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DSC63XXB

Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum

Features

• Output Frequency: 1 MHz to 100 MHz LVCMOS

• Spread Spectrum Options:

- Center-Spread: ±0.25%, ±0.5%, ±1.0%,

±1.5%, ±2.0%, ±2.5%

- Down-Spread: –0.25%, –0.5%, –1.0%,

–1.5%, –2.0%, –3.0%

• Ultra-Low Power Consumption: 3 mA (Active),



A (Standby)

• Wide Supply Voltage Range: 1.71V ~ 3.63V V

• Ultra-Small Package Sizes:

- 1.6 mm



1.2 mm

- 2.0 mm



1.6 mm

- 2.5 mm



2.0 mm

• Wide Temperature Range:

- Automotive: –40°C to +125°C

- Ext. Industrial: –40°C to +105°C

- Industrial: –40°C to +85°C

- Ext. Commercial: –20°C to +70°C

• Excellent Shock and Vibration Immunity

- Qualified to MIL-STD-883

• High Reliability

- 20x Better MTBF than Quartz Oscillators

• Lead Free and RoHS Compliant

• Automotive AEC-Q100 Option Available

General Description

The DSC63xxB family of devices is the industry’s

smallest and lowest-power spread-spectrum MEMS

oscillators. Available in three different package sizes

with operating current as low as 3 mA, the smallest

4-pin package is a mere 1.6 mm x 1.2 mm in size. The

devices support up to ±2.5% or –3% spread spectrum

that can achieve up to 15 dB electromagnetic

interference (EMI) reduction. Because of industry

standard package and pin options, customers can

solve last minute EMI problems simply by placing the

new DSC63xxB on their current board layout with no

redesign required.

The DSC63xxB family is available in 1.6 mm x 1.2 mm

and 2.0 mm x 1.6 mm, and 2.5 mm x 2.0 mm

packages. These packages are “drop-in” replacements

for standard 4-pin CMOS quartz crystal oscillators.

Package Types

DSC63

2.5 mm x 2.0 mm VLGA

2.0 mm x 1.6 mm VFLGA

1.6 mm x 1.2 mm VFLGA

(Top View)

OE/STDBY/SSEN

VDD

Applications

•

Flat Panel Display/Monitor

Multi-Function Printer

Digital Signage

Consumer Electronics

GND

OUT



2019 Microchip Technology Inc.

DS20006154A-page 1

DSC63XXB

Block Diagram

DSC63

DIGITAL

CONTROL

OE/STDBY/SSEN

PIN 1

SST

MEMS

RESONATOR

TEMP SENSOR

CONTROL &

COMPENSATION

PLL

VCO

SUPPLY

REGULATION

VDD

PIN 4

OUTPUT

DIVIDER

DRIVER

OUTPUT

PIN 3

GND

PIN 2

DS20006154A-page 2



2019 Microchip Technology Inc.

DSC63XXB

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

Supply Voltage .......................................................................................................................................... –0.3V to +4.0V

Input Voltage (V

) ..............................................................................................................................–0.3V to V

+0.3V

ESD Protection ............................................................................................................ 4 kV HBM, 400V MM, 2 kV CDM

ELECTRICAL CHARACTERISTICS

Electrical Characteristics:

Unless otherwise indicated, V

= 1.8V –5% to 3.3V +10%, T

= –40°C to +125°C.

Parameters

Supply Voltage

Power Supply Ramp

Active Supply Current

Standby Supply Current

Output Duty Cycle

Frequency

Frequency Stability

Sym.

STBY

SYM

∆f

Min.

1.71

0.1

—

0.7 x V

—

Typ.

—

3.0

1.5

—

300

Max.

