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HCPL-902J

SPECIALTY LOGIC CIRCUIT, PDIP8
专业逻辑电路, PDIP8

器件类别:逻辑    逻辑   

厂商名称:HP(Keysight)

厂商官网:http://www.semiconductor.agilent.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
HP(Keysight)
零件包装代码
SOIC
包装说明
SOP,
针数
16
Reach Compliance Code
unknow
系列
902
JESD-30 代码
R-PDSO-G16
JESD-609代码
e0
长度
10.287 mm
逻辑集成电路类型
LOGIC CIRCUIT
湿度敏感等级
1
功能数量
1
端子数量
16
最高工作温度
100 °C
最低工作温度
-40 °C
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
NOT SPECIFIED
认证状态
Not Qualified
座面最大高度
2.642 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
7.493 mm
文档预览
Agilent HCPL-9000/-0900, -9030/-0930,
HCPL-9031/-0931, -900J/-090J,
HCPL-901J/-091J, -902J/-092J
High Speed Digital Isolators
Data Sheet
Features
• +3.3V and +5V TTL/CMOS
compatible
• 3 ns max. pulse width distortion
• 6 ns max. propagation delay skew
• 15 ns max. propagation delay
Description
The HCPL-90xx and HCPL-09xx
CMOS digital isolators feature
high speed performance and
excellent transient immunity
specifications. The symmetric
magnetic coupling barrier gives
these devices a typical pulse
width distortion of 2 ns, a typical
propagation delay skew of 4 ns
and 100 Mbaud data rate, making
them the industry’s fastest
digital isolators.
The single channel digital isola-
tors (HCPL-9000/-0900) features
an active-low logic output enable.
The dual channel digital isolators
are configured as unidirectional
(HCPL-9030/-0930) and bi-
directional (HCPL-9031/-0931),
operating in full duplex mode
making it ideal for digital
fieldbus applications.
The quad channel digital isola-
tors are configured as unidirec-
tional (HCPL-900J/-090J), two
channels in one direction and
two channels in opposite direc-
tion (HCPL-901J/-091J), and one
channel in one direction and
three channels in opposite
direction (HCPL-902J/-092J).
These high channel density make
them ideally suited to isolating
data conversion devices, parallel
buses and peripheral interfaces.
They are available in 8-pin PDIP,
8-pin Gull Wing, 8-pin SOIC
packages, and 16–pin SOIC
narrow-body and wide-body
packages. They are specified over
the temperature range of -40° C
to +100° C.
CAUTION: It is advised that
normal static precautions be
taken in handling and assembly
of this component to prevent
damage and/or degradation,
which may be induced by ESD.
• High speed: 100 MBd
• 15 kV/µs min. common mode
rejection
• Tri-state output
(HCPL-9000/-0900)
• 2500 V RMS isolation
• UL1577 and IEC 61010-1 approved
Applications
• Digital fieldbus isolation
• Multiplexed data transmission
• Computer peripheral interface
• High speed digital systems
• Isolated data interfaces
• Logic level shifting
Selection Guide
Device Number
HCPL-9000
HCPL-0900
HCPL-9030
HCPL-0930
HCPL-9031
HCPL-0931
HCPL-900J
HCPL-090J
HCPL-901J
HCPL-091J
HCPL-902J
HCPL-092J
Channel Configuration
Single
Single
Dual
Dual
Dual, Bi-Directional
Dual, Bi-Directional
Quad
Quad
Quad, 2/2, Bi-Directional
Quad, 2/2, Bi-Directional
Quad, 1/3, Bi-Directional
Quad, 1/3, Bi-Directional
Package
8-pin DIP (300 Mil)
8-pin Small Outline
8-pin DIP (300 Mil)
8-pin Small Outline
8-pin DIP (300 Mil)
8-pin Small Outline
16-pin Small Outline, Wide Body
16-pin Small Outline, Narrow Body
16-pin Small Outline, Wide Body
16-pin Small Outline, Narrow Body
16-pin Small Outline, Wide Body
16-pin Small Outline, Narrow Body
Ordering Information
Specify Part Number followed by Option Number (if desired).
Examples:
HCPL-90xx-xxx
xxx:
No option = 300 Mil PDIP-8 package, 50 units per tube.
300 = Gull Wing Surface Mount Option, 50 units per tube.
500 = Tape and Reel Packaging Option, 1000 units per reel.
