Only Reflow Soldering
Water Repellent Chip Multilayer Ceramic Capacitors for General Purpose
GXM1555C1E6R0DA02_ (0402, C0G:EIA, 6pF, DC25V)
_: packaging code
1.Scope
This product specification is applied to Water Repellent Chip Multilayer Ceramic Capacitors used for General Electronic equipment.
This product is applied for Only Reflow Soldering.
Reference Sheet
2.MURATA Part NO. System
(Ex.)
GXM
15
(1)L/W
Dimensions
5
(2)T
Dimensions
5C
(3)Temperature
Characteristics
1E
(4)Rated
Voltage
6R0
(5)Nominal
Capacitance
D
(6)Capacitance
Tolerance
A02
(7)Murata’s Control
Code
D
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
1.0±0.05
(1)-2 W
0.5±0.05
(2) T
0.5±0.05
e
0.15 to 0.35
(Unit:mm)
g
0.3 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
0±30 ppm/°C
25 to 125 °C
(25 °C)
DC 25 V
6 pF
±0.5 pF
-55 to 125 °C
5.Package
mark
D
W
J
(8) Packaging
f180mm
Reel
PAPER W8P2
f180mm
Reel
PAPER W8P1
f330mm
Reel
PAPER W8P2
Packaging Unit
10000 pcs./Reel
20000 pcs./Reel
50000 pcs./Reel
Product specifications in this catalog are as of Oct.4,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GXM1555C1E6R0DA02-01
1
■
Specifications and Test Methods
No
1
Item
Rated Voltage
Shown in Rated value.
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
V
P-P
or V
O-P
, whichever is larger, should be maintained
within the rated voltage range.
2
3
4
Appearance
Dimension
Voltage proof
No defects or abnormalities.
Within the specified dimensions.
No defects or abnormalities.
Visual inspection.
Using Measuring instrument of dimension.
Measurement Point
Test Voltage
Applied Time
: Between the terminations
: 300% of the rated voltage
: 1s to 5 s
Charge/discharge current : 50mA max.
5
Insulation Resistance(I.R.)
C≦0.047µF:More than 10000MΩ
C＞0.047µF:More than 500Ω·F
C:Nominal Capacitance
Measurement Point
: Between the terminations
Measurement Voltage :
Charging Time
DC Rated Voltage
: 2 min
Charge/discharge current : 50mA max.
Measurement Temperature : Room Temperature
6
Capacitance
Shown in Rated value.
Measurement Temperature : Room Temperature
7
Q
30pF and over:Q≧1000
30pF and below:Q≧400+20C
C:Nominal Capacitance(pF)
Capacitance
C≦10μF
C＞10μF
Frequency
1.0+/-0.1kHz
120+/-24Hz
Voltage
1.0+/-0.2Vrms
0.5+/-0.1Vrms
8
Temperature
Characteristics
of Capacitance
No bias
Nominal values of the temperature coefficient is shown in Rated value. The capacitance change should be measured after 5 min
at each specified temp. stage.
But,the Capacitance Change under 25℃ is shown in Table A.
Capacitance Drift
Within +/-0.2% or +/-0.05pF
(Whichever is larger.)
The capacitance drift is calculated by dividing the differences
between the maximum and minimum measured values in the
step 1,3 and 5 by the cap. value in step 3.
Step
1
2
3
4
5
Temperature(C)
Reference Temp.+/-2
Min. Operating Temp.+/-3
Reference Temp.+/-2
Max. Operating Temp.+/-3
Reference Temp.+/-2
Capacitance value as a reference is the value in step 3.
· Measurement Voltage : Less than 1.0Vrms
(Refer to the individual data sheet)
9
Adhesive Strength
of Termination
No removal of the terminations or other defect
should occur.
Solder the capacitor on the test substrate shown in Fig.3.
Type
GXM15/GXM18
GXM21/GXM31/GXM32
Applied Force(N)
5
10
Holding Time
: 10+/-1s
the capacitor side.
Applied Direction : In parallel with the test substrate and vertical with
10 Vibration
Appearance
Capacitance
No defects or abnormalities.
Within the specified initial value.
Total amplitude
Q
11 Substrate
Bending test
Capacitance
Change
12 Solderability
Within +/-5% or +/-0.5pF
(Whichever is larger)
95% of the terminations is to be soldered evenly and continuously.
Appearance
Within the specified initial value.
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Kind of Vibration
: A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
: 1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
Solder the capacitor on the test substrate shown in Fig.1.
Pressurization method : Shown in Fig.2
Flexure
Holding Time
Soldering Method
Test Method
Flux
Preheat
Solder
Solder Temp.
Immersion time
:
1mm
:
5+/-1s
: Reflow soldering
: Solder bath method
Solution of rosin ethanol 25(mass)%
: 80℃ to 120℃ for 10s to 30s
: Sn-3.0Ag-0.5Cu
: 245+/-5℃
: 2+/-0.5s
JEMCGS-05877
2
No
13 Resistance to
Item
Appearance
Capacitance
Change
Q
I.R.
No defects or abnormalities.
Within +/-2.5% or +/- 0.25pF
(Whichever is larger)
Specification
Test Method
Solder
Solder Temp.
Immersion time
Exposure Time
Within the specified initial value.
Within the specified initial value.
