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FGB30N6S2

45A, 600V, N-CHANNEL IGBT, TO-263AB, PLASTIC, D2PAK-3

器件类别:分立半导体    晶体管   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Rochester Electronics
零件包装代码
D2PAK
包装说明
PLASTIC, D2PAK-3
针数
3
Reach Compliance Code
unknown
其他特性
LOW CONDUCTION LOSS
外壳连接
COLLECTOR
最大集电极电流 (IC)
45 A
集电极-发射极最大电压
600 V
配置
SINGLE
JEDEC-95代码
TO-263AB
JESD-30 代码
R-PSSO-G2
JESD-609代码
e3
湿度敏感等级
1
元件数量
1
端子数量
2
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
260
极性/信道类型
N-CHANNEL
认证状态
COMMERCIAL
表面贴装
YES
端子面层
MATTE TIN
端子形式
GULL WING
端子位置
SINGLE
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
POWER CONTROL
晶体管元件材料
SILICON
标称断开时间 (toff)
163 ns
标称接通时间 (ton)
28 ns
文档预览
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FGH30N6S2 / FGP30N6S2 / FGB30N6S2
August 2003
FGH30N6S2 / FGP30N6S2 / FGB30N6S2
600V, SMPS II Series N-Channel IGBT
General Description
The FGH30N6S2, FGP30N6S2, and FGB30N6S2 are Low
Gate Charge, Low Plateau Voltage SMPS II IGBTs combin-
ing the fast switching speed of the SMPS IGBTs along with
lower gate charge and plateau voltage and avalanche capa-
bility (UIS). These LGC devices shorten delay times, and
reduce the power requirement of the gate drive. These de-
vices are ideally suited for high voltage switched mode pow-
er supply applications where low conduction loss, fast
switching times and UIS capability are essential. SMPS II
LGC devices have been specially designed for:
Power Factor Correction (PFC) circuits
Full bridge topologies
Half bridge topologies
Push-Pull circuits
Uninterruptible power supplies
Zero voltage and zero current switching circuits
Features
• 100kHz Operation at 390V, 14A
• 200kHZ Operation at 390V, 9A
• 600V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . 90ns at TJ = 125
o
C
• Low Gate Charge . . . . . . . . . 23nC at V
GE
= 15V
• Low Plateau Voltage . . . . . . . . . . . . .6.5V Typical
• UIS Rated . . . . . . . . . . . . . . . . . . . . . . . . . 150mJ
• Low Conduction Loss
Formerly Developmental Type TA49367.
Package
TO-247
E
C
G
Symbol
C
TO-220AB
E
C
G
TO-263AB
G
G
E
COLLECTOR
(Back-Metal)
COLLECTOR
(Flange)
E
Device Maximum Ratings
T
C
= 25°C unless otherwise noted
Symbol
BV
CES
I
C25
I
C110
I
CM
V
GES
V
GEM
SSOA
E
AS
P
D
T
J
T
STG
Parameter
Collector to Emitter Breakdown Voltage
Collector Current Continuous, T
C
= 25°C
Collector Current Continuous, T
C
= 110°C
Collector Current Pulsed (Note 1)
Gate to Emitter Voltage Continuous
Gate to Emitter Voltage Pulsed
Switching Safe Operating Area at T
J
= 150°C, Figure 2
Pulsed Avalanche Energy, I
CE
= 20A, L = 1.3mH, V
DD
= 50V
Power Dissipation Total T
C
= 25°C
Power Dissipation Derating T
C
> 25°C
Operating Junction Temperature Range
Storage Junction Temperature Range
Ratings
600
45
20
108
±20
±30
60A at 600V
150
167
1.33
-55 to 150
-55 to 150
mJ
W
W/°C
°C
°C
Units
V
A
A
A
V
V
CAUTION: Stresses above those listed in “Device Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. Pulse width limited by maximum junction temperature.
©2003 Fairchild Semiconductor Corporation
FGH30N6S2 / FGP30N6S2 / FGB30N6S2 Rev. A1
FGH30N6S2 / FGP30N6S2 / FGS30N6S2
Package Marking and Ordering Information
Device Marking
30N6S2
30N6S2
30N6S2
30N6S2
Device
FGH30N6S2
FGP30N6S2
FGB30N6S2
FGB30N6S2T
Package
TO-247
TO-220AB
TO-263AB
TO-263AB
Reel Size
Tube
Tube
Tube
330mm
Tape Width
N/A
N/A
N/A
24mm
Quantity
30 Units
50 Units
50 Units
800 Units
Electrical Characteristics
T
J
= 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off State Characteristics
BV
CES
BV
ECS
I
CES
I
GES
Collector to Emitter Breakdown Voltage
Emitter to Collector Breakdown Voltage
Collector to Emitter Leakage Current
Gate to Emitter Leakage Current
I
C
= 250µA, V
GE
= 0
I
C
= -10mA, V
GE
= 0
V
CE
= 600V
V
GE
= ± 20V
T
J
= 25°C
T
J
= 125°C
600
20
-
-
-
-
-
-
-
-
-
-
100
2
±250
V
V
µA
mA
nA
On State Characteristics
V
CE(SAT)
Collector to Emitter Saturation Voltage
I
C
= 12A,
V
GE
= 15V
T
J
= 25°C
T
J
= 125°C
-
-
2.0
1.7
2.5
2.0
V
V
Dynamic Characteristics
Q
G(ON)
V
GE(TH)
V
GEP
Gate Charge
Gate to Emitter Threshold Voltage
Gate to Emitter Plateau Voltage
I
C
= 12A,
V
CE
= 300V
V
GE
= 15V
V
GE
= 20V
-
-
3.5
-
23
26
4.3
6.5
29
33
5.0
8.0
nC
nC
V
V
I
C
= 250µA, V
CE
= 600V
I
C
= 12A, V
CE
= 300V
Switching Characteristics
SSOA
t
d(ON)I
t
rI
t
d(OFF)I
t
fI
E
ON1
E
ON2
E
OFF
t
d(ON)I
t
rI
t
d(OFF)I
t
fI
E
ON1
E
ON2
E
OFF
Switching SOA
Current Turn-On Delay Time
Current Rise Time
Current Turn-Off Delay Time
Current Fall Time
Turn-On Energy (Note 2)
Turn-On Energy (Note 2)
Turn-Off Energy (Note 3)
Current Turn-On Delay Time
Current Rise Time
Current Turn-Off Delay Time
Current Fall Time
Turn-On Energy (Note 2)
Turn-On Energy (Note 2)
Turn-Off Energy (Note 3)
IGBT and Diode at T
J
= 125°C
I
CE
= 12A,
V
CE
= 390V,
V
GE
= 15V,
R
G
= 10Ω
L = 200µH
Test Circuit - Figure 20
T
J
= 150°C, R
G
= 10Ω, V
GE
=
15V, L = 100µH, V
CE
= 600V
60
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
6
10
40
53
55
110
100
11
17
73
90
55
160
250
-
-
-
-
-
-
-
150
-
-
100
100
-
200
350
A
ns
ns
ns
ns
µJ
µJ
µJ
ns
ns
ns
ns
µJ
µJ
µJ
IGBT and Diode at T
J
= 25°C,
I
CE
= 12A,
V
CE
= 390V,
V
GE
= 15V,
R
G
= 10Ω
L = 200µH
Test Circuit - Figure 20
Thermal Characteristics
R
θJC
NOTE:
2.
Values
Thermal Resistance Junction-Case
-
-
0.75
°C/W
for two Turn-On loss conditions are shown for the convenience of the circuit designer. E
ON1
is the turn-on loss
of the IGBT only. E
ON2
is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same T
J
as the IGBT. The diode type is specified in figure 20.
3.
Turn-Off
Energy Loss (E
OFF
) is defined as the integral of the instantaneous power loss starting at the trailing edge of
the input pulse and ending at the point where the collector current equals zero (I
CE
= 0A). All devices were tested per
JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produc-
es the true total Turn-Off Energy Loss.
