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FQPF9N25CT

MOSFET N-CH/250V/9A/QFET

器件类别:分立半导体    晶体管   

厂商名称:ON Semiconductor(安森美)

厂商官网:http://www.onsemi.cn

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器件参数
参数名称
属性值
Brand Name
ON Semiconductor
是否无铅
不含铅
厂商名称
ON Semiconductor(安森美)
包装说明
,
制造商包装代码
221AT
Reach Compliance Code
not_compliant
Factory Lead Time
1 week
配置
Single
最大漏极电流 (Abs) (ID)
8.8 A
FET 技术
METAL-OXIDE SEMICONDUCTOR
JESD-609代码
e3
最高工作温度
150 °C
极性/信道类型
N-CHANNEL
最大功率耗散 (Abs)
38 W
表面贴装
NO
端子面层
Tin (Sn)
文档预览
Is Now Part of
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www.onsemi.com
Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
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www.onsemi.com.
Please
email any questions regarding the system integration to
Fairchild_questions@onsemi.com.
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FQPF9N25C / FQPF9N25CT — N-Channel QFET
®
MOSFET
November 2013
FQPF9N25C / FQPF9N25CT
N-Channel QFET
®
MOSFET
250 V, 8.8 A, 430 mΩ
Features
• 8.8 A, 250 V, R
DS(on)
= 430 mΩ (Max.) @ V
GS
= 10 V,
I
D
= 4.4 A
• Low Gate Charge (Typ. 26.5 nC)
• Low Crss (Typ. 45.5 pF)
• 100% Avalanche Tested
Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary, planar
stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the avalanche
and commutation mode. These devices are well suited for high
efficiency switching DC/DC converters, switch mode power
supplies, DC-AC converters for uninterrupted power supplies
and motor controls.
D
G
D
S
G
TO-220F
S
MOSFET Maximum Ratings
T
C
= 25
o
C unless otherwise noted.
Symbol
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt
P
D
T
J
, T
STG
T
L
Drain to Source Voltage
Drain Current
Drain Current
Gate to Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation
(T
C
= 25 C)
o
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Parameter
- Continuous (T
C
= 25
o
C)
- Continuous (T
C
= 100 C)
- Pulsed
(Note 1)
FQPF9N25C / FQPF9N25CT
250
8.8 *
5.6 *
35.2 *
±
30
285
8.8
7.4
5.5
38
o
o
Unit
V
A
A
A
V
mJ
A
mJ
V/ns
W
W/°C
°C
°C
- Derate Above 25 C
0.3
-55 to +150
300
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
*Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol
R
θJC
R
θJA
Parameter
Thermal Resistance, Junction to Case, Max.
Thermal Resistance, Junction to Ambient, Max.
FQPF9N25C / FQPF9N25CT
3.29
62.5
Unit
°C/W
©2004 Fairchild Semiconductor Corporation
FQPF9N25C / FQPF9N25CT Rev. C1
1
www.fairchildsemi.com
FQPF9N25C / FQPF9N25CT — N-Channel QFET
®
MOSFET
Package Marking and Ordering Information
Device Marking
FQPF9N25C
FQPF9N25CT
Device
FQPF9N25C
FQPF9N25CT
Package
TO-220F
TO-220F
Reel Size
Tube
Tube
Tape Width
N/A
N/A
Quantity
50 units
50 units
Electrical Characteristics
T
C
= 25
o
C unless otherwise noted.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
Off Characteristics
BV
DSS
ΔBV
DSS
/
ΔT
J
I
DSS
I
GSSF
I
GSSR
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature Coeffi-
cient
Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
V
GS
= 0 V, I
D
= 250
μA
I
D
= 250
μA,
Referenced to 25°C
V
DS
= 250 V, V
GS
= 0 V
V
DS
= 200 V, T
C
= 125°C
V
GS
= 30 V, V
DS
= 0 V
V
GS
= -30 V, V
DS
= 0 V
250
--
--
--
--
--
--
0.30
--
--
--
--
--
--
10
100
100
-100
V
V/°C
μA
μA
nA
nA
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Gate Threshold Voltage
Static Drain-Source
On-Resistance
Forward Transconductance
V
DS
= V
GS
, I
D
= 250
μA
V
GS
= 10 V, I
D
= 4.4 A
V
DS
= 40 V, I
D
= 4.4 A
2.0
--
--
--
0.35
7.0
4.0
0.43
--
V
Ω
S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V
DS
= 25 V, V
GS
= 0 V,
f = 1.0 MHz
--
--
--
545
115
45.5
710
150
60
pF
pF
pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DS
= 200 V, I
D
= 8.8 A,
V
GS
= 10 V
(Note 4)
V
DD
= 125 V, I
D
= 8.8 A,
V
GS
= 10 V
,
R
G
= 25
Ω
(Note 4)
--
--
--
--
--
--
--
15
85
90
65
26.5
3.5
13.5
40
180
190
140
35
--
--
ns
ns
ns
ns
nC
nC
nC
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1. Repetitive rating : pulse-width limited by maximum junction temperature.
2. L = 5.9 mH, I
AS
= 8.8 A, V
DD
= 50 V, R
G
= 25
Ω,
starting T
J
= 25°C.
3. I
SD
8.8 A, di/dt
300 A/μs, V
DD
BV
DSS,
starting T
J
= 25°C.
4. Essentially independent of operating temperature.
Maximum Continuous Drain-Source Diode Forward Current
Maximum Pulsed Drain-Source Diode Forward Current
V
GS
= 0 V, I
S
= 8.8 A
Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
V
GS
= 0 V, I
S
= 8.8 A,
dI
F
/ dt = 100 A/μs
--
--
--
--
--
--
--
--
218
1.58
8.8
35.2
1.5
--
--
A
A
V
ns
μC
©2004 Fairchild Semiconductor Corporation
FQPF9N25C / FQPF9N25CT Rev. C1
2
www.fairchildsemi.com
FQPF9N25C / FQPF9N25CT — N-Channel QFET
®
MOSFET
Typical Characteristics
10
1
I
D
, Drain Current [A]
I
D
, Drain Current [A]
V
GS
15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
5.0 V
Bottom : 4.5 V
Top :
10
1
150 C
o
10
0
10
0
25 C
o
-55 C
o
Notes :
1. 250μ s Pulse Test
2. T
C
= 25
Notes :
1. V
DS
= 40V
2. 250μ s Pulse Test
10
-1
10
-1
10
0
10
1
10
-1
2
4
6
8
10
V
DS
, Drain-Source Voltage [V]
V
GS
, Gate-Source Voltage [V]
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
1.25
R
DS(ON)
[Ω ],
Drain-Source On-Resistance
1.00
I
DR
, Reverse Drain Current [A]
10
1
0.75
V
GS
= 10V
0.50
10
0
V
GS
= 20V
0.25
Note : T
J
= 25
150
25
Notes :
1. V
GS
= 0V
2. 250μ s Pulse Test
0.00
0
10
20
30
10
-1
0.2
0.4
0.6
0.8
1.0
1.2
1.4
I
D
, Drain Current [A]
V
SD
, Source-Drain voltage [V]
Figure 3. On-Resistance Variation vs
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation with Source Current
and Temperature
2000
C
iss
= C
gs
+ C
gd
(C
ds
= shorted)
C
oss
= C
ds
+ C
gd
C
rss
= C
gd
12
1500
V
GS
, Gate-Source Voltage [V]
10
V
DS
= 50V
V
DS
= 125V
V
DS
= 200V
Capacitance [pF]
8
1000
C
iss
C
oss
6
500
Notes :
1. V
GS
= 0 V
2. f = 1 MHz
C
rss
4
2
Note : I
D
= 8.8A
0
-1
10
10
0
10
1
0
0
5
10
15
20
25
30
V
DS
, Drain-Source Voltage [V]
Q
G
, Total Gate Charge [nC]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
©2004 Fairchild Semiconductor Corporation
FQPF9N25C / FQPF9N25CT Rev. C1
3
www.fairchildsemi.com
FQPF9N25C / FQPF9N25CT — N-Channel QFET
®
MOSFET
Typical Characteristics
(Continued)
1.2
3.0
BV
DSS
, (Normalized)
Drain-Source Breakdown Voltage
1.1
R
DS(ON)
, (Normalized)
Drain-Source On-Resistance
2.5
2.0
1.0
1.5
1.0
Notes :
1. V
GS
= 10 V
2. I
D
= 4.4 A
0.9
Notes :
1. V
GS
= 0 V
2. I
D
= 250
μA
0.5
0.8
-100
-50
0
50
100
o
150
200
0.0
-100
-50
0
50
100
o
150
200
T
J
, Junction Temperature [ C]
T
J
, Junction Temperature [ C]
Figure 7. Breakdown Voltage Variation
vs Temperature
Figure 8. On-Resistance Variation
vs Temperature
10
2
Operation in This Area
is Limited by R
DS(on)
10
I
D
, Drain Current [A]
10
μ
s
10
1
8
100
μ
s
1 ms
10 ms
I
D
, Drain Current [A]
6
10
0
DC
Notes :
1. T
C
= 25 C
2. T
J
= 150 C
3. Single Pulse
o
o
4
2
10
-1
10
0
10
1
10
2
0
25
50
75
100
125
150
V
DS
, Drain-Source Voltage [V]
T
C
, Case Temperature [
]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs Case Temperature
Z
θJC
(t), Thermal Response [
o
C/W]
Z (t), Thermal Response
D = 0 .5
10
0
0 .2
0 .1
0 .0 5
10
-1
N o te s :
1 . Z
θ
J C
( t) = 3 . 2 9
/W M a x .
2 . D u t y F a c to r , D = t
1
/t
2
3 . T
J M
- T
C
= P
D M
* Z
θ
J C
( t)
0 .0 2
0 .0 1
s in g le p u ls e
P
DM
t
1
t
2
10
0
θ
JC
10
-2
10
-5
10
-4
10
-3
10
-2
10
-1
10
1
t
1
, S q u a r e W a v e P u ls e D u r a t io n [ s e c ]
Figure 11. Transient Thermal Response Curve
©2004 Fairchild Semiconductor Corporation
FQPF9N25C / FQPF9N25CT Rev. C1
4
www.fairchildsemi.com
查看更多>
参数对比
与FQPF9N25CT相近的元器件有:。描述及对比如下:
型号 FQPF9N25CT
描述 MOSFET N-CH/250V/9A/QFET
Brand Name ON Semiconductor
是否无铅 不含铅
厂商名称 ON Semiconductor(安森美)
制造商包装代码 221AT
Reach Compliance Code not_compliant
Factory Lead Time 1 week
配置 Single
最大漏极电流 (Abs) (ID) 8.8 A
FET 技术 METAL-OXIDE SEMICONDUCTOR
JESD-609代码 e3
最高工作温度 150 °C
极性/信道类型 N-CHANNEL
最大功率耗散 (Abs) 38 W
表面贴装 NO
端子面层 Tin (Sn)
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器件捷径:
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