CRCW01005 e3
www.vishay.com
Vishay
Standard Thick Film Chip Resistors
FEATURES
• Very small standard size (0.4 mm x 0.2 mm)
• Low tolerance (1 %)
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
CASE
SIZE
IMPERIAL
CASE
SIZE
METRIC
POWER RATING
P
70
W
LIMITING
ELEMENT
VOLTAGE
U
max.
AC
RMS
/DC
V
TEMPERATURE
RESISTANCE
TOLERANCE
COEFFICIENT
RANGE
%
ppm/K
TYPE
SERIES
±1
± 250
± 2, ± 5
0.031
CRCW01005
01005
RR0402M
-200/+600
± 2, ± 5
Zero-Ohm-Resistor:
R
max.
= 50 m,
I
max.
= 0.5 A
1.0 to 9.1
15
±1
1.0 to 9.76
10.0 to 1M
E24; E96
E24
E24; E96
E24
Notes
• These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
TECHNICAL SPECIFICATIONS
PARAMETER
Rated Dissipation
P
70 (1)
Operating Voltage
U
max.
AC
RMS
/DC
Insulation Voltage
U
ins
(1 min)
Insulation Resistance
Operating Temperature Range
Mass
UNIT
W
V
V
°C
mg
CRCW01005
0.031
15
30
> 10
9
-55 to +125
0.07
Note
(1)
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 125 °C is not exceeded.
Revision: 06-Nov-13
Document Number: 20056
1
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CRCW01005 e3
www.vishay.com
Vishay
PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: CRCW01001K00FREL
C
R
C
W
0
1
0
0
1
K
0
0
F
R
E
L
TYPE
CRCW0100
VALUE
R
= Decimal
K
= Thousand
M
= Million
0000
= Jumper
TOLERANCE
F
= ± 1.0 %
G
= ± 2.0 %
J
= ± 5.0 %
Z
= Jumper
TCR
R
= ± 250 ppm/K
Y
= -200 ppm/K/+600 ppm/K
0
= Jumper
PACKAGING
EL
PRODUCT DESCRIPTION: CRCW01005 250 1K0 1 % ET3 e3
CRCW01005
TYPE
CRCW01005
250
TCR
± 250
ppm/K
-200/+600
ppm/K
1K0
RESISTANCE
VALUE
1R0
= 1
10R
= 10
1K0
= 1 k
10K
= 10 k
1M0
= 1 M
0R0
= Jumper
1%
TOLERANCE
VALUE
±1%
±2%
±5%
ET3
PACKAGING
ET3
e3
LEAD (Pb)-FREE
e3
= Pure tin
termination finish
PACKAGING
TYPE
CRCW01005
CODE
EL = ET3
QUANTITY
20 000
CARRIER TAPE
Paper tape acc. to IEC 60286-3, Type 1a
WIDTH
8 mm
PITCH
2 mm
REEL DIAMETER
180 mm/7"
DIMENSIONS
in millimeters
SIZE
IMPERIAL
01005
METRIC
RR0402M
L
0.4 ± 0.02
W
0.2 ± 0.02
DIMENSIONS
H
0.13 ± 0.02
T1
0.10 ± 0.03
T2
0.10 ± 0.03
RECOMMENDED SOLDER PAD
DIMENSIONS
a
0.15
b
0.2
l
0.2
Note
• No marking for 01005 size.
DERATING
Fraction of Rated Dissipation
P
70
in %
100
50
0
- 50
0
50
100
125
150
70
Ambient Temperature
ϑ
amb
in °C
Revision: 06-Nov-13
Document Number: 20056
2
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CRCW01005 e3
www.vishay.com
Vishay
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 1 OR BETTER
Stability for product types:
CRCW01005 e3
1
to 1 M
± 1 %; ± 2 %; ± 5 %
± (2 %
R
+ 0.1
)
Resistance
-
U
= 2.5 x
P
70
x
R
2 x
U
max.
;
duration according to style
Solder bath method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(235 ± 3) °C
(2 ± 0.5) s
(20/-55/20) °C and
(20/125/20) °C
Depth 3 mm; 1 time
15 min. at -55 °C;
15 min. at 125 °C;
300 cycles
U
=
P
70
x
R
U
max.
;
1.5 h on; 0.5 h off;
70 °C; 1000 h
Solder bath method
(260 ± 5) °C; (10 ± 1) s
(40 ± 2) °C; (90 to 95) % RH;
1000 h
125 °C, 1000 h
Isopropyl alcohol;
(20 to 25) °C; (5 ± 0.5) min
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
-
-
PROCEDURE
TEST
4.5
4.13
Short time overload
Good tinning ( 95 % covered)
no visible damage
4.17.2
58 (Td)
Solderability
Good tinning ( 95 % covered)
no visible damage
- 200 ppm/K/+600 ppm/K,
± 250 ppm/K
No visible damage,
no open circuit in bent position
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
4.8.4.2
4.33
-
21 (Uu
1
)
Temperature coefficient
Substrate bending
Rapid change
of temperature
4.19
14 (Na)
4.25.1
-
Endurance at 70 °C
Resistance to
soldering heat
Damp heat, steady state
Endurance at upper
category temperature
Component
solvent resistance
± (5 %
R
+ 0.1
)
± (2 %
R
+ 0.1
)
± (5 %
R
+ 0.1
)
± (2 %
R
+ 0.1
)
No visible damage
4.18.2
4.24
4.25.3
4.29
58 (Td)
78 (Cab)
-
45 (XA)
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2-x, environmental test procedures
Packaging of components is done in paper tapes according to IEC 60286-3.
Revision: 06-Nov-13
Document Number: 20056
3
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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Revision: 08-Feb-17
1
Document Number: 91000
