型号
- 型号
- 关键词
OTP ROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, CERDIP-32
厂商官网：https://www.rocelec.com/
下载文档| 型号 | CY27C010-200DMB | CY27C010-90LMB | CY27C010-120DMB | CY27C010-150DMB | CY27C010-200LMB |
|---|---|---|---|---|---|
| 描述 | OTP ROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, CERDIP-32 | OTP ROM, 128KX8, 90ns, CMOS, CQCC32, HERMETIC SEALED, LCC-32 | OTP ROM, 128KX8, 120ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, CERDIP-32 | OTP ROM, 128KX8, 150ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, CERDIP-32 | OTP ROM, 128KX8, 200ns, CMOS, CQCC32, HERMETIC SEALED, LCC-32 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 包装说明 | DIP, | QCCN, | DIP, | DIP, | QCCN, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 200 ns | 90 ns | 120 ns | 150 ns | 200 ns |
| JESD-30 代码 | R-GDIP-T32 | R-CQCC-N32 | R-GDIP-T32 | R-GDIP-T32 | R-CQCC-N32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | QCCN | DIP | DIP | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD |
