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CY7C1020CV33-10ZIT

Standard SRAM, 32KX16, 10ns, CMOS, PDSO44, TSOP2-44

器件类别:存储    存储   

厂商名称:Cypress(赛普拉斯)

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器件参数
参数名称
属性值
厂商名称
Cypress(赛普拉斯)
零件包装代码
TSOP2
包装说明
TSOP2,
针数
44
Reach Compliance Code
unknown
ECCN代码
3A991.B.2.B
最长访问时间
10 ns
JESD-30 代码
R-PDSO-G44
长度
18.415 mm
内存密度
524288 bit
内存集成电路类型
STANDARD SRAM
内存宽度
16
功能数量
1
端子数量
44
字数
32768 words
字数代码
32000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
32KX16
封装主体材料
PLASTIC/EPOXY
封装代码
TSOP2
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE
并行/串行
PARALLEL
认证状态
Not Qualified
座面最大高度
1.194 mm
最大供电电压 (Vsup)
3.63 V
最小供电电压 (Vsup)
2.97 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
GULL WING
端子节距
0.8 mm
端子位置
DUAL
宽度
10.16 mm
Base Number Matches
1
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CY7C1020CV33
512K (32K x 16) Static RAM
Features
• Pin- and function-compatible with CY7C1020V33
• Temperature Ranges
— Commercial: 0°C to 70°C
— Industrial: –40°C to 85°C
— Automotive: –40°C to 125°C
• High speed
— t
AA
= 10, 12, 15 ns
• CMOS for optimum speed/power
• Low active power
— 360 mW (max.)
• Automatic power-down when deselected
• Independent control of upper and lower bits
• Available in 44-pin TSOP II
Functional Description
The CY7C1020CV33 is a high-performance CMOS static
RAM organized as 32,768 words by 16 bits. This device has
an automatic power-down feature that significantly reduces
power consumption when deselected.
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O
1
through I/O
8
), is
written into the location specified on the address pins (A
0
through A
14
). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O
9
through I/O
16
) is written into the location
specified on the address pins (A
0
through A
14
).
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O
1
to I/O
8
. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O
9
to I/O
16
. See
the truth table at the back of this data sheet for a complete
description of read and write modes.
The input/output pins (I/O
1
through I/O
16
) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
The CY7C1020CV33 is available in standard 44-pin TSOP
Type II package.
Logic Block Diagram
DATA IN DRIVERS
Pin Configuration
TSOP II
Top View
NC
A
3
A
2
A
1
A
0
CE
I/O
1
I/O
2
I/O
3
I/O
4
V
CC
V
SS
I/O
5
I/O
6
I/O
7
I/O
8
WE
A
4
A
14
A
13
A
12
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
32K × 16
RAM Array
I/O
1
–I/O
8
I/O
9
–I/O
16
COLUMN DECODER
BHE
WE
CE
OE
BLE
A
5
A
6
A
7
OE
BHE
BLE
I/O
16
I/O
15
I/O
14
I/O
13
V
SS
V
CC
I/O
12
I/O
11
I/O
10
I/O
9
NC
A
8
A
9
A
10
A
11
NC
ROW DECODER
A
8
A
9
A
10
A
11
A
12
A
13
A
14
SENSE AMPS
Cypress Semiconductor Corporation
Document #: 38-05133 Rev. *D
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised March 7, 2005
CY7C1020CV33
Selection Guide
1020CV33-10
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Com’l / Ind’l
Automotive
Com’l / Ind’l
Automotive
10
90
-
5
-
1020CV33-12
12
85
-
5
-
1020CV33-15
15
80
85
5
10
Unit
ns
mA
mA
mA
mA
Pin Definitions
Pin Name
A
0
–A
14
I/O
1
–I/O
16
NC
WE
CE
BHE, BLE
OE
TSOP - Pin Number
5,4,3,2,18,44,43,42,27,26,
25,24,21,20,19
7-10,13-16,29-32,35-38
1,22,23,28
17
6
40,39
41
I/O Type
Input
Description
Address Inputs used to select one of the address locations.
Input/Output
Bidirectional Data I/O lines.
Used as input or output lines
depending on operation.
No Connect
No Connects.
Not connected to the die.
Input/Control
Write Enable Input, active LOW.
When selected LOW, a Write is
conducted. When deselected HIGH, a Read is conducted.
Input/Control
Chip Enable Input, active LOW.
When LOW, selects the chip.
When HIGH, deselects the chip.
Input/Control
Byte Write Select Inputs, active LOW.
BLE controls I/O
8
–I/O
1
,
BHE controls I/O
16
–I/O
9
.
Input/Control
Output Enable, active LOW.
Controls the direction of the I/O pins.
When LOW, the I/O pins are allowed to behave as outputs. When
deasserted HIGH, I/O pins are three-stated, and act as input data
pins.
Ground
Ground for the device.
Should be connected to ground of the
system.
V
SS
V
CC
12,34
11,33
Power Supply
Power Supply inputs to the device.
Document #: 38-05133 Rev. *D
Page 2 of 9
CY7C1020CV33
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Supply Voltage on V
CC
to Relative GND
[1]
.... –0.5V to +4.6V
DC Voltage Applied to Outputs
in High-Z State
[1]
....................................–0.5V to V
CC
+ 0.5V
DC Input Voltage
[1]
.................................–0.5V to V
CC
+ 0.5V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage........................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current..................................................... > 200 mA
Operating Range
Range
Commercial
Industrial
Automotive
Ambient Temperature
0°C to +70°C
–40°C to +85°C
–40°C to +125°C
V
CC
3.3V
±
10%
3.3V
±
10%
3.3V
±
10%
Electrical Characteristics
Over the Operating Range
1020CV33-10 1020CV33-12 1020CV33-15
Parameter
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
OS[2]
I
CC
Description
Test Conditions
Min.
2.4
0.4
2.0
−0.3
GND < V
I
< V
CC
GND < V
I
< V
CC
,
Output Disabled
Com’l / Ind’l
Automotive
Output Leakage
Current
Output Short
Circuit Current
V
CC
Operating
Supply Current
Com’l / Ind’l
Automotive
−1
-
−1
-
V
CC
+
0.3
0.8
+1
-
+1
-
−300
90
-
15
-
5
-
2.0
–0.3
–1
-
–1
-
Max.
Min.
2.4
0.4
V
CC
+
0.3
0.8
+1
-
+1
-
–300
85
-
15
-
5
-
2.0
–0.3
–1
–20
–1
–20
Max.
Min.
2.4
0.4
V
CC
+
0.3
0.8
+1
+20
+1
+20
–300
80
85
15
20
5
10
Max.
Unit
V
V
V
V
µA
µA
µA
µA
mA
mA
mA
mA
mA
mA
mA
Output HIGH Voltage V
CC
= Min., I
OH
= –4.0 mA
Output LOW Voltage V
CC
= Min., I
OL
= 8.0 mA
Input HIGH Voltage
Input LOW Voltage
[1]
Input Load Current
V
CC
= Max., V
OUT
= GND
V
CC
= Max.,
I
OUT
= 0 mA,
f = f
MAX
= 1/t
RC
Com’l / Ind’l
Automotive
Com’l / Ind’l
Automotive
Com’l / Ind’l
Automotive
I
SB1
Automatic CE
Max. V
CC
, CE > V
IH
Power-down Current V
IN
> V
IH
or V
IN
< V
IL
,
f = f
MAX
—TTL Inputs
Max. V
CC
,
Automatic CE
Power-down Current CE > V
CC
– 0.3V,
—CMOS Inputs
V
IN
> V
CC
– 0.3V,
or V
IN
< 0.3V, f = 0
I
SB2
Capacitance
[3]
Parameter
C
IN
C
OUT
Description
Input Capacitance
Output Capacitance
Test Conditions
T
A
= 25°C, f = 1 MHz,
V
CC
= 3.3V
Max.
8
8
Unit
pF
pF
Thermal Resistance
[3]
Parameter
Description
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Test Conditions
Test conditions follow standard test
methods and procedures for measuring
thermal impedance, per EIA / JESD51.
