EMDS13N2H-87.500M TR
Series
RoHS Compliant (Pb-free) 3.3V 6 Pad 5mm x 7mm
Plastic SMD LVDS MEMS Oscillator
Frequency Tolerance/Stability
±25ppm Maximum over -20°C to +70°C
Duty Cycle
50 ±5(%)
RoHS
Pb
Packaging Options
Tape & Reel
EMDS13 N 2 H -87.500M TR
Nominal Frequency
87.500MHz
Logic Control / Additional Output
Output Enable (OE) and Complementary Output
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
87.500MHz
±25ppm Maximum over -20°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C,
Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,
1st Year Aging at 25°C, Reflow, Shock, and Vibration)
±1ppm First Year Maximum
+3.3Vdc ±0.3Vdc
80mA Maximum (Excluding Load Termination Current)
1.425Vdc Typical
1.075Vdc Typical
247mVdc Minimum, 350mVdc Typical, 454mVdc Maximum
1.125V Minimum, 1.250V Typical, 1.375V Maximum
225pSec Typical, 325pSec Maximum (Measured over 20% to 80% of waveform)
50mVdc Maximum
50 ±5(%) (Measured at 50% of waveform)
50mVdc Maximum
100 Ohms Between Output and Complementary Output
LVDS
Output Enable (OE) and Complementary Output
Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc
Maximum to Disable Output and Complementary Output (High Impedance)
75mA Maximum (OE) Without Load
0.2pSec Typical
2.0pSec Typical
1.8pSec Typical, 2.5pSec Maximum
25pSec Typical, 30pSec Maximum
2.1pSec Typical
1.7pSec Typical
1.5pSec Typical
10mSec Maximum
-55°C to +125°C
Aging at 25°C
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Differential Output Voltage (Vod)
Offset Voltage (Vos)
Rise/Fall Time
Differential Output Error (dVod)
Duty Cycle
Offset Error (dVos)
Load Drive Capability
Output Logic Type
Logic Control / Additional Output
Output Control Input Voltage
Output Enable Current
Period Jitter (Deterministic)
Period Jitter (Random)
Period Jitter (RMS)
Period Jitter (pk-pk)
RMS Phase Jitter (Fj = 637kHz to
10MHz; Random)
RMS Phase Jitter (Fj = 1MHz to
20MHz; Random)
RMS Phase Jitter (Fj = 1.875MHz to
20MHz; Random)
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Flammability
Mechanical Shock
Moisture Resistance
Moisture Sensitivity Level
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
MIL-STD-883, Method 3015, Class 2, HBM 2000V
UL94-V0
MIL-STD-883, Method 2002, Condition G, 30,000G
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003 (Six I/O Pads on bottom of package only)
MIL-STD-883, Method 1010, Condition B
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 1 of 6
EMDS13N2H-87.500M TR
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Thermal Shock
Vibration
MIL-STD-883, Method 1011, Condition B
MIL-STD-883, Method 2007, Condition A, 20G
MECHANICAL DIMENSIONS (all dimensions in millimeters)
5.00
±0.15
0.85
±0.15
0.08
MAX
3
7.00
±0.15
5.08
±0.10
4
PIN
CONNECTION
Output Enable (OE)
No Connect
Case Ground
Output
Complementary Output
Supply Voltage
1.20 ±0.10 (x4)
1.47
1
2
3
4
5
6
2
A
5
2.30
LINE MARKING
1
1
2.54 TYP
2.60
±0.15
6
1.40
±0.10 (x4)
XXXX or XXXXX
XXXX or XXXXX=Ecliptek
Manufacturing Lot Code
Note A: Center paddle is connected
internally to oscillator ground (Pad 3).
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.80 (X6)
2.00 (X6)
0.54 (X4)
2.39 (X3)
All Tolerances are ±0.1
Solder Land
(X6)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 2 of 6
EMDS13N2H-87.500M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
TRI-STATE INPUT
V
IH
V
IL
Q & Q OUTPUTS
V
OH
V
OS
V
OL
V
OD
Q
HIGH IMPEDANCE
STATE
Q
Q MINUS Q OUTPUT
80%
0V
V
Op-p
HIGH IMPEDANCE
STATE
20%
t
PLZ
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
t
PZL
Test Circuit for Tri-State and Complementary Output
Oscilloscope
Frequency
Counter
Current
Meter
0.01µF
(Note 1)
Supply
Voltage
(V
DD
)
Probe 2
(Note 2)
Probe 1
(Note 2)
100 Ohms
Complementary
Output
Output
Switch
0.1µF
(Note 1)
Ground
Power
Supply
Voltage
Meter
Power
Supply
Tri-State
No
Connect
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm)
to the package ground and supply voltage pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is
recommended.
Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 3 of 6
EMDS13N2H-87.500M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.2
2.0 ±0.2
DIA 1.5 ±0.1
0.30 ±0.05
7.5 ±0.2
16.0 ±0.3
6.75 ±0.20
A0*
8.0 ±0.2
*Compliant to EIA 481A
B0*
K0*
1.5 MIN
DIA 40 MIN
Access Hole at
Slot Location
22.4 MAX
180 MAX
DIA 50 MIN
DIA 20.2 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
16.4 +2.0/-0
DIA 13.0 ±0.2
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 4 of 6
EMDS13N2H-87.500M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 5 of 6
DSP 与 ARM 处理器
