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FDS6690AS

漏源电压(Vdss):30V 连续漏极电流(Id)(25°C 时):10A 栅源极阈值电压:3V @ 1mA 漏源导通电阻:12mΩ @ 10A,10V 最大功率耗散(Ta=25°C):2.5W 类型:N沟道

器件类别:分立半导体    晶体管   

厂商名称:ON Semiconductor(安森美)

厂商官网:http://www.onsemi.cn

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器件参数
参数名称
属性值
Brand Name
ON Semiconductor
是否无铅
不含铅
包装说明
SMALL OUTLINE, R-PDSO-G8
制造商包装代码
751EB
Reach Compliance Code
compliant
ECCN代码
EAR99
Factory Lead Time
1 week
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
30 V
最大漏极电流 (Abs) (ID)
10 A
最大漏极电流 (ID)
10 A
最大漏源导通电阻
0.012 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JESD-30 代码
R-PDSO-G8
JESD-609代码
e4
湿度敏感等级
1
元件数量
1
端子数量
8
工作模式
ENHANCEMENT MODE
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
N-CHANNEL
最大功率耗散 (Abs)
2.5 W
认证状态
Not Qualified
表面贴装
YES
端子面层
Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式
GULL WING
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
SWITCHING
晶体管元件材料
SILICON
Base Number Matches
1
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www.onsemi.com
Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
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Please
email any questions regarding the system integration to
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FDS6690AS
30V N-Channel PowerTrench
®
SyncFET™
May
2008
FDS6690AS
30V N-Channel PowerTrench
®
SyncFET
General Description
The FDS6690AS is designed to replace a single SO-8
MOSFET and Schottky diode in synchronous DC:DC
power supplies. This 30V MOSFET is designed to
maximize power conversion efficiency, providing a low
R
DS(ON)
and low gate charge.
The FDS6690AS
includes an integrated Schottky diode using Fairchild’s
monolithic SyncFET technology. The performance of
the FDS6690AS as the low-side switch in a
synchronous rectifier is close to the performance of the
FDS6690A in parallel with a Schottky diode.
tm
Features
10 A, 30 V.
R
DS(ON)
max= 12 mΩ @ V
GS
= 10 V
R
DS(ON)
max= 15 mΩ @ V
GS
= 4.5 V
Includes SyncFET Schottky diode
Low gate charge (16nC typical)
High performance trench technology for extremely low
R
DS(ON)
High power and current handling capability
Applications
DC/DC converter
Low side notebooks
D
D
D
D
5
6
4
3
2
1
SO-8
S
S
S
G
7
8
Absolute Maximum Ratings
Symbol
V
DSS
V
GSS
I
D
P
D
Drain-Source Voltage
Gate-Source Voltage
Drain Current
– Continuous
– Pulsed
T
A
=25
o
C unless otherwise noted
Parameter
Ratings
30
±20
(Note 1a)
Units
V
V
A
W
10
50
2.5
1.2
1
–55 to +150
Power Dissipation for Single Operation
(Note 1a)
(Note 1b)
(Note 1c)
T
J
, T
STG
Operating and Storage Junction Temperature Range
°C
Thermal Characteristics
R
θJA
R
θJC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)
50
25
°C/W
°C/W
Package Marking and Ordering Information
Device Marking
FDS6690AS
Device
FDS6690AS
Reel Size
13’’
Tape width
12mm
Quantity
2500 units
©2008
Fairchild Semiconductor Corporation
FDS6690AS Rev A2(X)
FDS6690AS
30V N-Channel PowerTrench
®
SyncFET™
Electrical Characteristics
Symbol
BV
DSS
∆BV
DSS
∆T
J
I
DSS
I
GSS
T
A
= 25°C unless otherwise noted
Parameter
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage
(Note 2)
Test Conditions
V
GS
= 0 V, I
D
= 1 mA
I
D
= 10 mA, Referenced to 25°C
V
DS
= 24 V,
V
GS
=
±20
V,
V
GS
= 0 V
V
DS
= 0 V
Min
30
Typ
Max
Units
V
Off Characteristics