Preheat
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
: Solder bath method
: Sn-3.0Ag-0.5Cu
: 270+/-5℃
: 10+/-0.5s
: 24+/-2h
: GXM31 size max.: 120℃ to 150℃ for 1 min
GXM32 size
: 100℃ to 120℃ for 1 min
and 170℃ to 200℃ for 1 min
Soldering Heat
Voltage proof No defects.
14 Temperature
Sudden Change
Capacitance
Change
Q
Within +/-2.5% or +/- 0.25pF
(Whichever is larger)
Within the specified initial value.
Perform the five cycles according to the four heat treatments
shown in the following table.
Step
1
2
Temp.(C)
Min.Operating Temp.+0/-3
Room Temp.
Max.Operating Temp.+3/-0
Room Temp
Time (min)
30+/-3
2 to 3
30+/-3
2 to 3
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
I.R.
Within the specified initial value.
3
4
Voltage proof No defects.
Exposure Time
15 High
Temperature
High Humidity
(Steady)
Capacitance
Change
Q
Within +/-7.5% or +/-0.75pF
(Whichever is larger)
30pF and over:Q≧200
30pF and below :Q≧100+10C/3
C:Nominal Capacitance(pF)
I.R.
16 Durability
Appearance
Capacitance
Change
Q
More than 500MΩ or 25Ω·F (Whichever is smaller)
No defects or abnormalities.
Within +/-3% or +/-0.3pF
(Whichever is larger)
30pF and over:Q≧350
10pF and over
30pF and below : Q≧275+5C/2
10pF and below : Q≧200+10C
C:Nominal Capacitance (pF)
I.R.
More than 1,000MΩ or 50Ω·F (Whichever is smaller)
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
Test Time
Test Voltage
Exposure Time
: Max. Operating Temp. +/-3℃
: 1000+/-12h
: 200% of the rated voltage
: 24+/-2h
Test Temperature
Test Humidity
Test Time
Test Voltage
Exposure Time
: 40+/-2℃
: 90%RH to 95%RH
: 500+/-12h
: DC Rated Voltage
: 24+/-2h
Appearance
No defects or abnormalities.
: 24+/-2h
Solder the capacitor on the test substrate shown in Fig.3.
Charge/discharge current : 50mA max.
Charge/discharge current : 50mA max.
No
17 Water
Repellency
Item
Ink Adhesion
Area
Specification
maximum 20% of the LW surface gross area
Test Method
After paint with water-based pen to the LW surface of capacitor,
binarize the surface and calculate the ratio of the ink adhesion
area to the LW surface.
Table A
Char.
5C
7U
Max.
0.58
8.78
-55C
Capacitance Change from 25C (%)
-30C
-10C
Min.
Max.
Min.
Max.
Min.
-0.24
0.40
-0.17
0.25
-0.11
5.04
6.04
3.47
3.84
2.21
JEMCGS-05877
3
Substrate Bending test
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GXM15: t:0.8mm)
Copper foil thickness : 0.035mm
:
Solder resist
(Coat with heat resistant resin for solder)
Land
f4.5
*1,2：2.0±0.05
4.0±0.1
＊1
Type
GXM15
GXM18
GXM21
GXM31
GXM32
a
100
a
0.4
1.0
1.2
2.2
2.2
Dimension (mm)
b
1.5
Ａ
3.0
4.0
5.0
5.0
Ｂ
φ1.5
+0.1
-0
＊2
c
0.5
1.2
1.65
2.0
0.05以下
2.9
3.5±0.05
40
c
c
1.75±0.1
8.0±0.3
b
t
Fig.1
Kind of Solder
・Test
substrate : Sn-3.0Ag-0.5Cu
Pressurization
・Test
substrate method
(in mm)
20
50 min.
Pressurization
speed
1.0mm/s
tor
R5
Pressurize
Support
Capacitance meter
45
45
Flexure
Fig.2
(in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, High Temperature High Humidity(Steady) , Durability
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
Kind of Solder
・Test
substrate : Sn-3.0Ag-0.5Cu
Land Dimensions
・Test
substrate
Chip Capacitor
Land
Type
c
b
a
Solder Resist
GXM15
GXM18
GXM21
GXM31
GXM32
Fig.3
a
0.4
1.0
1.2
2.2
2.2
Dimension (mm)
b
1.5
3.0
4.0
5.0
5.0
c
0.5
1.2
1.65
2.0
2.9
JEMCGS-05877
4
Package
GXM Type
1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
φ180mm reel
Type
Paper Tape
Code:D/E
5 (LWT Dimensions Tolerance:
less
than ±0.05)
GXM15
5 (LWT Dimensions Tolerance:±0.1min.)
5 (LW Dimensions Tolerance:±0.1min.
and T Dimensions Tolerance:±0.05)
GXM18
6
GXM21
9
A/B
GXM31
M/X
C
M
GXM32
N
C
R/D/E
10000(W8P2)
10000(W8P2)
10000(W8P2)
4000
4000
4000
3000
3000
3000
2000
3000
2000
2000
1000
Code:W
20000(W8P1)
Plastic Tape
Code:L
φ330mm reel
Paper Tape
Code:J/ F
50000(W8P2)
40000(W8P2)
50000(W8P2)
10000
10000
10000
10000
10000
10000
6000
10000
8000
6000
4000
Plastic Tape
Code:K
JEMCGP-04248A
5
