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FS70VSJ-06F-A1

High-Speed Switching Use Nch Power MOS FET

器件类别:分立半导体    晶体管   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

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器件参数
参数名称
属性值
厂商名称
Renesas(瑞萨电子)
零件包装代码
TO-220S
包装说明
TO-220S, 3 PIN
针数
3
Reach Compliance Code
compliant
ECCN代码
EAR99
外壳连接
DRAIN
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
60 V
最大漏极电流 (Abs) (ID)
70 A
最大漏极电流 (ID)
70 A
最大漏源导通电阻
0.0083 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JESD-30 代码
R-PSSO-G2
元件数量
1
端子数量
2
工作模式
ENHANCEMENT MODE
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
极性/信道类型
N-CHANNEL
最大功率耗散 (Abs)
125 W
最大脉冲漏极电流 (IDM)
280 A
认证状态
Not Qualified
表面贴装
YES
端子形式
GULL WING
端子位置
SINGLE
晶体管应用
SWITCHING
晶体管元件材料
SILICON
Base Number Matches
1
文档预览
FS70VSJ-06F
High-Speed Switching Use
Nch Power MOS FET
REJ03G0265-0100
Rev.1.00
Aug.20.2004
Features
Drive voltage : 4 V
V
DSS
: 60 V
r
DS(ON) (max)
: 7.0 mΩ
I
D
: 70 A
Recovery Time of the Integrated Fast Recovery Diode (TYP.) : 70 ns
Outline
TO-220S
4
2, 4
1
1
2
3
1.
2.
3.
4.
Gate
Drain
Source
Drain
3
Applications
Motor control, lamp control, solenoid control, DC-DC converters, etc.
Maximum Ratings
(Tc = 25°C)
Parameter
Drain-source voltage
Gate-source voltage
Drain current
Drain current (Pulsed)
Avalanche current (Pulsed)
Source current
Source current (Pulsed)
Maximum power dissipation
Channel temperature
Storage temperature
Mass
Symbol
V
DSS
V
GSS
I
D
I
DM
I
DA
I
S
I
SM
P
D
Tch
Tstg
Ratings
60
±20
70
280
70
70
280
125
– 55 to +150
– 55 to +150
1.2
Unit
V
V
A
A
A
A
A
W
°C
°C
g
Conditions
V
GS
= 0 V
V
DS
= 0 V
L = 10
µH
Typical value
Rev.1.00, Aug.20.2004, page 1 of 6
FS70VSJ-06F
Electrical Characteristics
(Tch = 25°C)
Parameter
Drain-source breakdown voltage
Gate-source breakdown voltage
Drain-source leakage current
Gate-source leakage current
Gate-source threshold voltage
Drain-source on-state resistance
Drain-source on-state resistance
Drain-source on-state voltage
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Source-drain voltage
Thermal resistance
Reverse recovery time
Symbol
V
(BR)DSS
V
(BR)GSS
I
DSS
I
GSS
V
GS(th)
r
DS(ON)
r
DS(ON)
V
DS(ON)
| y
fs
|
Ciss
Coss
Crss
t
d(on)
t
r
t
d(off)
t
f
V
SD
Rth(ch-c)
t
rr
Min.
60
±20
1.0
Typ.
1.5
5.5
6.6
0.19
110
8500
1300
720
42
130
800
330
1.0
70
Max.
100
±10
2.0
7.0
8.3
0.25
1.5
1.0
Unit
V
V
µA
µA
V
mΩ
mΩ
V
S
pF
pF
pF
ns
ns
ns
ns
V
°C/W
ns
Test conditions
I
D
= 1 mA, V
GS
= 0 V
I
G
=
±100 µA,
V
DS
= 0 V
V
DS
= 60 V, V
GS
= 0 V
V
GS
=
±20
V, V
DS
= 0 V
I
D
= 1 mA, V
DS
= 10 V
I
D
= 35 A, V
GS
= 10 V
I
D
= 35 A, V
GS
= 4 V
I
D
= 35 A, V
GS
= 10 V
I
D
= 35 A, V
DS
= 10 V
V
DS
= 10 V, V
GS
= 0 V,
f = 1MHz
V
DD
= 30 V, I
D
= 35 A,
V
GS
= 10 V,
R
GEN
= R
GS
= 50
I
S
= 35 A, V
GS
= 0 V
Channel to case
I
S
= 70 A, dis/dt = –100 A/µs
Rev.1.00, Aug.20.2004, page 2 of 6
FS70VSJ-06F
Performance Curves
Drain Power Dissipation Derating Curve
150
Maximum Safe Operating Area
10
3
7
5
3
2
10
2
7
5
3
2
10
1
7
5
3
2
10
0
3
Drain Power Dissipation P
D
(W)
125
100
75
50
25
0
Drain Current I
D
(A)
tw = 10
µs
100
µs
1 ms
10 ms
100 ms
DC
5 7 10
1
2 3 5 7 10
2
Tc = 25°C
Single Pulse
5 7 10
0
2 3
0
50
100
150
200
Case Temperature Tc (°C)
Drain-Source Voltage V
DS
(V)
Output Characteristics (Typical)
100
Output Characteristics (Typical)
50
V
GS
=
10V
5V
40
4V
30
3V
Drain Current I
D
(A)
80
Drain Current ID (A)
3V
3.5V
2.5V
V
GS
= 10V
60
5V
4V
3.5V
P
D
= 125W
2.5V
40
20
20
10
Tc = 25°C
Pulse Test
0
0
0.4
0.8
1.2
1.6
2.0
0
0
0.2
0.4
0.6
Tc = 25°C
Pulse Test
0.8
1.0
Drain-Source Voltage V
DS
(V)
Drain-Source Voltage V
DS
(V)
Drain-Source On-State Resistance r
DS(ON)
(mΩ)
Drain-Source On-State Voltage V
DS(ON)
(V)
On-State Voltage vs.
Gate-Source Voltage (Typical)
1.0
On-State Resistance vs.
Drain Current (Typical)
10
Tc = 25°C
Pulse Test
Tc = 25°C
Pulse Test
8
0.8
V
GS
= 4V
6
0.6
I
D
= 100A
70A
10V
0.4
4
0.2
30A
2
0
10
0
2 3 5 7 10
1
2 3 5 7 10
2
2 3 5 7 10
3
0
0
2
4
6
8
10
Gate-Source Voltage V
GS
(V)
Drain Current I
D
(A)
Rev.1.00, Aug.20.2004, page 3 of 6
FS70VSJ-06F
Forward Transfer Admittance vs.
Drain Current (Typical)
Forward Transfer Admittance | yfs | (S)
10
3
7
V
DS
= 10V
5
Pulse Test
4
3
2
10
2
7
5
4
3
2
10
1
10
0
Transfer Characteristics (Typical)
200
Drain Current I
D
(A)
160
Tc = 25°C
V
DS
= 10V
Pulse Test
120
Tc = 25°C
80
75°C
125°C
40
0
0
2
4
6
8
10
2 3 4 5 7 10
1
2 3 4 5 7 10
2
Gate-Source Voltage V
GS
(V)
Capacitance vs.
Drain-Source Voltage (Typical)
3
2
Drain Current I
D
(A)
Switching Characteristics (Typical)
10
3
7
5
4
3
2
tr
Capacitance (pF)
10
4
7
5
3
2
10
3
7
5
Ciss
Switching Time (ns)
Tch = 25°C
f = 1MHz
V
GS
= 0V
td(off)
tf
Coss
Crss
3
10
–1
2 3 5 710
0
2 3 5 7 10
1
2 3 5 7 10
2
10
2
7
5
td(on)
4
3
Tch = 25°C
2
V
DD
= 30V
V
GS
= 10V
R
GEN
= R
GS
= 50Ω
10
1
10
0
2 3 4 5 7 10
1
2 3 4 5 7 10
2
Drain-Source Voltage V
DS
(V)
Drain Current I
D
(A)
Gate-Source Voltage vs.