©2003 Fairchild Semiconductor Corporation
FGH30N6S2 / FGP30N6S2 / FGS30N6S2 Rev. A1
FGH30N6S2 / FGP30N6S2 / FGS30N6S2
Typical Performance Curves
I
CE
, COLLECTOR TO EMITTER CURRENT (A)
50
I
CE
, DC COLLECTOR CURRENT (A)
70
T
J
= 150
o
C, R
G
= 10Ω, V
GE
= 15V, L = 100µH
60
50
40
30
20
10
0
0
100
200
300
400
500
600
700
V
CE
, COLLECTOR TO EMITTER VOLTAGE (V)
40
30
20
10
0
25
50
T
C
75
100
125
150
, CASE TEMPERATURE (
o
C)
Figure 1. DC Collector Current vs Case
Temperature
1000
f
MAX
, OPERATING FREQUENCY (kHz)
T
C
75
o
C
V
GE
= 10V
V
GE
= 15V
Figure 2. Minimum Switching Safe Operating Area
t
SC
, SHORT CIRCUIT WITHSTAND TIME (µs)
V
CE
= 390V, R
G
= 10Ω, T
J
= 125
o
C
10
300
8
t
SC
6
I
SC
250
100
f
MAX1
= 0.05 / (t
d(OFF)I
+ t
d(ON)I
)
f
MAX2
= (P
D
- P
C
) / (E
ON2
+ E
OFF
)
P
C
= CONDUCTION DISSIPATION
(DUTY FACTOR = 50%)
R
ØJC
= 0.49
o
C/W, SEE NOTES
T
J
= 125
o
C, R
G
= 3Ω L = 200µH, V
CE
= 390V
,
200
4
150
2
9
10
11
12
13
14
15
10
1
10
I
CE
, COLLECTOR TO EMITTER CURRENT (A)
20
30
100
16
V
GE
, GATE TO EMITTER VOLTAGE (V)
Figure 3. Operating Frequency vs Collector to
Emitter Current
I
CE
, COLLECTOR TO EMITTER CURRENT (A)
18
16
14
12
10
8
6
T
J
= 150
o
C
4
2
0
0.50
T
J
= 25
o
C
T
J
= 125
o
C
DUTY CYCLE < 0.5%, V
GE
= 10V
PULSE DURATION = 250µs
I
CE
, COLLECTOR TO EMITTER CURRENT (A)
Figure 4. Short Circuit Withstand Time
18
16
14
12
10
8
6
4
2
0
.5
.75
1
1.25
1.50
T
J
= 25
o
C
1.75
2.0
2.25
T
J
= 150
o
C
DUTY CYCLE < 0.5%, V
GE
=15V
PULSE DURATION = 250µs
T
J
= 125
o
C
0.75
1.00
1.25
1.50
1.75
2.00
2.25
V
CE
, COLLECTOR TO EMITTER VOLTAGE (V)
V
CE
, COLLECTOR TO EMITTER VOLTAGE (V)
Figure 5. Collector to Emitter On-State Voltage
Figure 6. Collector to Emitter On-State Voltage
©2003 Fairchild Semiconductor Corporation
FGH30N6S2 / FGP30N6S2 / FGS30N6S2 Rev. A1
I
SC
, PEAK SHORT CIRCUIT CURRENT (A)
12
350
FGH30N6S2 / FGP30N6S2 / FGS30N6S2
Typical Performance Curves
(Continued)
400
E
ON2
, TURN-ON ENERGY LOSS (µJ)
R
G
= 10Ω, L = 500µH, V
CE
= 390V
350
300
T
J
= 125
o
C, V
GE
= 10V, V
GE
= 15V
250
200
150
100
T
J
= 25
o
C, V
GE
= 10V, V
GE
= 15V
50
0
0
5
10
15
20
25
I
CE
, COLLECTOR TO EMITTER CURRENT (A)
E
OFF
TURN-OFF ENERGY LOSS (µJ)
600
R
G
= 10Ω, L = 500µH, V
CE
= 390V
500
400
T
J
= 125
o
C, V
GE
= 10V, V
GE
= 15V
300
200
100
T
J
= 25
o
C, V
GE
= 10V, V
GE
= 15V
0
0
5
10
15
20
25
I
CE
, COLLECTOR TO EMITTER CURRENT (A)
Figure 7. Turn-On Energy Loss vs Collector to
Emitter Current
16
t
d(ON)I
, TURN-ON DELAY TIME (ns)
R
G
= 10Ω L = 500µH, V
CE
= 390V
,
14
12
10
T
J
= 25
o
C, T
J
= 125
o
C, V
GE
= 10V
8
6
4
T
J
= 25
o
C, T
J
= 125
o
C, V
GE
= 15V
2
0
Figure 8. Turn-Off Energy Loss vs Collector to
Emitter Current
40
R
G
= 10Ω L = 500µH, V
CE
= 390V
,
35
t
