F-203-1
GFZDL–20–10–05.00
GFZDL– 30–10–05.00
SOLDERLESS DATA LINK
GFZDL SERIES
SPECIFICATIONS
For complete specifications
see www.samtec.com?GFZDL
Insulator Material:
Liquid Crystal Polymer
Contact Material:
BeCu
Plating:
30µ" (0,76µm) Gold
over 50µ" (1,27µm) Nickel
Cable:
1 oz. rolled annealed copper
Base Film:
1 mil Polyimide
Adhesive:
FR (DuPont)
Stiffener:
FR-4 glass epoxy
CONTACT
Dual spring
action for
TM
solderless
connection
Ideal for test probes
and other temporary
connections
(1,27mm x 1,27mm)
.050" x .050"
pitch grid array
Polarized
alignment pin
APPLICATION
SPECIFIC OPTIONS
Other sizes available.
Call Samtec.
Note:
Some lengths,
styles and options are
non-standard, non-returnable.
Processing:
Suggested PCB Layouts:
For reference only. Please
contact Samtec or go to
www.samtec.com?GFZDL
for recommended PCB layout.
(8,81)
.150
(11,43)
.450
01
(1,63)
.064
DIA
GFZDL
POSITIONS
PER ROW
NO. OF
ROWS
OVERALL
LENGTH
–10
–20
(127,00)
5.00
(100,33)
3.95
–05.00
= (127,0mm)
5.00"
= Ten
Rows
(4,45)
.175
No. of positions x (1,27) .050 + (6,91) .272
See GFZ for
specifications
(9,14)
.360
(1,27)
.050
(12,50)
.492
(4,06)
.160
(5,72)
.225
(1,27)
.050
01
(0,79) .031
DIA
SOLDER
MASK
01
(0,25)
.010
TRACE
See GFZ for
specifications
(0,64)
.025 DIA (0,53)
PAD
.021
(0,31).012
DIA VIA
Due to technical progress, all designs, specifications and components are subject to change without notice.
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