Intel
®
80219 General Purpose PCI
Processor Datasheet
Extended Temperature Support
Product Features
■
■
■
■
Core Features
— Integrated Intel XScale
®
Core
— ARM* V5T Instruction Set
— ARM V5E DSP Extensions
— 400 MHz and 600 MHz
— Write Buffer, Write-back Cache
PCI Bus Interface
—
PCI Local Bus Specification,
Rev. 2.2
compliant
—
PCI-X Addendum to the PCI Local Bus
Specification,
Rev. 1.0a
— 64-bit/66 MHz Operation in PCI Mode
—64-bit/133 MHz Operation in PCI-X
Mode
— Support 32-bit PCI Initiators and Targets
— Four Split Read Requests as Initiator
— Eight Split Read Requests as Target
— 64-bit Addressing Support
Memory Controller
—PC200 Double Data Rate (DDR) SDRAM
— Up to 1 Gbyte of 64-bit DDR SDRAM
— Up to 512 Mbytes of 32-bit DDR
SDRAM
— Single-bit Error Correction, Multi-bit
Support (ECC)
— 1024-byte Posted Memory Write Queue
— 40- and 72-bit wide Memory Interface
Address Translation Unit
— 2 Kbyte or 4 Kbyte Outbound Read
Queue
— 4 Kbyte Outbound Write Queue
— 4 Kbyte Inbound Read and Write Queue
—Connects Internal Bus to PCI/PCI-X Bus
■
■
■
■
■
■
■
DMA Controller
— Two Independent Channels Connected
to Internal Bus
— Up to 1064 Mbytes/s Burst Support in
PCI-X Mode
— Up to 1600 Mbytes/s Burst Support for
Internal Bus
— Two 1-Kbyte Queues in Ch-0 and Ch-1
— 2
32
Addressing Range on Internal Bus
Interface
— 2
64
Addressing Range on PCI Interface
I
2
C Bus Interface Units
— Two Separate I
2
C Units
— Serial Bus
— Master/Slave Capabilities
— System Management Functions
Peripheral Performance Monitoring Unit
— One Dedicated Global Time Stamp
Counter
— Fourteen Programmable Event Counters
— Three Control/Status Registers
Timers
— Two Dual-programmable 32-bit Timers
— Watchdog Timer
544-Ball, Plastic Ball Grid Array (PBGA)
Eight General Purpose I/O Pins
Intel
®
80219 General Purpose PCI
Processor can operate at an ambient
temperature of 0° to 85°C
Document Number: 270418-001
November 2003
Intel
®
80219 General Purpose PCI Processor Datasheet
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The Intel
®
80219 General Purpose PCI Processor may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Intel
®
internal code names are subject to change.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling
1-800-548-4725 or by visiting Intel's website at http://www.intel.com.
Copyright© Intel Corporation, 2003
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*Other names and brands may be claimed as the property of others.
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November 2003
Extended Temperature Support
Intel
®
80219 General Purpose PCI Processor Datasheet
Contents
1.0
Introduction......................................................................................................................... 7
1.1
About This Document............................................................................................7
1.1.1 Terminology..............................................................................................7
1.1.2 Other Relevant Documents ...................................................................... 8
About the Intel
®
80219 General Purpose PCI Processor ...................................... 9
1.2
2.0
Features ...........................................................................................................................11
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Internal Bus ......................................................................................................... 11
DMA Controller.................................................................................................... 11
Address Translation Unit .....................................................................................12
Messaging Unit.................................................................................................... 12
Memory Controller............................................................................................... 12
Peripheral Bus Interface...................................................................................... 12
Performance Monitoring Unit............................................................................... 13
I
2
C Bus Interface Units ........................................................................................ 13
3.0
Package Information ........................................................................................................14
3.1
Package Introduction........................................................................................... 14
3.1.1 Functional Signal Definitions ..................................................................14
3.1.2 544-Lead PBGA Package ...................................................................... 25
Package Thermal Specifications .........................................................................39
3.2.1 Thermal Specifications ........................................................................... 39
3.2.1.1 Ambient Temperature................................................................ 39
3.2.1.2 Case Temperature .................................................................... 39
3.2.1.3 Thermal Resistance ..................................................................39
3.2.2 Thermal Analysis .................................................................................... 40
Socket Information .............................................................................................. 41
3.3.1 Socket-Header Vendor........................................................................... 41
3.3.2 Burn-in Socket Vendor ........................................................................... 41
3.3.3 Shipping Tray Vendor............................................................................. 41
3.3.4 Logic Analyzer Interposer Vendor .......................................................... 41
3.3.5 JTAG Emulator Vendor .......................................................................... 42
3.3.6 Heat Sink Vendor .................................................................................. 42
3.2
3.3
4.0
Electrical Specifications.................................................................................................... 43
4.1
4.2
4.3
4.4
Absolute Maximum Ratings................................................................................. 43
V
CCPLL
Pin Requirements ................................................................................... 43