rI
, RISE TIME (ns)
30
25
T
J
= 125
o
C, V
GE
= 15V, V
GE
= 10V
20
15
10
T
J
= 25
o
C, V
GE
= 10V, V
GE
=15V
5
0
0
5
10
15
20
25
0
5
10
15
20
25
I
CE
, COLLECTOR TO EMITTER CURRENT (A)
I
CE
, COLLECTOR TO EMITTER CURRENT (A)
Figure 9. Turn-On Delay Time vs Collector to
Emitter Current
90
t
d(OFF
) TURN-OFF DELAY TIME (ns)
R
G
= 10Ω, L = 500µH, V
CE
= 390V
80
70
60
50
40
30
20
0
5
10
15
20
25
I
CE
, COLLECTOR TO EMITTER CURRENT (A)
Figure 10. Turn-On Rise Time vs Collector to
Emitter Current
120
R
G
= 10Ω L = 500µH, V
CE
= 390V
,
t
fI
, FALL TIME (ns)
100
T
J
= 125
o
C, V
GE
= 10V OR 15V
80
60
T
J
= 25
o
C, V
GE
= 10V OR 15V
40
0
5
10
15
20
25
I
CE
, COLLECTOR TO EMITTER CURRENT (A)
Figure 11. Turn-Off Delay Time vs Collector to
Emitter Current
Figure 12. Fall Time vs Collector to Emitter
Current
©2003 Fairchild Semiconductor Corporation
FGH30N6S2 / FGP30N6S2 / FGS30N6S2 Rev. A1
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参数对比
与FGB30N6S2相近的元器件有:FGH30N6S2、FGP30N6S2、FGB30N6S2T。描述及对比如下:
型号 FGB30N6S2 FGH30N6S2 FGP30N6S2 FGB30N6S2T
描述 45A, 600V, N-CHANNEL IGBT, TO-263AB, PLASTIC, D2PAK-3 45A, 600V, N-CHANNEL IGBT, TO-247, TO-247, 3 PIN 45A, 600V, N-CHANNEL IGBT, TO-220AB, TO-220AB, 3 PIN 45A, 600V, N-CHANNEL IGBT, TO-263AB, PLASTIC, D2PAK-3
是否无铅 不含铅 不含铅 不含铅 不含铅
厂商名称 Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
零件包装代码 D2PAK TO-247 TO-220AB D2PAK
包装说明 PLASTIC, D2PAK-3 TO-247, 3 PIN TO-220AB, 3 PIN PLASTIC, D2PAK-3
针数 3 3 3 3
Reach Compliance Code unknown unknown unknown unknown
其他特性 LOW CONDUCTION LOSS LOW CONDUCTION LOSS LOW CONDUCTION LOSS LOW CONDUCTION LOSS
外壳连接 COLLECTOR COLLECTOR COLLECTOR COLLECTOR
最大集电极电流 (IC) 45 A 45 A 45 A 45 A
集电极-发射极最大电压 600 V 600 V 600 V 600 V
配置 SINGLE SINGLE SINGLE SINGLE
JEDEC-95代码 TO-263AB TO-247 TO-220AB TO-263AB
JESD-30 代码 R-PSSO-G2 R-PSFM-T3 R-PSFM-T3 R-PSSO-G2
JESD-609代码 e3 e3 e3 e3
湿度敏感等级 1 NOT APPLICABLE NOT APPLICABLE 1
元件数量 1 1 1 1
端子数量 2 3 3 2
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE FLANGE MOUNT FLANGE MOUNT SMALL OUTLINE
峰值回流温度(摄氏度) 260 NOT APPLICABLE NOT APPLICABLE 260
极性/信道类型 N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL
认证状态 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
表面贴装 YES NO NO YES
端子面层 MATTE TIN MATTE TIN MATTE TIN MATTE TIN
端子形式 GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING
端子位置 SINGLE SINGLE SINGLE SINGLE
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT APPLICABLE NOT APPLICABLE NOT SPECIFIED
晶体管应用 POWER CONTROL POWER CONTROL POWER CONTROL POWER CONTROL
晶体管元件材料 SILICON SILICON SILICON SILICON
标称断开时间 (toff) 163 ns 163 ns 163 ns 163 ns
标称接通时间 (ton) 28 ns 28 ns 28 ns 28 ns
是否Rohs认证 符合 符合 符合 -
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