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FRDM-STBC-AGM01

Acceleration Sensor Development Tools Sensor Toolbox for NXP Freedom development board with FXOS8700C and FXAS21002C

器件类别:开发板/开发套件/开发工具   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

器件标准:

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器件参数
参数名称
属性值
Product Attribute
Attribute Value
制造商
Manufacturer
NXP(恩智浦)
产品种类
Product Category
Acceleration Sensor Development Tools
RoHS
Details
产品
Product
Development Boards
类型
Type
Accelerometer, Gyroscope, Magnetometer Sensors
工具用于评估
Tool Is For Evaluation Of
FXAS21002, FXOS8700
工作电源电压
Operating Supply Voltage
1.95 V to 3.6 V
Description/Function
9 axis sensor toolbox development board with 3 axis gyroscope and 6 axis integrated e-compass
接口类型
Interface Type
I2C, SPI, UART, USB
最大工作温度
Maximum Operating Temperature
+ 85 C
最小工作温度
Minimum Operating Temperature
- 40 C
工厂包装数量
Factory Pack Quantity
1
单位重量
Unit Weight
1 lb
文档预览
Freescale Semiconductor, Inc.
Data Sheet: Technical Data
FXAS21002C
Rev. 2.1, 5/2015
3-Axis Digital Angular Rate
Gyroscope
FXAS21002C is a small, low-power, yaw, pitch, and roll angular
rate gyroscope with 16 bit ADC resolution. The full-scale range is
adjustable from ±250°/s to ±2000°/s. It features both I
2
C and SPI
interfaces.
FXAS21002C is capable of measuring angular rates up to
±2000°/s, with output data rates (ODR) from 12.5 to 800 Hz. An
integrated Low-Pass Filter (LPF) allows the host application to
limit the digital signal bandwidth. The device may be configured
to generate an interrupt when a user-programmable angular rate
threshold is crossed on any one of the enabled axes.
FXAS21002C is available in a plastic, 24-lead QFN package; the
device is guaranteed to operate over the extended temperature
range of –40 °C to +85 °C.
Features
FXAS21002C
24 QFN
4 mm x 4 mm x 1 mm
Case 2209-01
Top View
RSVD_GND
RSVD_GND
RSVD_GND
RSVD_GND
21
Supply voltage (V
DD
) from 1.95 V to 3.6 V
2
18
V
DDIO
Interface Supply voltage (V
DDIO
) from 1.62 V to V
DD
+ 0.3 V
17
SPI_CS_B
INT1
3
16-bit digital output resolution
16
VREGD
RST_B
4
±250/500/1000/2000°/s configurable full-scale dynamic
15
V
DD
GND2
5
ranges
14
GND3
RSVD_GND
6
Full-Scale Range boost function enables FSR's up to
13
SA0 /
RSVD_GND
7
±4000 dps
9
10
8
11
12
MISO
Angular rate sensitivity of 0.0625°/s in ±2000°/s FSR mode
Noise spectral density of 25 mdps/√Hz at 64 Hz bandwidth
(200 Hz ODR)
Current consumption in Active mode is 2.7 mA
Fast transition from Standby to Active mode (60 ms)
Pin Connections
Supported digital interfaces include:
• I
2
C Standard and Fast Mode (100/400 kHz)
• SPI Interface (3- and 4-wire modes, up to 2 MHz)
FIFO buffer is 192 bytes (32 X/Y/Z samples) with stop and circular operating modes
Output Data Rates (ODR) from 12.5 to 800 Hz; programmable low-pass filter to further limit digital output
data bandwidth
Low power standby mode
Power mode transition control via external pin for accelerometer-based power management (motion
interrupt)
Rate Threshold interrupt function
Integrated self-test function
8-bit temperature sensor
I
2
C_B / SPI
RSVD_GND
RSVD_GND
SCL / SCLK
SDA / MOSI
/ SPI_DATA
GND1
INT2 /
PWR_CTRL
24
1
23
22
RSVD_GND
20
19
GND4
© 2014-2015 Freescale Semiconductor, Inc. All rights reserved.
