• Cal-Chip’s CNTC thermistor is made from metallic oxide
ceramic semi-conductor.
• The thermistor is a resistant element having higher sen-
sitivity and reliability. The resistance changes according to
temperature.
• Their leadless chip design makes them ideal for automated
mounting on printed circuit boards.
P
RODUCT
I
DENTIFICATION
CNTC S1 S
103 K 440 H 5Q
Operating
Temperature
B constant tolerance symbol
(H - ±3%)
F
EATURES
• Guaranteed up to 125°C.
• Large B constant for higher temperature measurement
capability.
• Ideal for automatic mounting in bulk or from tapes
because of front-rear symmetry.
• EIAJ standard dimensions.
• Reliability has been improved by use of internal electrodes.
B constant
R
25
tolerance symbol
J = ±5%
K = ±10%
M = ±20%
Resistance of R
25
Packaging
External dimension
(S1: 1608 Type)
Type
S
HAPES
AND
D
IMENSIONS
C
HARACTERISTICS
R25
Resistance of the thermistor at
the temperature of 25±0.2°C and
one digit characteristic section.
For example: 15 kΩ = 153.
Calculated from the resistance of
the thermistor R(T1) and R(T2)
measured at the temperature of
T
1
[K] and T
2
[K] with the following
formula; and the first three digits
out of 4 are used.
In [R (T
1
) / R (T
2
) ]
I
T
1
I
T
2
Dimensions in mm
B constant
TYPE
CNTC1608
L
1.6±0.2
W
0.8±0.2
T
0.8±0.2
e
0.35±0.25
Terminal Electrodes:
Solder Plating
B=
P
ACKAGING
Q
UANTITY
Symbol
S
R
Raraks
Bulk Products
Taped Products
Standard Qty.
2000
4000
Usually, T
1
=298.15K (25°C) and T
2
=358.15K (85°C) are applied.
98
Cal-Chip
1608 T
YPE
Electronics, Incorporated
CNTC S
ERIES
Operating Temperature: -55~125°C
Chip Type NTC Thermistors
Ordering Code
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
CNTC
S1
S1
S1
S1
S1
S1
S1
S1
S1
S1
S1
S1
S1
S1
S1
S1
S1
S1
S1
S1
S1
S1
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
470
680
101
151
221
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
▲
▲
▲
▲
▲
▲
▲
▲
▲
▲
▲
▲
▲
▲
▲
▲
▲
▲
▲
▲
▲
▲
295
295
315
315
410
410
410
410
410
410
410
410
440
440
440
460
460
460
475
475
475
475
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
5Q
R
25
[kΩ]
0.047
0.068
0.100
0.150
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
68
100
150
B constant (K:25/85°C)
2950
2950
3150
3150
4100
4100
4100
4100
4100
4100
4100
4100
4400
4400
4400
4600
4600
4600
4750
4750
4750
4750
Thermal Time Constant
Dissipation Factor
≤
5 sec
1.0~2.5
mW/°C
C
HARACTERISTICS
S
UGGESTED
C
IRCUIT
U
SE
99
Cal-Chip
I
TEM
Operating Temperature Range
Storage Temperature Range
Rated Power
Nominal Zero-Power Resistance
Electronics, Incorporated
S
PECIFIED
V
ALUE
-55°C to 125°C
-55°C to 125°C
63m W
0.047 to 150kΩ
±5%
±10%
±20%
2950 to 4750K
Within ±3%
Ambient temperature: 25±0.2°C
Measuring electric power: 0.1mW max
CNTC S
ERIES
T
EST
M
ETHODS
AND
Chip Type CNTC Thermistors
R
ELIABILITY
D
ATA
R
EMARKS
Nominal B Constant
Measure the resistance at the ambient temperatures of 25±0.2°C and 85±0.2°C
lnR25-lnR85
T : Absolute temperature
B=
1/T25-1/T85
TO : 273.15
This represents the amount of electric power required to raise the temperature of the
element by 1°C through self heating under thermal equilibrium.
This represents the amount of time for the temperature of the thermistor element to
change by 63.2% of the difference between the initial temperature and the ambient tem-
perature by the drastic change of power application into thermistor from non-zero-power to
zero-power status.
This represents the maximum ambient temperature at which rated power could be applied.
Dissipation Constant (single unit)
1.0 to 2.5mW/°C
Thermal Time Constant (single unit)
Within 5 seconds
Rated Ambient Temperature
Electric Power Derating Curve
25°C
As shown in the figure at right
This represents the relations between the ambient temperature and the maximum
permissible power.
Resistance to Flexure of Substrate
R25 change: within ±5%
B constant change: within ±2%
Warp: 2mm
Testing board: glass-epoxy-resin substrate
Board thickness: 0.8mm
Pressing speed: 0.5mm/sec.
Duration: 30 Sec.
Adhesion of Terminal Electrode
R25 change: within ±5%
B constant change: within ±2%
Applied force: 5N
Duration: 10 sec.
Solderability
At least 80% of terminal electrode is covered by new solder
According to JIS C5102 clause 8.4
Solder Temperature: 230±5°C
Duration: 4±1 sec.
Reflow soldering
Solder Temperature: 240°C
Duration: 5 sec.
Number of reflows: 3 times
Conditions for 1 cycle /
Resistance to Soldering
R25 change: within ±5%
B constant change: within ±2%
Preheating Temperature: 150°C
Preheating Time: 90 sec.
Thermal Shock
R25 change: within ±5%
B constant change: within ±3%
Step 1: -55±2°C
Step 2: Room temp.
Step 3: +125±2°C
Step 4: Room Temp.
30 min.
15 min.
30 min.
15 min.
Number of cycles: 100
Recovery: 2 hrs of recovery under the standard condition after the test
High Temperature Life Test
R25 change: within ±5%
B constant change: within ±3%
Temperature: 125±2°C
Duration: 1000 ±12 hrs
Recovery: 2 hrs of recovery under the standard condition after the removal from the
test chamber
Temperature: 85±2°C
Humidity: 90 to 95%RH
Duration: 1000 ±12 hrs
Recovery: 2 hrs of recovery under the standard condition after the removal from the
test chamber
Damp Heat (steady state)
R25 change: within ±5%
B constant change: within ±3%
Note on standard condition:
“standard condition” referred to herein is defined as follows: 5 to 35°C of temperature, 45 to 85% relative humidity and 86 to 106kPa of air
pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20±2°C of temper-
ature, 65 to 70% relative humidity and 86 to 106kPa of air pressure.
100
Unless otherwise specified, all the tests are conducted under the “standard condition”.