44-pin TSOP-II
76.92
15.86
Unit
°C/W
°C/W
Θ
JA
Θ
JC
Notes:
1. V
IL
(min.) = –2.0V and V
IH
(max) = V
CC
+ 0.5V for pulse durations of less than 20 ns.
2. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
3. Tested initially and after any design or process changes that may affect these parameters.
Document #: 38-05133 Rev. *D
Page 3 of 9
CY7C1020CV33
AC Test Loads and Waveforms
[4]
R 317Ω
3.3V
OUTPUT
30 pF
R2
351Ω
High-Z characteristics:
3.3V
OUTPUT
5 pF
ALL INPUT PULSES
90%
GND
10%
90%
10%
R2
351Ω
R 317Ω
(a)
3.0V
(c)
Rise Time: 1 V/ns
(b)
Fall Time: 1 V/ns
Switching Characteristics
Over the Operating Range
[4]
1020CV33-10
Parameter
Read Cycle
t
RC
t
AA
t
OHA
t
ACE
t
DOE
t
LZOE
t
HZOE
t
LZCE
t
HZCE
t
PU[7]
t
PD[7]
t
DBE
t
LZBE
t
HZBE
Write Cycle
[8]
t
WC
t
SCE
t
AW
t
HA
t
SA
t
PWE
t
SD
t
HD
t
LZWE
t
HZWE
t
BW
Write Cycle Time
CE LOW to Write End
Address Set-up to Write End
Address Hold from Write End
Address Set-up to Write Start
WE Pulse Width
Data Set-up to Write End
Data Hold from Write End
WE HIGH to Low-Z
[5]
WE LOW to High-Z
[5, 6]
Byte Enable to End of Write
7
10
8
7
0
0
7
5
0
3
5
8
12
9
8
0
0
8
6
0
3
6
9
15
10
10
0
0
10
8
0
3
7
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Read Cycle Time
Address to Data Valid
Data Hold from Address Change
CE LOW to Data Valid
OE LOW to Data Valid
OE LOW to
OE HIGH to
CE LOW to
CE HIGH to
Low-Z
[5]
High-Z
[5, 6]
Low-Z
[5]
High-Z
[5, 6]
0
10
5
0
5
0
6
3
5
0
12
6
0
7
0
5
3
6
0
15
7
3
10
5
0
6
3
7
10
10
3
12
6
0
7
12
12
3
15
7
15
15
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Description
Min.
Max.
1020CV33-12
Min.
Max.
1020CV33-15
Min.
Max.
Unit
CE LOW to Power-up
CE HIGH to Power-down
Byte Enable to Data Valid
Byte Enable to Low-Z
Byte Disable to High-Z
Notes:
4. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V.
5. At any given temperature and voltage condition, t
HZCE
is less than t
LZCE
, t
HZOE
is less than t
LZOE
, and t
HZWE
is less than t
LZWE
for any given device.
6. t
HZOE
, t
HZBE
, t
HZCE
, and t
HZWE
are specified with a load capacitance of 5 pF as in part (c) of AC Test Loads. Transition is measured
±
500 mV from steady-state voltage.
7. This parameter is guaranteed by design and is not tested.
8. The internal Write time of the memory is defined by the overlap of CE LOW, WE LOW and BHE / BLE LOW. CE, WE and BHE / BLE must be LOW to initiate a Write,
and the transition of these signals can terminate the Write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the Write.
Document #: 38-05133 Rev. *D
Page 4 of 9
CY7C1020CV33
Switching Waveforms
Read Cycle No. 1
[9, 10]
t
RC
ADDRESS
t
AA
t
OHA
DATA OUT
PREVIOUS DATA VALID
DATA VALID
Read Cycle No. 2 (OE Controlled)
[10, 11]
ADDRESS
t
RC
CE
t
ACE
OE
BHE, BLE
t
DOE
t
LZOE
t
DBE
t
LZBE
HIGH IMPEDANCE
t
LZCE
V
CC
SUPPLY
CURRENT
t
PU
50%
t
HZCE
t
HZBE
DATA VALID
t
PD
50%
IISB
SB
IICC
CC
t
HZOE
HIGH
IMPEDANCE
DATA OUT
Notes:
9. Device is continuously selected. OE, CE, BHE and/or BHE = V
IL
.