30
500
±100
mV/°C
µA
nA
On Characteristics
V
GS(th)
∆V
GS(th)
∆T
J
R
DS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
On–State Drain Current
Forward Transconductance
V
DS
= V
GS
, I
D
= 1 mA
I
D
= 10 mA, Referenced to 25°C
V
GS
= 10 V,
I
D
= 10 A
V
GS
= 4.5 V,
I
D
= 8.5 A
V
GS
=10 V, I
D
=10A, T
J
=125°C
V
GS
= 10 V,
V
DS
= 15 V,
V
DS
= 5 V
I
D
= 10 A
1
1.6
–4
10
12
15
3
V
mV/°C
12
15
19
mΩ
I
D(on)
g
FS
50
45
A
S
Dynamic Characteristics
C
iss
C
oss
C
rss
R
G
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
(Note 2)
V
DS
= 15 V,
f = 1.0 MHz
V
GS
= 15 mV,
V
GS
= 0 V,
910
270
100
pF
pF
pF
f = 1.0 MHz
2.0
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
Q
g
(TOT)
Q
g
Q
gs
Q
gd
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
8
V
DS
= 15 V,
V
GS
= 10 V,
I
D
= 1 A,
R
GEN
= 6
5
25
6
11
V
DS
= 15 V,
V
GS
= 4.5 V,
I
D
= 1 A,
R
GEN
= 6
11
15
8
16
V
DD
= 15 V,
I
D
= 10 A
9
2.3
3.0
16
10
40
12
20
20
27
16
23
13
ns
ns
ns
ns
ns
ns
ns
ns
nC
nC
nC
nC
Total Gate Charge at Vgs=10V
Total Gate Charge at Vgs=5V
Gate–Source Charge
Gate–Drain Charge
FDS6690AS Rev A2 (X)
FDS6690AS
30V N-Channel PowerTrench
®
SyncFET™
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min
Typ
Max
Units
Drain–Source Diode Characteristics and Maximum Ratings
I
S
V
SD
T
rr
Q
rr
Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
Voltage
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
V
GS
= 0 V,
I
F
= 10A,
d
iF
/d
t
= 300 A/µs
(Note 3)
3.5
(Note 2)
A
V
nS
nC
I
S
= 3.5 A
0.6
16
9
0.7
Notes:
1.
R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the
drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) 50°/W when
mounted on a 1 in
2
pad of 2 oz copper
b) 105°/W when
mounted on a .04 in
2
pad of 2 oz copper
c) 125°/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2.
Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
3.
See “SyncFET Schottky body diode characteristics” below.
FDS6690AS Rev A2 (X)
FDS6690AS
30V N-Channel PowerTrench
®
SyncFET™
Typical Characteristics
50
R
DS(ON)
, NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
V
GS
= 10V
4.0V
2.2
V
GS
= 4.0V
40
I
D
, DRAIN CURRENT (A)
6.0V
4.5V
1.8
3.5V
30
3.0V
1.4
4.0V
4.5V
5.0V
6.0V
10V
20
1
10
2.5V
0
0
0.5
1
1.5
V
DS
, DRAIN-SOURCE VOLTAGE (V)
2
0.6
0
10
20
30
I
D
, DRAIN CURRENT (A)
40
50
Figure 1. On-Region Characteristics.
Figure 2. On-Resistance Variation with
Drain Current and Gate Voltage.
0.06
R
DS(ON)
, ON-RESISTANCE (OHM)
1.6
R
DS(ON)
, NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
1.45
1.3
1.15
1
0.85
0.7
-50
-25
0
25
50
75
100
o
T
J
, JUNCTION TEMPERATURE ( C)
125
150
I
D
= 10A
V
GS
= 10V
I
D
= 5A
0.05
0.04
0.03
T
A
= 125 C
0.02
o
0.01
T
A
= 25
o
C
0
2
4
6
8
V
GS
, GATE TO SOURCE VOLTAGE (V)
10
Figure 3. On-Resistance Variation with
Temperature.
50
I
S
, REVERSE DRAIN CURRENT (A)
V
DS
= 5V
Figure 4. On-Resistance Variation with
Gate-to-Source Voltage.
10
V
GS
= 0V
I
D
, DRAIN CURRENT (A)
40
1
T
A
= 125
o
C
30
0.1
25
o
C
-55
o
C
20
T
A
= 125 C
o
-55 C
o
0.01
10
25
o
C
0
1
1.5
2
2.5
3
3.5
V
GS
, GATE TO SOURCE VOLTAGE (V)
4
0.001
0
0.2
0.4
0.6
V
SD
, BODY DIODE FORWARD VOLTAGE (V)
0.8
Figure 5. Transfer Characteristics.
Figure 6. Body Diode Forward Voltage Variation
with Source Current and Temperature.
FDS6690AS Rev A2 (X)
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