3.63

100

—

100

±20

±25

±50

±5

±1

1.5

—

0.3 x V

200 +

2 Periods

—

Units

µA

MHz

ppm

Note 1

Note 8

OUT

= 27 MHz, V

= 1.8V, No

Load

= 1.8/2.5V,

Note 2

= 3.3V,

Note 2

—

All temp ranges,

Note 3

1st year @ 25°C

Per year after first year

From 90% V

to valid clock

output, T = 25°C

Input Logic High,

Note 4

Input Logic Low,

Note 4

Note 5

Note 6

If configured,

Note 7

Conditions

Aging

Startup Time

Input Logic Levels

Output Disable Time

Output Enable Time

OE/STDBY/SSEN Pull-up

Resistor

Note 1:

∆f

—

ppm

µs

kΩ

Pin 4 V

should be filtered with 0.1 µF capacitor.

Not including current through pull-up resistor on EN pin (if configured).

Includes frequency variations due to initial tolerance, temp. and power supply voltage.

Input waveform must be monotonic with rise/fall time < 10 ms

Output Disable time takes up to two periods of the output waveform + 200 ns.

For parts configured with OE, not Standby.

Output is enabled if pad is floated or not connected.

Time to reach 90% of target V

. Power ramp rise must be monotonic.



2019 Microchip Technology Inc.

DS20006154A-page 3

DSC63XXB

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics:

Unless otherwise indicated, V

= 1.8V –5% to 3.3V +10%, T

= –40°C to +125°C.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Output Logic High, I = 3 mA,

Std. Drive

Output Logic High, I = 6 mA,

High Drive

Output Logic Low, I = –3 mA,

Std. Drive

Output Logic Low, I = –6 mA,

High Drive

DSC61x2

= 1.8V

High Drive,

20% to 80%

= 15 pF V

= 2.5V/3.3V

DSC61x1

= 1.8V

Std Drive,

20% to 80%

= 10 pF V

= 2.5V/3.3V

= 1.8V

= 2.5V/3.3V

= 1.8V

= 2.5V/3.3V

= 1.8V

= 2.5V/3.3V

Output Logic Levels

0.8 x V

—

0.2 x V

—

Output Transition Time

Rise Time/Fall Time

—

Period Jitter, RMS

Cycle-to-Cycle Jitter

(Peak)

Period Jitter

(Peak-to-Peak)

Spread Spectrum

Modulation Frequency

Note 1:

PER

—

Cy–Cy

—

0.5

1.2

0.6

8.5

1.5

1.0

2.0

1.2

—

OUT

RMS

27 MHz,

Spread Off

OUT

27 MHz,

Spread Off

OUT

27 MHz,

Spread Off

—

kHz

Pin 4 V

should be filtered with 0.1 µF capacitor.

Not including current through pull-up resistor on EN pin (if configured).

Includes frequency variations due to initial tolerance, temp. and power supply voltage.

Input waveform must be monotonic with rise/fall time < 10 ms

Output Disable time takes up to two periods of the output waveform + 200 ns.

For parts configured with OE, not Standby.

Output is enabled if pad is floated or not connected.

Time to reach 90% of target V

. Power ramp rise must be monotonic.

DS20006154A-page 4



2019 Microchip Technology Inc.

DSC63XXB

SPREAD SPECTRUM

Ordering Code

Spread Percentage

±0.25%

±0.5%

±1.0%

±1.5%

±2.0%

±2.5%

–0.25%

–0.5%

–1.0%

–1.5%

–2.0%

–3.0%

Custom

Spread Type

Center-Spread

Down-Spread

Center-Spread or Down-Spread

TEMPERATURE SPECIFICATIONS (Note

Parameters

Temperature Ranges

Junction Operating Temperature

Storage Ambient Temperature Range

Soldering Temperature

Note 1:

–40

–55

—

+260

+150

—

°C

—

40 sec. max.

Sym.

Min.

Typ.

Max.

Units

Conditions

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., T

, T

). Exceeding the max-

imum allowable power dissipation will cause the device operating junction temperature to exceed the max-

imum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.



2019 Microchip Technology Inc.

DS20006154A-page 5