 2, 5, 10
TEMPERATURE
COEFFICIENT
± ppm/°C
100
100
100
DIMENSIONS
in millimeters (inches)
A
D
D
C
D
A
(1)
D
C
D
A
D
C
E
E
B
(F)
CASE SIZE
MAX. TOL.
+ 0.1 (+ 0.004)
MIN. TOL.
- 0.1 (- 0.004)
02016
0402
0603
(P)
(N) and (G)
DIMENSIONS
A
(1)
MAX. TOL.
+ 0.1 (+ 0.004)
MIN. TOL.
- 0.1 (- 0.004)
0.48 (0.020)
1.00 (0.040)
1.52 (0.060)
B
MAX. TOL.
+ 0.1 (+ 0.004)
MIN. TOL.
- 0.1 (- 0.004)
0.39 (0.016)
0.6 (0.023)
0.75 (0.030)
C
MAX. TOL.
+ 0.127 (+ 0.005)
MIN. TOL.
- 0.127 (- 0.005)
0.42 (0.02)
(2)
0.5 (0.02)
0.5 (0.02)
MIN.
0.11 (0.004)
0.15 (0.006)
0.25 (0.010)
D/E
MAX.
0.15 (0.008)
0.35 (0.014)
0.51 (0.020)
Notes
(1)
For CH0402 and CH0603 with P termination, A dimension is increased by 0.2 mm
(2)
+ or - 0.07 mm
Revision: 31-Jan-13
Document Number: 53014
1
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CH
www.vishay.com
Vishay Sfernice
LAND PATTERN FLIP CHIP TERMINATIONS
in millimeters
G
min.
X
max.
Z
max.
CHIP SIZE
02016
0402
0603
Z
max.
0.53
1.4
1.71
X
max.
0.44
0.650
0.9
G
min.
0.15
0.4
0.760
Note
• Suggested land pattern: According to IPC-7351
Dimension and tolerance of land pattern shall be defined by PCB designer; PCB can be designed according to IPC-7351A
“Generic Requirements for Surface Mount Design and Land Pattern Standard”
Example of land pattern: Fabrication allowance, assembly location and min. or max. level density board are not included in the
exemple bellow.
According to IPC-7351A “Generic Requirements for Surface Mount Design and Land Pattern Standard”:
Z
max.
= A
min.
+ 2J
T
+
G
min.
= F
max.
+ 2J
H
-
X
max.
= B
min.
+ 2J
S
+
C
A
+
F
+
P
with C: “Unilateral profile tolerance for the component”;
C
F
+
F
+
P
F: ”Unilateral profile tolerance for the board land pattern”;
C
B
+
F
+
P
and P: “Diameter of true position placement accuracy to the center of land pattern”.
J
H
2
2
2
2
2
2
2
2
2
J
S
For rectangular component
suggest:
JT (TOE)
Flip-Chip mounting, we
0 mm
0 mm
0 mm
COMPONENT
JH (HELL)
JS (SDE)
Land Pattern Footprint
J
T
WRAPAROUND TERMINATIONS
in millimeters
G
min.
Z
max.
CHIP SIZE
0402
0603
Z
max.
1.55
2.37
G
min.
0.15
0.35
X
m
ax
.
X
max.
0.73
0.98
TOLERANCE VS. OHMIC VALUES
Ohmic range
Tolerance
10
 