Typical Applications
• Industrial and consumer grade robots, UAVs, and RC vehicles
• Game controller
• Gyro-stabilized electronic compass
• Orientation determination
• Gesture-based user interfaces and Human Machine Interface (HMI)
• Indoor navigation
• Mobile phones and tablets
• Virtual and augmented reality devices (including glasses)
Ordering Information
Part Number
FXAS21002CQR1
Temperature Range
–40 °C to +85 °C
Package Description
QFN
Shipping
Tape and reel (1 k)
Related Documentation
The FXAS21002C device features and operations are described in a variety of reference manuals, user guides,
and application notes. To find the most-current versions of these documents, go to freescale.com/
FXAS21002C, and then click on the Documentation tab.
2
Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Table of Contents
1 General Description.............................................................. 4
1.1 Block Diagram............................................................. 4
1.2 Pinout...........................................................................4
System Connections....................................................5
1.3.1 Typical Application Circuit—I2C Mode.............5
1.3.2 Typical Application Circuit—SPI Mode............ 6
1.4 Sensitive Axes Orientations and Polarities.................. 7
2 Mechanical and Electrical Specifications.............................. 8
2.1 Absolute Maximum Ratings......................................... 8
2.2 Operating Conditions................................................... 9
2.3 Mechanical Characteristics..........................................9
2.4 Electrical Characteristics............................................. 10
2.5 Temperature Sensor Characteristics........................... 11
3 Digital Interfaces................................................................... 12
3.1 I²C Interface................................................................. 12
3.1.1 I²C Operation................................................... 14
3.1.2 I²C Read Operations........................................ 15
3.1.3 I²C Write Operations........................................ 15
3.2 SPI Interface................................................................ 17
3.2.1 General SPI Operation.................................... 17
3.2.2 SPI Write Operations with 3- and 4-Wire
Modes.............................................................. 18
3.2.3 SPI Read Operations with 4-Wire Mode.......... 20
3.2.4 SPI Read Operations with 3-Wire Mode.......... 21
3.2.5 SPI Timing Specifications (4-wire mode)......... 21
3.2.6 SPI Timing Specifications (3-wire mode)......... 23
4 Modes of Operation...............................................................24
5 Functionality.......................................................................... 26
5.1 FIFO Data Buffer......................................................... 27
5.2 Rate Threshold Detection Function............................. 28
1.3
6 Register Descriptions............................................................ 30
6.1 0x00: STATUS.............................................................30
6.2 0x01–0x06: OUT_X_MSB, OUT_X_LSB,
OUT_Y_MSB, OUT_Y_LSB, OUT_Z_MSB,
OUT_Z_LSB................................................................ 31
6.3 0x07: DR_STATUS......................................................33
6.4 0x08: F_STATUS.........................................................35
6.5 0x09: F_SETUP...........................................................35
6.6 0x0A: F_EVENT.......................................................... 36
6.7 0x0B: INT_SOURCE_FLAG........................................ 37
6.8 0x0C: WHO_AM_I....................................................... 38
6.9 0x0D: CTRL_REG0..................................................... 38
6.10 0x0E: RT_CFG............................................................ 40
6.11 0x0F: RT_SRC............................................................ 41
6.12 0x10: RT_THS............................................................. 43
6.13 0x11: RT_COUNT....................................................... 44
6.14 0x12: TEMP................................................................. 44
6.15 0x13: CTRL_REG1......................................................45
6.16 0x14: CTRL_REG2......................................................47
6.17 0x15:CTRL_REG3.......................................................48
7 Printed Circuit Board Layout and Device Mounting.............. 50
7.1 Printed Circuit Board Layout........................................50
7.2 Overview of Soldering Considerations.........................51
7.3 Halogen Content..........................................................52
8 Package Information............................................................. 52
8.1 Product Identification Markings....................................52
8.2 Tape and Reel Information.......................................... 52
8.3 Package Description....................................................53
9 Revision History.................................................................... 55
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
3
Freescale Semiconductor, Inc.
