型号
- 型号
- 关键词
| 型号 | CY7C1019B-12ZCT | CY7C1019B-15VIT | CY7C1019B-12VCT | CY7C1019B-15ZCT | CY7C1019B-15VCT | ||
|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, TSOP2-32 | Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.400 INCH, SOJ-32 | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, SOJ-32 | Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, TSOP2-32 | Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.400 INCH, SOJ-32 | ||
| 是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 | ||
| 厂商名称 | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | ||
| 零件包装代码 | TSOP2 | SOJ | SOJ | TSOP2 | SOJ | ||
| 包装说明 | TSOP2, | SOJ, | SOJ, | TSOP2, | SOJ, | ||
| 针数 | 32 | 32 | 32 | 32 | 32 | ||
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | ||
| ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | ||
| 最长访问时间 | 12 ns | 15 ns | 12 ns | 15 ns | 15 ns | ||
| JESD-30 代码 | R-PDSO-G32 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-G32 | R-PDSO-J32 | ||
| JESD-609代码 | e0 | e0 | e0 | - | e0 | ||
| 长度 | 20.95 mm | 20.955 mm | 20.955 mm | 20.95 mm | 20.955 mm | ||
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | ||
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | ||
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | ||
| 湿度敏感等级 | 3 | - | 2 | - | 2 | ||
| 功能数量 | 1 | 1 | 1 | 1 | 1 | ||
| 端子数量 | 32 | 32 | 32 | 32 | 32 | ||
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | ||
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | ||
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ||
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | ||
| 组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | ||
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | ||
| 封装代码 | TSOP2 | SOJ | SOJ | TSOP2 | SOJ | ||
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | ||
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | ||
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | ||
| 峰值回流温度（摄氏度） | 235 | - | 225 | - | 225 | ||
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | ||
| 座面最大高度 | 1.2 mm | 3.7592 mm | 3.7592 mm | 1.2 mm | 3.7592 mm | ||
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | ||
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | ||
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | ||
| 表面贴装 | YES | YES | YES | YES | YES | ||
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | ||
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | ||
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | - | TIN LEAD | ||
| 端子形式 | GULL WING | J BEND | J BEND | GULL WING | J BEND | ||
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | ||
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | ||
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | 30 | - | 30 | ||
| 宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |