型号
  • 型号
  • 关键词
首页 > 器件类别 > 存储

FT25H16S-RT

IC FLASH 16M SPI 120MHZ 8SOP

器件类别：存储   

厂商名称：Fremont_Micro_Devices_USA

器件标准：

下载文档
参数 预览 参数对比
器件参数
参数名称
属性值
存储器类型
非易失
存储器格式
闪存
技术
FLASH
存储容量
16Mb （2M x 8）
时钟频率
120MHz
写周期时间 - 字，页
2.4ms
存储器接口
SPI
电压 - 电源
2.7 V ~ 3.6 V
工作温度
-40°C ~ 85°C（TA）
安装类型
表面贴装
封装/外壳
8-SOIC（0.154"，3.90mm 宽）
供应商器件封装
8-SOP
文档预览
Fremont Micro Devices
Preliminary FT25H16
FM
© 2014 Fremont Micro Devices Inc.
D
C
Confidential Rev1.1
on
DS25H16-page1
fid
FT25H16
DATASHEET
en
tia
l
Fremont Micro Devices
Preliminary FT25H16
CONTENTS
1. FEATURES ................................................................................................................................................. 4
2. GENERAL DESCRIPTION ......................................................................................................................... 6
3. MEMORY ORGANIZATION ....................................................................................................................... 8
4. DEVICE OPERATION ................................................................................................................................ 9
5. DATA PROTECTION ................................................................................................................................10
6. STATUS REGISTER ................................................................................................................................12
7.1. W
RITE
E
NABLE
(WREN) (06H) ...............................................................................................................18
7.2. W
RITE
D
ISABLE
(WRDI) (04H) ...............................................................................................................18
7.3. R
EAD
S
TATUS
R
EGISTER
(RDSR) (05H
OR
35H).....................................................................................18
7.5. R
EAD
D
ATA
B
YTES
(READ) (03H)...........................................................................................................19
7.6. R
EAD
D
ATA
B
YTES
A
T
H
IGHER
S
PEED
(F
AST
R
EAD
) (0BH) .......................................................................20
7.7. D
UAL
O
UTPUT
F
AST
R
EAD
(3BH) ............................................................................................................20
7.8. Q
UAD
O
UTPUT
F
AST
R
EAD
(6BH) ...........................................................................................................21
7.9. D
UAL
I/O F
AST
R
EAD
(BBH) ...................................................................................................................22
7.10. Q
UAD
I/O F
AST
R
EAD
(EBH).................................................................................................................23
7. 12. P
AGE
P
ROGRAM
(PP) (02H) ................................................................................................................25
7. 13.Q
UAD
P
AGE
P
ROGRAM
(QPP) (32H).....................................................................................................26
7.15. 32KB B
LOCK
E
RASE
(BE) (52H)...........................................................................................................28
7.16. 64KB B
LOCK
E
RASE
(BE) (D8H) ..........................................................................................................28
7.17. C
HIP
E
RASE
(CE) (60/C7H) .................................................................................................................29
7.18. D
EEP
P
OWER
-D
OWN
(DP) (B9H) .........................................................................................................29
7.19. R
ELEASE FROM
D
EEP
P
OWER
-D
OWN
A
ND
R
EAD
D
EVICE
ID (RDI) (ABH) ...............................................30
7.14. S
ECTOR
E
RASE
(SE) (20H) ..................................................................................................................27
FM
7.20. R
EAD
M
ANUFACTURE
ID/ D
EVICE
ID (REMS) (90H) ..............................................................................31
7.21. R
EAD
I
DENTIFICATION
(RDID) (9FH) .....................................................................................................32
7.22. H
IGH
S
PEED
M
ODE
(HSM) (A3H) .........................................................................................................32
7.23. C
ONTINUOUS
R
EAD
M
ODE
R
ESET
(CRMR) (FFH) .................................................................................33
7.24. P
ROGRAM
/E
RASE
S
USPEND
(PES) (75H) .............................................................................................33
7.25. P
ROGRAM
/E
RASE
R
ESUME
(PER) (7AH) ..............................................................................................34
7.26. E
RASE
S
ECURITY
R
EGISTERS
(44H) .....................................................................................................34
7.27. P
ROGRAM
S
ECURITY
R
EGISTERS
(42H) ................................................................................................35
7.28. R
EAD
S
ECURITY
R
EGISTERS
(48H) .......................................................................................................36
8. ELECTRICAL CHARACTERISTICS ........................................................................................................37
8.1. P
OWER
-
ON
T
IMING