General Description
1 General Description
1.1 Block Diagram
Charge
Pump
Drive Z
Drive X/Y
Self-Test
Programmable
32 Sample
FIFO
Buffer
Configuration
and Control
Registers
x,y,z
X+
Y+
Z+
Fd
Temperature
Sensor
Digital
Signal
Processing
X/Y Vibrating
Mass
Z Vibrating
Mass
MUX
C2V
LPF
Angular Rate
Demod
Gain
AAF
MUX
ADC-16
X-
Y-
Z-
Voltage References
and Regulators
Oscillators,
Clock
Generator
NVM,
Trim Logic
Digital I/O
I
2
C/SPI Interface
VDDIO
GND
VDD
INT
1
INT
2
/
SPI/I
2
C_B
PWR_CTRL
SCL/SCLK SDA/MOSI/ SA0/MISO
SPI_DATA
SPI_CS_B RST_B
Figure 1. Block Diagram
1.2 Pinout
RSVD_GND
RSVD_GND
RSVD_GND
RSVD_GND
21
GND1
INT2 /
PWR_CTRL
INT1
RST_B
GND2
RSVD_GND
RSVD_GND
24
1
2
3
4
5
6
7
8
23
22
RSVD_GND
20
19
18
17
16
15
14
13
GND4
V
DDIO
SPI_CS_B
VREGD
V
DD
GND3
SA0 /
MISO
9
10
11
12
I
2
C_B / SPI
RSVD_GND
RSVD_GND
SCL / SCLK
Figure 2. Device pinout (top view)
4
Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
SDA / MOSI
/ SPI_DATA
General Description
Table 1. Pin functions
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Name
GND1
INT2 / PWR_CTRL
1
INT1
RST_B
GND2
RSVD_GND
RSVD_GND
I
2
C_B / SPI
RSVD_GND
RSVD_GND
SCL/SCLK
SA0/MISO
GND3
V
DD
V
REGD
SPI_CS_B
V
DDIO
GND4
RSVD_GND
RSVD_GND
RSVD_GND
RSVD_GND
RSVD_GND
Ground
Interrupt Output 2 / Power state transition control input
Interrupt Output 1
Reset input, active low. Connect this pin to V
DDIO
if unused.
Ground
Reserved - Must be tied to ground
Reserved - Must be tied to ground
Digital interface selection pin. This pin must be tied high to select SPI interface
mode, or low to select I
2
C interface mode.
Reserved pin—must be tied to ground
Reserved pin—must be tied to ground
I
2
C / SPI clock
I
2
C address bit0 / SPI 4-wire Master In Slave Out
Ground
Supply voltage
Digital regulator output. Connect a 0.1 μF capacitor between this pin and ground
SPI chip select input, active low. This pin must be held logic high when operating
in I
2
C interface mode (I
2
C_B/SPI set to ground) to ensure correct operation.
Interface supply voltage
Ground
Reserved - Must be tied to ground
Reserved - Must be tied to ground
Reserved - Must be tied to ground
Reserved - Must be tied to ground
Reserved - Must be tied to ground
Function
SDA / MOSI / SPI_Data I
2
C data / SPI 4-wire Master Out Slave In / SPI 3-wire data In/Out
2
1. INT2/PWR_CTRL becomes a high-impedance input with weak internal pull-up resistor when
CTRLREG3[EXTCTRLEN]
= 1; the pull-up resistor is referenced to VDDIO.
2. MOSI becomes a bidirectional data pin when FXAS21002C is operated in 3-wire SPI mode with
CTRL_REG0[SPIW]=1.
1.3 System Connections
The FXAS21002C offers the choice of interfacing with a host processor through
either I
2
C or SPI interfaces.
Figure 3
and
Figure 4
show the recommended circuit
connections for implementing both interface options.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
5
Freescale Semiconductor, Inc.
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