HCPL-09xx-xxx
xxx:
No option = SO-8 package, 100 units per tube.
500 = Tape and Reel Packaging Option, 1500 units per reel.
HCPL-90xJ-xxx
xxx:
No option = Wide Body SOIC-16 package, 50 units per tube.
500 = Tape and Reel Packaging Option, 1000 units per reel.
HCPL-09xJ-xxx
xxx:
No option = Narrow Body SOIC-16 package, 50 per tube.
500 = Tape and Reel Packaging Option, 1000 units per reel.
2
Pin Description
Symbol
V
DD1
V
DD2
IN
X
OUT
X
GND
1
GND
2
V
OE
NC
Functional Diagrams
Single Channel
V
DD1
IN
1
NC
GND
1
1
8
Description
Power Supply 1
Galvanic Isolation
Power Supply 2
Logic Input Signal
Logic Output Signal
Power Supply Ground 1
Power Supply Ground 2
Logic Output Enable
(Single Channel), Active Low
Not Connected
V
DD2
V
OE
OUT
1
GND
2
Truth Table
IN
1
L
H
L
H
V
OE
L
L
H
H
OUT
1
L
H
Z
Z
2
7
3
6
4
5
HCPL-9000/0900
Dual Channel
V
DD1
IN
1
IN
2
GND
1
1
8
V
DD2
OUT
1
OUT
2
GND
2
V
DD1
IN
1
OUT
2
GND
1
1
8
V
DD2
OUT
1
IN
2
GND
2
2
7
2
Galvanic Isolation
Galvanic Isolation
7
3
6
3
6
4
5
4
5
HCPL-9030/0930
HCPL-9031/0931
Quad Channel
V
DD1
GND
1
IN
1
IN
2
IN
3
IN
4
NC
GND
1
1
16
V
DD2
GND
2
OUT
1
OUT
2
OUT
3
OUT
4
NC
GND
2
V
DD1
GND
1
IN
1
IN
2
OUT
3
OUT
4
NC
GND
1
1
16
V
DD2
GND
2
OUT
1
OUT
2
IN
3
IN
4
NC
GND
2
V
DD1
GND
1
IN
1
IN
2
IN
3
OUT
4
NC
GND
1
1
16
V
DD2
GND
2
OUT
1
OUT
2
OUT
3
IN
4
NC
GND
2
2
15
2
15
2
15
Galvanic Isolation
Galvanic Isolation
4
13
4
13
4
Galvanic Isolation
3
14
3
14
3
14
13
5
12
5
12
5
12
6
11
6
11
6
11
7
10
7
10
7
10
8
9
8
9
8
9
HCPL-900J/-090J
HCPL-901J/-091J
HCPL-902J/-092J
3
Package Outline Drawings
HCPL-9000, HCPL-9030 and HCPL-9031 Standard DIP Packages
8
7
6
5
0.240 (6.096)
0.260 (6.604)
1
2
3
4
0.370 (9.398)
0.400 (10.160)
0.290 (7.366)
0.310 (7.874)
0.55 (1.397)
0.65 (1.651)
0.120 (3.048)
0.150 (3.810)
0.008 (0.203)
0.015 (0.381)
0.015 (0.381)
0.035 (0.889)
0.030 (0.762)
0.045 (1.143)
0.015 (0.380)
0.023 (0.584)
0.090 (2.286)
0.110 (2.794)
0.045 (1.143)
0.065 (1.651)
0.300 (7.620)
0.370 (9.398)
DIMENSIONS: INCHES (MILLIMETERS) MIN
MAX
HCPL-9000, HCPL-9030 and HCPL-9031 Gull Wing Surface Mount Option 300
PAD LOCATION (for reference only)
0.370 (9.400)
0.390 (9.900)
8
7
6
5
0.040 (1.016)
0.047 (1.194)
0.190 TYP.
(4.826)
0.240 (6.100)
0.260 (6.600)
0.370 (9.398)
0.390 (9.906)
1
2
3
4
0.047 (1.194)
0.070 (1.778)
0.045 (1.143)
0.065 (1.651)
0.370 (9.400)
0.390 (9.900)
0.290 (7.370)
0.310 (7.870)
0.015 (0.381)
0.025 (0.635)
0.030 (0.762)
0.045 (1.143)
0.120 (3.048)
0.150 (3.810)
0.008 (0.203)
0.013 (0.330)
0.030 (0.760)
0.056 (1.400)
0.100
(2.540)
BSC
DIMENSIONS INCHES (MILLIMETERS)
0.025 (0.632)
0.035 (0.892)
0.015 (0.385)
0.035 (0.885)
12° NOM.
MIN
MAX
LEAD COPLANARITY = 0.004 INCHES (0.10 mm)
4
HCPL-0900, HCPL-0930 and HCPL-0931 Small Outline SO-8 Package
0.189 (4.80)
0.197 (5.00)
8
0.228 (5.80)
0.244 (6.20)
7
6
5
0.150 (3.80)
0.157 (4.00)
1
2
3
4
0.013 (0.33)
0.020 (0.51)
0.010 (0.25)
0.020 (0.50)
x 45°
0.054 (1.37)
0.069 (1.75)
0.040 (1.016)
0.060 (1.524)
0.004 (0.10)
0.010 (0.25)
0.016 (0.40)
0.050 (1.27)
0.008 (0.19)
0.010 (0.25)
DIMENSIONS: INCHES (MILLIMETERS) MIN
MAX
HCPL-900J, HCPL-901J and HCPL-902J Wide Body SOIC-16 Package
0.397 (10.084)
0.413 (10.490)
8
1
Pin 1 indent
0.394 (10.007)
0.419 (10.643)
0.291 (7.391)
0.299 (7.595)
0.013 (0.330)
0.020 (0.508)
7° TYP
0.080 (2.032)
0.100 (2.54)
0.040 (1.016)
0.060 (1.524)
0.092 (2.337)
0.104 (2.642)
7° TYP
0.287 (7.290)
0.297 (7.544)
0.010 (0.254)
x 45°
0.020 (0.508)
0° – 8° TYP
0.004 (0.1016)
0.011 (0.279)
0.009 (0.229)
0.012 (0.305)
0.016 (0.40)
0.050 (1.27)
DIMENSIONS: INCHES (MILLIMETERS) MIN
MAX
5
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