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FDP070AN06A0

漏源电压(Vdss):60V 连续漏极电流(Id)(25°C 时):80A(Tc) 栅源极阈值电压:4V @ 250uA 漏源导通电阻:7mΩ @ 80A,10V 最大功率耗散(Ta=25°C):175W(Tc) 类型:N沟道 N沟道

器件类别:分立半导体    晶体管   

厂商名称:ON Semiconductor(安森美)

厂商官网:http://www.onsemi.cn

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器件参数
参数名称
属性值
Brand Name
ON Semiconductor
是否无铅
不含铅
厂商名称
ON Semiconductor(安森美)
包装说明
FLANGE MOUNT, R-PSFM-T3
制造商包装代码
340AT
Reach Compliance Code
compliant
ECCN代码
EAR99
Factory Lead Time
1 week
雪崩能效等级(Eas)
190 mJ
外壳连接
DRAIN
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
60 V
最大漏极电流 (Abs) (ID)
80 A
最大漏极电流 (ID)
15 A
最大漏源导通电阻
0.007 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码
TO-220AB
JESD-30 代码
R-PSFM-T3
JESD-609代码
e3
元件数量
1
端子数量
3
工作模式
ENHANCEMENT MODE
最高工作温度
175 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
FLANGE MOUNT
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
N-CHANNEL
最大功率耗散 (Abs)
175 W
认证状态
Not Qualified
表面贴装
NO
端子面层
Tin (Sn)
端子形式
THROUGH-HOLE
端子位置
SINGLE
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
SWITCHING
晶体管元件材料
SILICON
文档预览
Is Now Part of
To learn more about ON Semiconductor, please visit our website at
www.onsemi.com
Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor
product management systems do not have the ability to manage part nomenclature that utilizes an underscore
(_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain
device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated
device numbers. The most current and up-to-date ordering information can be found at
www.onsemi.com.
Please
email any questions regarding the system integration to
Fairchild_questions@onsemi.com.
ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number
of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right
to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON
Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON
Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
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FDP070AN06A0 — N-Channel PowerTrench
®
MOSFET
October 2013
FDP070AN06A0
60
V,
80
A,
7
Features
N-Channel PowerTrench
®
MOSFET
Applications
Synchronous Rectification for ATX / Server / Telecom PSU
Battery Protection Circuit
Motor Drives and Uninterruptible Power Supplies
R
DS(on)
=
6.1
mΩ (Typ.) @ V
GS
= 10 V, I
D
=
80
A
Q
g(tot)
=
51
nC (Typ.) @ V
GS
= 10 V
Low Miller Charge
Low Q
rr
Body Diode
UIS Capability (Single Pulse and Repetitive Pulse)
Formerly developmental type 82567
D
GD
S
G
TO-220
S
MOSFET Maximum Ratings
T
C
= 25°C unless
otherwise noted.
Symbol
V
DSS
V
GS
I
D
E
AS
P
D
T
J
, T
STG
Drain to Source Voltage
Gate to Source Voltage
Continuous (T
C
< 97
o
C, V
GS
= 10V)
Pulsed
Single Pulse Avalanche Energy (Note 1)
Power dissipation
Derate above 25 C
Operating and Storage Temperature
o
Parameter
FDP070AN06A0
60
±20
80
Figure 4
190
175
1.17
-55 to 175
Unit
V
V
A
A
mJ
W/
o
C
o
Drain Current
W
C
Thermal Characteristics
R
θJC
R
θJA
Thermal Resistance Junction to Case, Max.
Thermal Resistance Junction to Ambient, Max. (Note 2)
0.86
62
o
C/W
o
C/W
©2003 Fairchild Semiconductor Corporation
FDP070AN06A0
Rev. C2
1
www.fairchildsemi.com
FDP070AN06A0 — N-Channel PowerTrench
®
MOSFET
Package Marking and Ordering Information
Device Marking
FDP070AN06A0
Device
FDP070AN06A0
Package
TO-220
Reel Size
N/A
Tape Width
N/A
Quantity
50
units
Electrical Characteristics
T
C
= 25°C unless otherwise noted.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
Off Characteristics
B
VDSS
I
DSS
I
GSS
Drain to Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
I
D
= 250µA, V
GS
= 0V
V
DS
= 50V
V
GS
= 0V
V
GS
=
±20V
T
C
= 150 C
o
60
-
-
-
-
-
-
-
-
1
250
±100
V
µA
nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage
Drain to Source On Resistance
I
D
= 80A, V
GS
= 10V
V
GS
= V
DS
, I
D
= 250µA
2
-
-
-
0.0061
0.0127
4
0.007
0.015
V
I
D
= 80A, V
GS
= 10V,
T
J
= 175
o
C
Dynamic Characteristics
C
ISS
C
OSS
C
RSS
Q
g(TOT)
Q
g(TH)
Q
gs
Q
gs2
Q
gd
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge at 10V