.................................................................................................................................37
8.2. I
NITIAL
D
ELIVERY
S
TATE
........................................................................................................................37
8.3. D
ATA
R
ETENTION AND
E
NDURANCE
.........................................................................................................37
© 2014 Fremont Micro Devices Inc.
Confidential Rev1.1
DS25H16-page2
D
C
on
7.11. Q
UAD
I/O W
ORD
F
AST
R
EAD
(E7H).......................................................................................................24
fid
en
7.4. W
RITE
S
TATUS
R
EGISTER
(WRSR) (01H) ...............................................................................................19
tia
l
7. COMM ANDS DESCRIPTION..................................................................................................................14
Fremont Micro Devices
Preliminary FT25H16
8.4. L
ATCH UP
C
HARACTERISTICS
..................................................................................................................37
8.5. A
BSOLUTE
M
AXIMUM
R
ATINGS
................................................................................................................38
8.6. C
APACITANCE
M
EASUREMENT
C
ONDITION
...............................................................................................38
8.7. DC C
HARACTERISTICS
............................................................................................................................39
8.8. AC C
HARACTERISTICS
............................................................................................................................40
9. ORDERING INFORMATION ....................................................................................................................42
10. PACKAGE INFORMATION ....................................................................................................................43
10.1.P
ACKAGE
SOP8 150MIL .......................................................................................................................43
10.2. P
ACKAGE
SOP8 208MIL ......................................................................................................................44
10.3. P
ACKAGE
DIP8 300MIL .......................................................................................................................45
10.5. P
ACKAGE
TSSOP8 173MIL .................................................................................................................47
11. REVISION HISTORY ..............................................................................................................................48
FM
© 2014 Fremont Micro Devices Inc.
D
C
Confidential Rev1.1
on
DS25H16-page3
fid
en
tia
l
10.4. P
ACKAGE
VSOP8 208MIL....................................................................................................................46
Fremont Micro Devices
Preliminary FT25H16
1. FEATURES
16M -bit Serial Flash
2048K-byte
256 bytes per programmable page
Standard, Dual, Quad SPI
Standard SPI: SCLK, CS#, SI, SO, WP#, HOLD#
Dual SPI: SCLK, CS#, IO0, IO1, WP#, HOLD#
Quad SPI: SCLK, CS#, IO0, IO1, IO2, IO3
High Speed Clock Frequency
120MHz for fast read with 30PF load
Dual I/O Data transfer up to 240Mbits/s
Quad I/O Data transfer up to 480Mbits/s
Program/Erase Speed
Page Program time: 0.4ms typical
Sector Erase time: 120ms typical
Block Erase time: 0.2/0.4s typical
Chip Erase time: 10s typical
Flexible Architecture
Sector of 4K-byte
Block of 32/64k-byte
Low Power Consumption
5uA maximum power down current
FM
Software/Hardware Write Protection
Write protect all/portion of memory via software
Enable/Disable protection with WP# Pin
Top or Bottom, Sector or Block selection
Advanced security Features
4*256-Byte Security Registers With OTP Lock
Single Power Supply Voltage: Full voltage range:2.7~3.6V
Minimum 100,000 Program/Erase Cycle
© 2014 Fremont Micro Devices Inc.
D
20mA maximum active current
C
Confidential Rev1.1
on
DS25H16-page4
fid
en
tia
l
Fremont Micro Devices
Hardware Features
8-pin SOP8 (150mil)
8-pin SOP8 (208mil)
8-pin DIP8 (300mil)
8-pin VSOP8 (200mil)
8-pin TSSOP8 (173mil)
Preliminary FT25H16
FM
© 2014 Fremont Micro Devices Inc.
D
C
Confidential Rev1.1
on
DS25H16-page5
fid
en
tia
l
查看更多>
参数对比
与FT25H16S-RT相近的元器件有：FT25H16T-RB。描述及对比如下：
型号 FT25H16S-RT FT25H16T-RB
描述 IC FLASH 16M SPI 120MHZ 8SOP IC FLASH 16M SPI 120MHZ 8TSSOP
存储器类型 非易失 非易失
存储器格式 闪存 闪存
技术 FLASH FLASH
存储容量 16Mb （2M x 8） 16Mb （2M x 8）
时钟频率 120MHz 120MHz
写周期时间 - 字，页 2.4ms 2.4ms
存储器接口 SPI SPI
电压 - 电源 2.7 V ~ 3.6 V 2.7 V ~ 3.6 V
工作温度 -40°C ~ 85°C（TA） -40°C ~ 85°C（TA）
安装类型 表面贴装 表面贴装
封装/外壳 8-SOIC（0.154"，3.90mm 宽） 8-TSSOP（0.173"，4.40mm 宽）
供应商器件封装 8-SOP 8-TSSOP
热门器件
热门资源推荐
[零基础一周学会PIC单片机视频教程].5-1至5-5 MAX2648 邮件的MIME编码和解码包 机械设计 S3C2410的底层Bootloader的测试程序 Borland c++ builder串口通讯源码示例程序 长虹C2593-1 PCBDESIGNQA100 PC机（上位机）与MSP430单片机串行通信的实现方法 零死角玩转stm32-中级篇
ULINK2调试问题 TI DSP simulator 种类选择 关于data flash的使用出现的问题 MSP430FR6043 超声波感应评估模块 跪求PCB封装 #AI挑战营终点站#在LuckFox Pico Pro/Max上初步实现手写数字识别 教你如何辨别MID的真假？ 【TI DLP创意征集】+世界杯解说投影 电子商务：未来的路该怎么走 这些储能术语，你了解吗？
简洁的过零调功器电路设计与分析 单稳态控制电路设计与分析 光控电路设计与分析 永不缺相启动运行的电动机控制电路 IGBT模块通过控制门极阻断过电流 MT3608构成3.7V转12V的升压电路图 运算放大器IC741的基本工作原理及在电路中的实现方式 比较常见的功率整流器和滤波电路 一个简单的红外耳机电路 基于TDA1554的立体声放大器电路
器件捷径:
S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY
需要登录后才可以下载。
登录取消