10. WE is HIGH for Read cycle.
11. Address valid prior to or coincident with CE transition LOW.
Document #: 38-05133 Rev. *D
Page 5 of 9
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参数对比
与CY7C1020CV33-10ZIT相近的元器件有:CY7C1020CV33-12ZIT、CY7C1020CV33-15ZCT、CY7C1020CV33-10ZCT、CY7C1020CV33-15ZXC、CY7C1020CV33-15ZXCT、CY7C1020CV33-15ZXIT、CY7C1020CV33-15ZXI、CY7C1020CV33-15ZSE、CY7C1020CV33-12ZCT。描述及对比如下:
型号 CY7C1020CV33-10ZIT CY7C1020CV33-12ZIT CY7C1020CV33-15ZCT CY7C1020CV33-10ZCT CY7C1020CV33-15ZXC CY7C1020CV33-15ZXCT CY7C1020CV33-15ZXIT CY7C1020CV33-15ZXI CY7C1020CV33-15ZSE CY7C1020CV33-12ZCT
描述 Standard SRAM, 32KX16, 10ns, CMOS, PDSO44, TSOP2-44 Standard SRAM, 32KX16, 12ns, CMOS, PDSO44, TSOP2-44 Standard SRAM, 32KX16, 15ns, CMOS, PDSO44, TSOP2-44 Standard SRAM, 32KX16, 10ns, CMOS, PDSO44, TSOP2-44 Standard SRAM, 32KX16, 15ns, CMOS, PDSO44, LEAD FREE, TSOP2-44 Standard SRAM, 32KX16, 15ns, CMOS, PDSO44, LEAD FREE, TSOP2-44 Standard SRAM, 32KX16, 15ns, CMOS, PDSO44, LEAD FREE, TSOP2-44 Standard SRAM, 32KX16, 15ns, CMOS, PDSO44, LEAD FREE, TSOP2-44 Standard SRAM, 32KX16, 15ns, CMOS, PDSO44, TSOP2-44 Standard SRAM, 32KX16, 12ns, CMOS, PDSO44, TSOP2-44
零件包装代码 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2
包装说明 TSOP2, TSOP2, TSOP2, TSOP2, LEAD FREE, TSOP2-44 TSOP2, TSOP2, LEAD FREE, TSOP2-44 TSOP2-44 TSOP2,
针数 44 44 44 44 44 44 44 44 44 44
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown compliant unknown
ECCN代码 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
最长访问时间 10 ns 12 ns 15 ns 10 ns 15 ns 15 ns 15 ns 15 ns 15 ns 12 ns
JESD-30 代码 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44
长度 18.415 mm 18.415 mm 18.415 mm 18.415 mm 18.415 mm 18.415 mm 18.415 mm 18.415 mm 18.415 mm 18.415 mm
内存密度 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit
内存集成电路类型 STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
内存宽度 16 16 16 16 16 16 16 16 16 16
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 44 44 44 44 44 44 44 44 44 44
字数 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
字数代码 32000 32000 32000 32000 32000 32000 32000 32000 32000 32000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 70 °C 70 °C 70 °C 70 °C 85 °C 85 °C 125 °C 70 °C
组织 32KX16 32KX16 32KX16 32KX16 32KX16 32KX16 32KX16 32KX16 32KX16 32KX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.194 mm 1.194 mm 1.194 mm 1.194 mm 1.194 mm 1.194 mm 1.194 mm 1.194 mm 1.194 mm 1.194 mm
最大供电电压 (Vsup) 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V
最小供电电压 (Vsup) 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL AUTOMOTIVE COMMERCIAL
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
宽度 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm
厂商名称 Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) - Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯)
JESD-609代码 - - e0 e0 e4 e3/e4 e3/e4 e4 e0 e0
端子面层 - - TIN LEAD TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au) MATTE TIN/NICKEL PALLADIUM GOLD MATTE TIN/NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb) TIN LEAD
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E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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