HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6422
Issued Date : 1992.11.25
Revised Date : 2001.06.15
Page No. : 1/3
HBC556
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HBC556 is primarily intended for use in driver stage of audio
amplifiers.
Features
•
High Breakdown Voltage: 65V at IC=1mA
•
High AC Current Gain: 75-500 at IC=2mA,VCE=5V,f=1MHz
Absolute Maximum Ratings
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature ................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ............................................................................... 500 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ....................................................................................... -80 V
VCEO Collector to Emitter Voltage .................................................................................... -65 V
VEBO Emitter to Base Voltage ............................................................................................ -5 V
IC Collector Current ..................................................................................................... -100 mA
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
VBE(on)1
VBE(on)2
*VCE(sat)1
*VCE(sat)2
*hFE
fT
Cob
Min.
-80
-65
-5
-
-600
-
-
-
75
-
-
Typ.
-
-
-
-
-
-
-
-
-
300
4.5
Max.
-
-
-
-15
-750
-820
-300
-650
475
-
-
Unit
V
V
V
nA
mV
mV
mV
mV
MHZ
Pf
Test Conditions
IC=-100uA, IE=0
IC=-1mA, IB=0
IE=-10uA, IC=0
VCB=-30V, IE=0
IC=-2mA, VCE=-5V
IC=-10mA, VCE=-5V
IC=-10mA, IB=-0.5mA
IC=-100mA, IB=-5mA
VCE=-5V, IC=-2mA,
VCE=-5V, IC=-10mA, f=100MHz
VCB=-10V, IE=0, f=1MHz
*Pulse Test : Pulse Width
≤380us,
Duty Cycle≤2%
Classification of hFE
Rank
Range
A
125-250
B
220-475
Normal
75-475
HBC556
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
100000
Spec. No. : HE6422
Issued Date : 1992.11.25
Revised Date : 2001.06.15
Page No. : 2/3
Saturation Voltage & Collector Current
100
hFE @ V
CE
=5V
Saturation Voltage (mV)
10000
hFE
1000
V
BE(sat)
@ I
C
=20I
B
100
V
CE(sat)
@ I
C
=20I
B
10
1
0.1
1
10
100
1000
10
0.1
1
10
100
1000
Collector Current (mA)
Collector Current (mA)
On Voltage & Collector Current
10000
10
Capacitance & Reverse-Biased Voltage
1000
Capacitance (pF)
On Voltage (mV)
Cob
V
BE(on)
@ V
CE
=5V
100
0.1
1
10
100
1000
1
0.1
1
10
100
Collector Current (mA)
Reverse-Biased Voltage (V)
Cutoff Frequency & Collector Current
1000
10000
PT=1ms
Safe Operating Area
PT=100ms
Collector Current-I
C
(mA)
Cutoff Frequency (MHz)
1000
PT=1s
100
V
CE
=5V
100
10
10
1
10
100
1000
1
1
10
100
Collector Current (mA)
Forward Voltage-V
CE
(V)
HBC556
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A
B
1 2
3
Spec. No. : HE6422
Issued Date : 1992.11.25
Revised Date : 2001.06.15
Page No. : 3/3
α
2
Marking :
HSMC Logo
Part Number
Date Code
Rank
Product Series
α
3
Laser Mark
HSMC Logo
Product Series
C
D
Part Number
H
I
E
F
G
Ink Mark
Style : Pin 1.Collector 2.Base 3.Emitter
α
1
3-Lead TO-92 Plastic Package
HSMC Package Code : A
*:Typical
DIM
A
B
C
D
E
F
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
-
0.0142 0.0220
-
*0.0500
0.1323 0.1480
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
-
0.36
0.56
-
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
-
*0.1000
-
*0.0500
-
*5°
-
*2°
-
*2°
Millimeters
Min.
Max.
0.36
0.56
-
*2.54
-
*1.27
-
*5°
-
*2°
-
*2°
Notes :
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
•
Head Office
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
HBC556
HSMC Product Specification