Targeted DC Specifications................................................................................. 44
Targeted AC Specifications................................................................................. 46
4.4.1 Clock Signal Timings ..............................................................................46
4.4.2 PCI Interface Signal Timings ..................................................................47
4.4.3 DDR SDRAM Interface Signal Timings .................................................. 48
4.4.4 Peripheral Bus Interface Signal Timings ................................................ 48
4.4.5 I
2
C Interface Signal Timings................................................................... 49
4.4.6 Boundary Scan Test Signal Timings ...................................................... 50
AC Timing Waveforms ........................................................................................ 51
AC Test Conditions ............................................................................................. 55
4.5
4.6
Extended Temperature Support
November 2003
3
Intel
®
80219 General Purpose PCI Processor Datasheet
Figures
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
Intel
®
80219 General Purpose PCI Processor
Functional Block Diagram ................................................................................... 10
544-Lead PBGA Package (Top View)................................................................. 25
544-Lead PBGA Package (Bottom View) ........................................................... 26
Ball Map - Left Side - Top View........................................................................... 27
Ball Map - Right Side - Top View ........................................................................ 28
Thermocouple Attachment - No Heatsink ........................................................... 39
V
CCPLL
Lowpass Filter ........................................................................................ 43
Clock Timing Measurement Waveforms ............................................................. 51
Output Timing Measurement Waveforms ........................................................... 51
Input Timing Measurement Waveforms .............................................................. 52
I
2
C Interface Signal Timings................................................................................ 52
DDR SDRAM Write Timings ............................................................................... 53
DDR SDRAM Read Timings ............................................................................... 54
AC Test Load for all Signals Except PCI and DDR SDRAM ............................... 55
PCI/PCI-X TOV(max) Rising Edge AC Test Load............................................... 55
PCI/PCI-X TOV(max) Falling Edge AC Test Load .............................................. 55
PCI/PCI-X TOV(min) AC Test Load .................................................................... 56
PCI_RST# vs. PWRDELAY Timings During Power-Up ...................................... 56
PCI_RST# vs. PWRDELAY Timings During Power-Down ................................. 56
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November 2003
Extended Temperature Support
Intel
®
80219 General Purpose PCI Processor Datasheet
Tables
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Related Documentation......................................................................................... 8
Pin Description Nomenclature............................................................................. 14
DDR SDRAM Signals ..........................................................................................15
Peripheral Bus Interface Signals .........................................................................16
PCI Bus Signals .................................................................................................. 19
Miscellaneous Signals......................................................................................... 21
Pin Mode Behavior .............................................................................................. 23
544-Lead PBGA Package - Alphabetical Ball Listing .......................................... 29
544-Lead PBGA Package - Alphabetical Signal Listing ...................................... 34
544-Lead PBGA Package Thermal Characteristics ............................................ 40
Socket-Header Vendor........................................................................................ 41
Burn-in Socket Vendor ........................................................................................ 41
Shipping Tray Vendor..........................................................................................41
Logic Analyzer Interposer Vendor .......................................................................41
Logic Analyzer Interposer Vendor .......................................................................42
Heat Sink Vendor ................................................................................................ 42
Operating Conditions........................................................................................... 43
DC Characteristics .............................................................................................. 44
I
CC
Characteristics .............................................................................................. 45
Clock Timings...................................................................................................... 46
PCI Signal Timings.............................................................................................. 47
DDR SDRAM Signal Timings ..............................................................................48
Peripheral Bus Signal Timings ............................................................................ 48
I
2
C Signal Timings............................................................................................... 49
Boundary Scan Test Signal Timings ................................................................... 50
DAT Mode Timings.............................................................................................. 50
Bypass Mode Timings ......................................................................................... 50
AC Measurement Conditions ..............................................................................55
Extended Temperature Support
November 2003
5