Threshold Gate Charge
Gate to Source Gate Charge
Gate Charge Threshold to Plateau
Gate to Drain “Miller” Charge
V
DS
= 25V, V
GS
= 0V,
f = 1MHz
V
GS
= 0V to 10V
V
GS
= 0V to 2V
V
DD
= 30V
I
D
= 80A
I
g
= 1.0mA
-
-
-
-
-
-
-
3000
510
230
51
5.4
17
11.6
16
-
-
-
66
7
-
-
-
pF
pF
pF
nC
nC
nC
nC
nC
Switching Characteristics
(V
GS
= 10V)
t
d(ON)
t
d(OFF)
t
f
t
OFF
t
ON
Turn-On Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-Off Time
V
DD
= 30V, I
D
= 80A
V
GS
= 10V, R
GS
= 5.6Ω
-
-
-
-
-
-
-
12
159
27
35
-
256
-
-
-
-
93
ns
ns
ns
ns
ns
ns
t
r
Drain-Source Diode Characteristics
V
SD
t
rr
Q
RR
Source to Drain Diode Voltage
Reverse Recovery Time
Reverse Recovered Charge
I
SD
= 80A
I
SD
= 40A
I
SD
= 75A, dI
SD
/dt = 100A/µs
I
SD
= 75A, dI
SD
/dt = 100A/µs
-
-
-
-
-
-
-
-
1.25
1.0
34
35
V
V
ns
nC
Notes:
1:
Starting T
J
= 25°C, L = 93µH, I
AS
= 64A.
2:
Pulse width = 100s.
©2003 Fairchild Semiconductor Corporation
FDP070AN06A0
Rev. C2
2
www.fairchildsemi.com
FDP070AN06A0 — N-Channel PowerTrench
®
MOSFET
Typical Characteristics
T
C
= 25°C unless otherwise noted
1.2
120
CURRENT LIMITED
BY PACKAGE
POWER DISSIPATION MULTIPLIER
1.0
I
D
, DRAIN CURRENT (A)
0
25
50
75
100
150
175
100
0.8
80
0.6
60
0.4
40
0.2
20
0
125
T
C
, CASE TEMPERATURE (
o
C)
0
25
50
75
100
125
150
175
T
C
, CASE TEMPERATURE (
o
C)
Figure 1. Normalized Power Dissipation vs
Ambient Temperature
2
1
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.02
0.01
Figure 2. Maximum Continuous Drain Current vs
Case Temperature
Z
θJC
, NORMALIZED
THERMAL IMPEDANCE
P
DM
0.1
t
1
t
2
NOTES:
DUTY FACTOR: D = t
1
/t
2
PEAK T
J
= P
DM
x Z
θJC
x R
θJC
+ T
C
10
-3
10
-2
t , RECTANGULAR PULSE DURATION (s)
10
-1
10
0
10
1
SINGLE PULSE
0.01
10
-5
10
-4
Figure 3. Normalized Maximum Transient Thermal Impedance
2000
T
C
= 25
o
C
FOR TEMPERATURES
1000
I
DM
, PEAK CURRENT (A)
ABOVE 25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
I = I
25
175 - T
C
150
V
GS
= 10V
100
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
50
10
-5
10
-4
10
-3
10
-2
t, PULSE WIDTH (s)
10
-1
10
0
10
1
Figure 4. Peak Current Capability
©2003 Fairchild Semiconductor Corporation
FDP070AN06A0
Rev. C2
3
www.fairchildsemi.com
FDP070AN06A0 — N-Channel PowerTrench
®
MOSFET
Typical Characteristics
T
C
= 25°C unless otherwise noted
1000
10µs
I
D
, DRAIN CURRENT (A)
100
100µs
I
AS
, AVALANCHE CURRENT (A)
100
500
If R = 0
t
AV
= (L)(I
AS
)/(1.3*RATED BV
DSS
- V
DD
)
If R
0
t
AV
= (L/R)ln[(I
AS
*R)/(1.3*RATED BV
DSS
- V
DD
) +1]
1ms
10
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
DS(ON)
DC
1
SINGLE PULSE
T
J
= MAX RATED
T
C
= 25
o
C
0.1
1
10
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
100
10ms
STARTING T
J
= 25
o
C
10
STARTING T
J
= 150
o
C
1
0.01
0.1
1
10
100
t
AV
, TIME IN AVALANCHE (ms)
Figure 5. Forward Bias Safe Operating Area
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 6. Unclamped Inductive Switching
Capability
160
V
GS
= 10V
I
D
, DRAIN CURRENT (A)
120
V
GS
= 7V
160
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
V
DD
= 15V
I
D
, DRAIN CURRENT (A)
120
V
GS
= 6V
80
T
C
= 25
o
C
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
V
GS
= 5V
0
80
T
J
= 25
o
C
40
T
J
=
175
o
C
T
J
= -55
o
C
40
0
4.0
4.5
5.0
5.5
6.0
6.5
V
GS
, GATE TO SOURCE VOLTAGE (V)
7.0
0
0.5
1.0
1.5
2.0
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Transfer Characteristics
16
DRAIN TO SOURCE ON RESISTANCE(mΩ)
NORMALIZED DRAIN TO SOURCE
ON RESISTANCE
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
14
Figure 8. Saturation Characteristics
2.5
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
2.0
12
V
GS
= 6V
10
1.5
1.0
8
V
GS
= 10V
6
0
20
40
60
I
D
, DRAIN CURRENT (A)
80
V
GS
= 10V, I
D
=80A
0.5
-80
-40
0
40
80
120
T
J
, JUNCTION TEMPERATURE (
o
C)
160
200
Figure 9. Drain to Source On Resistance vs Drain
Current
©2003 Fairchild Semiconductor Corporation
FDP070AN06A0
Rev. C2
4
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
www.fairchildsemi.com
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