R
< 50
5 %, 10 %
50

R
< 100
2 %, 5 %, 10 %
100

R
500
(1)
1 %, 2 %, 5 %, 10 %
Note
(1)
Best tolerance for 100
to 500
in 02016 is 2 %
Revision: 31-Jan-13
Document Number: 53014
2
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CH
www.vishay.com
PREFERRED MODELS AND VALUES
Vishay Sfernice highly recommend to use the smallest sizes and flip chip version to get the best performances.
Recommended Values:
10R/18R/25R/50R/75R/100R/150R/180R/200R/250R/330R/500R
Those values are available with a
MOQ of 100 pieces.
Other values can be ordered upon request, but higher MOQ will apply: 1000 pieces for CH02016, 500 pieces for
CH0402,
250 pieces for CH0603.
Recommended terminations:
F
Recommended tolerance:
2%
Design kits
are available Ex Stock in CH02016 and CH0402 sizes. There are 20 pieces per recommended value. F termination.
5 % tolerance.
Those kits are packaged in pieces of tape and delivered in ESD bags.
Vishay Sfernice
PACKAGING
Standard packaging is waffle pack for sizes 0402 and 0603. Plastic tape and reel (low conductivity) for size 02016.
Plastic tape and reel is available for 0402 and 0603 (low conductivity) or paper tape under request for all sizes.
Depending on the type of terminations, parts will be packed differently:
One face:
• Gold terminations: Active face up
• Tin/silver termination: Active face down
Note
• Please refer to Vishay Sfernice Application Note “Guidelines for Vishay Sfernice Resistive and Inductive Products” for soldering
recommendation (document number 52029, 3. Guidelines for Surface Mounting Components (SMD), profile number 3 applies
NUMBER OF PIECES PER PACKAGE
SIZE
MOQ
WAFFLE PACK
2" X 2"
484
100
100
100
5000
8 mm
TAPE AND REEL
Min.
Max.
TAPE WIDTH
02016
0402
0603
See MOQ mentioned
on preferred models
and values
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover. To get
“not stacked up” waffle pack in case of ordered quantity
> maximum number of pieces per package: Please consult
Vishay Sfernice for specific ordering code.
Tape and Reel
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered is between the MOQ and the
maximum reel capacity, only one reel is provided. When
several reels are needed for ordered quantity within MOQ
and maximum reel capacity: Please consult Vishay Sfernice
for specific ordering code.
Revision: 31-Jan-13
Document Number: 53014
3
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CH
www.vishay.com
Vishay Sfernice
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: CH0402-50RJF (preferred part number format)
C
GLOBAL MODEL
CH
H
0
SIZE
02016
0402
0603
4
0
OHMIC VALUE
10R to 500R
2
-
5
0
R
J
F
T
PACKAGING
T
= Tape and reel
PT
= Paper tape
Leave blank
for waffle pack
TOLERANCE
F
=1%
G
=2%
J
=5%
K
= 10 %
TERMINATION
(1)
F
(Flip Chip):
SnAg over nickel barrier
N
(W/A):
SnAg over nickel barrier
(except 02016)
P
(one face):
(2)
Gold bonding pads
G
(W/A): Gold
(except 02016)
Historical Part Number example: CH 0402 50R 5 % P e2 (will continue to be accepted)
CH
HISTORICAL MODEL
0402
SIZE
50R
OHMIC VALUE
5%
TOLERANCE
P
TERMINATION
e2
LEAD (Pb)-FREE
VERSION
e2:
Tin/silver
e4:
Gold
Global Part Number Ordering design kits:
CHKIT-02016
CHKIT-0402
Notes
(1)
02016 not available with N and G termination
(2)
Gold termination for application in hermetic package
TYPICAL HIGH FREQUENCY PERFORMANCE ELECTRICAL MODEL
Z
C
Z
0
L
c
L
R
L
c
C
g
Z
0
C
L
R
Z
L
c
C
g
Internal shunt capacitance
Internal inductance
Resistance
Internal impedance (R, L, C)
External connection inductance
External capacitance to ground
Revision: 31-Jan-13
Document Number: 53014
4
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CH
www.vishay.com
The complex impedance of the chip resistor is given by the following equations:
R
+
j
L
R
C
L C
-
Z
=
-------------------------------------------------------------------------------------
2
2
2
4
1
+
C
 
R
C
2L

+
L C
Z
1
-
-------
=
-----------------------------------------------------------------------------------------
x
-
2
2
2
4
R
1
+
C
 
R
C
2L

+
L C
1
 
L
2
2
2
2
Vishay Sfernice
 
L
R
C
L C
-
1
+
-----------------------------------------------------------
R
2
2
2
2
2
2
Notes
=2x
x
f
f:
Frequency
R
C
L C
-
=
tan
-----------------------------------------------------------
R
L
The chip resistor itself is purely resistive when
R
=
---
. The smaller the L x C product the greater the frequency range over
-
C
which the resistor looks approximately resistive.
Z
-
This can be seen on the graphs showing the ratio
-------
versus frequency.
R
R, L and C are relevant to the chip resistor itself.
L
c
and C
g
also depends on the way the chip resistor is mounted.
It is important to notice that after assembly the external reactance of L
c
and C
g
will be combined to internal reactance of L and
C. This combination can upgrade or downgrade the HF behaviour of the component.
This is why we are displaying two sets of data:
Z
-
-------
versus frequency curves which aims to show at a glance the intrinsic HF performance of a given chip resistor
R
• S-parameters versus frequency curves relevant to chip resistor when assembled on ideal Z0 impedance transmission line
These lines are terminated with adapted source and load impedance respectively Z
s
and Z
l
with Z
0
= Z
L
= Z
s
(for others
configurations please consult us).
Equivalent circuit for S-parameters:
Z total
C
Z
S
Z
0
C
g
L
c
L
R
L
c
C
g
Z
0
Z
L
G
S-parameters are computed taking into account all the resistive, inductive and capacitive elements (Z total) and Z
0
= Z
L
= Z
s
=
R.
Revision: 31-Jan-13
Document Number: 53014
5
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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