Gate Charge (Typical)
10
100
Source-Drain Diode Forward
Characteristics (Typical)
V
GS
= 0V
Pulse Test
Gate-Source Voltage V
GS
(V)
Tch = 25°C
I
D
= 70A
Source Current I
S
(A)
8
80
Tc = 125°C
60
6
V
DS
= 10V
20V
4
40
40V
2
75°C
25°C
20
0
0
40
80
120
160
200
0
0
0.4
0.8
1.2
1.6
2.0
Gate Charge Qg (nC)
Source-Drain Voltage V
SD
(V)
Rev.1.00, Aug.20.2004, page 4 of 6
FS70VSJ-06F
On-State Resistance vs.
Channel Temperature (Typical)
10
1
7
V
GS
= 10V
5
I
D
= 35A
4
Pulse Test
3
2
10
0
7
5
4
3
2
10
–1
–50
0
50
100
150
Drain-Source On-State Resistance r
DS(ON)
(25°C)
Drain-Source On-State Resistance r
DS(ON)
(t°C)
Gate-Source Threshold Voltage V
GS(th)
(V)
Threshold Voltage vs.
Channel Temperature (Typical)
4.0
V
DS
= 10V
I
D
= 1mA
3.2
2.4
1.6
0.8
0
–50
0
50
100
150
Channel Temperature Tch (°C)
Channel Temperature Tch (°C)
Drain-Source Breakdown Voltage V
(BR)DSS
(t°C)
Drain-Source Breakdown Voltage V
(BR)DSS
(25°C)
Transient Thermal Impedance Zth(ch-c) (°C/W)
Breakdown Voltage vs.
Channel Temperature (Typical)
1.4
Transient Thermal Impedance Characteristics
10
1
7
5
3
2
V
GS
= 0V
I
D
= 1mA
1.2
1.0
0.8
D = 1.0
10
0
7
0.5
5
3
0.2
2
0.1
P
DM
tw
T
0.6
0.05
10
–1
0.02
7
5
0.01
3
Single Pulse
2
D = tw
T
0.4
–50
0
50
100
150
10
–2
10
–4
2 3 5 710
–3
2 3 5 7 10
–2
2 3 5 7 10
–1
2 3 5 7 10
0
2 3 5 7 10
1
Channel Temperature Tch (°C)
Pulse Width tw (s)
Switching Time Measurement Circuit
Vin Monitor
D.U.T.
R
L
Vin
Vout
R
GS
V
DD
Vout
Monitor
Switching Waveform
90%
R
GEN
10%
10%
10%
90%
td(on)
tr
90%
td(off)
tf
Rev.1.00, Aug.20.2004, page 5 of 6
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参数对比
与FS70VSJ-06F-A1相近的元器件有:FS70VSJ-06F、FS70VSJ-06F-T11。描述及对比如下:
型号 FS70VSJ-06F-A1 FS70VSJ-06F FS70VSJ-06F-T11
描述 High-Speed Switching Use Nch Power MOS FET High-Speed Switching Use Nch Power MOS FET High-Speed Switching Use Nch Power MOS FET
厂商名称 Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子)
零件包装代码 TO-220S TO-220S TO-220S
包装说明 TO-220S, 3 PIN SMALL OUTLINE, R-PSSO-G2 TO-220S, 3 PIN
针数 3 3 3
Reach Compliance Code compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99
外壳连接 DRAIN DRAIN DRAIN
配置 SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 60 V 60 V 60 V
最大漏极电流 (Abs) (ID) 70 A 70 A 70 A
最大漏极电流 (ID) 70 A 70 A 70 A
最大漏源导通电阻 0.0083 Ω 0.0083 Ω 0.0083 Ω
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 代码 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2
元件数量 1 1 1
端子数量 2 2 2
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 150 °C 150 °C 150 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
极性/信道类型 N-CHANNEL N-CHANNEL N-CHANNEL
最大功率耗散 (Abs) 125 W 125 W 125 W
最大脉冲漏极电流 (IDM) 280 A 280 A 280 A
认证状态 Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES
端子形式 GULL WING GULL WING GULL WING
端子位置 SINGLE SINGLE SINGLE
晶体管应用 SWITCHING SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON SILICON
Base Number Matches 1 1 1
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