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参数对比

与HCS02KMSRS9000相近的元器件有：5962R9567901VXC、HCS02HMSR、5962R9567901VCC、HCS02D/SAMPLE、HCS02K/SAMPLE、HCS02DMSR。描述及对比如下：

型号	HCS02KMSRS9000	5962R9567901VXC	HCS02HMSR	5962R9567901VCC	HCS02D/SAMPLE	HCS02K/SAMPLE	HCS02DMSR
描述	NOR Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDFP14	NOR Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDFP14	NOR Gate, HC/UH Series, 4-Func, 2-Input, CMOS	NOR Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDIP14	NOR Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDIP14	NOR Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDFP14	NOR Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDIP14
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
厂商名称	Harris	-	Harris	Harris	Harris	Harris	Harris
系列	-	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH
JESD-30 代码	-	R-CDFP-F14	X-XUUC-N14	R-CDIP-T14	R-CDIP-T14	R-CDFP-F14	R-CDIP-T14
负载电容（CL）	-	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	-	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE
功能数量	-	4	4	4	4	4	4
输入次数	-	2	2	2	2	2	2
端子数量	-	14	14	14	14	14	14
最高工作温度	-	125 °C	125 °C	125 °C	-	-	125 °C
最低工作温度	-	-55 °C	-55 °C	-55 °C	-	-	-55 °C
封装主体材料	-	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装形状	-	RECTANGULAR	UNSPECIFIED	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	-	FLATPACK	UNCASED CHIP	IN-LINE	IN-LINE	FLATPACK	IN-LINE
传播延迟（tpd）	-	20 ns	18 ns	20 ns	18 ns	18 ns	20 ns
认证状态	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	-	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	-	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	-	YES	YES	NO	NO	YES	NO
技术	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	-	MILITARY	MILITARY	MILITARY	-	-	MILITARY
端子形式	-	FLAT	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	FLAT	THROUGH-HOLE
端子位置	-	DUAL	UPPER	DUAL	DUAL	DUAL	DUAL