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HD64F3062BTE

Microcontroller, 16-Bit, FLASH, 25MHz, CMOS, PQFP100, TQFP-100

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Hitachi (Renesas )

厂商官网:http://www.renesas.com/eng/

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器件参数
参数名称
属性值
厂商名称
Hitachi (Renesas )
零件包装代码
QFP
包装说明
TFQFP,
针数
100
Reach Compliance Code
unknown
具有ADC
YES
地址总线宽度
24
位大小
16
最大时钟频率
25 MHz
DAC 通道
YES
DMA 通道
NO
外部数据总线宽度
16
JESD-30 代码
S-PQFP-G100
长度
14 mm
I/O 线路数量
79
端子数量
100
最高工作温度
75 °C
最低工作温度
-20 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
TFQFP
封装形状
SQUARE
封装形式
FLATPACK, THIN PROFILE, FINE PITCH
认证状态
Not Qualified
ROM可编程性
FLASH
座面最大高度
1.2 mm
速度
25 MHz
最大供电电压
5.5 V
最小供电电压
4.5 V
标称供电电压
5 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL EXTENDED
端子形式
GULL WING
端子节距
0.5 mm
端子位置
QUAD
宽度
14 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
Base Number Matches
1
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Hitachi Single-Chip Microcomputer
H8/3062 Series
H8/3062
H8/3061
H8/3060
H8/3064B
H8/3062B
H8/3061B
H8/3060B
HD6433062
HD6433061
HD6433060
HD6433064B
HD6433062B
HD6433061B
HD6433060B
H8/3062B Series
H8/3062F-ZTAT™
HD64F3062, HD64F3062R, HD64F3062B
H8/3064F-ZTAT™
HD64F3064B
Hardware Manual
ADE-602-136D
Rev. 5.0
3/18/02
Hitachi, Ltd.
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or
use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that
demands especially high quality and reliability or where its failure or malfunction may directly
threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear
power, combustion control, transportation, traffic, safety equipment or medical equipment for
life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,
consider normally foreseeable failure rates or failure modes in semiconductor devices and
employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi
product does not cause bodily injury, fire or other consequential damage due to operation of
the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.
Preface
The H8/3062 Series is a high-performance single-chip microcomputer that integrates peripheral
functions necessary for system configuration with an H8/300H CPU featuring a 32-bit internal
architecture as its core.
The on-chip peripheral functions include ROM, RAM, 16-bit timers, 8-bit timers, a programmable
timing pattern controller (TPC), a watchdog timer (WDT), a serial communication interface (SCI),
a D/A converter, an A/D converter, and I/O ports, providing an ideal configuration as a
microcomputer for embedding in sophisticated control systems. Flash memory (F-ZTAT™*) and
mask ROM are available as on-chip ROM, enabling users to respond quickly and flexibly to
changing application specifications and the demands of the transition from initial to full-fledged
volume production.
Note: * F-ZTAT is a trademark of Hitachi, Ltd.
Intended Readership: This manual is intended for users undertaking the design of an application
system using the H8/3062 Series. Readers using this manual require a basic
knowledge of electrical circuits, logic circuits, and microcomputers.
Purpose:
The purpose of this manual is to give users an understanding of the hardware
functions and electrical characteristics of the H8/3062 Series. Details of
execution instructions can be found in the H8/300H Series Programming
Manual, which should be read in conjunction with the present manual.
Using this Manual:
For an overall understanding of the H8/3062 Series's functions
Follow the Table of Contents. This manual is broadly divided into sections on the CPU, system
control functions, peripheral functions, and electrical characteristics.
For a detailed understanding of CPU functions
Refer to the separate publication H8/300H Series Programming Manual.
Note on bit notation: Bits are shown in high-to-low order from left to right.
Related Material:
The latest information is available at our Web Site. Please make sure that
you have the most up-to-date information available.
(http://www.hitachisemiconductor.com/)
User's Manuals on the H8/3062:
Manual Title
H8/3062 Hardware Manual
H8/300H Series Programming Manual
ADE No.
This manual
ADE-602-053
Users manuals for development tools:
Manual Title
C/C++ Compiler, Assembler, Optimizing Linkage Editor User’s Manual
H8S, H8/300 Series Simulator/Debugger User’s Manual
Hitachi Embedded Workshop User’s Manual
H8S, H8/300 Series Hitachi Embedded Workshop, Hitachi Debugging
Interface User’s Manual
ADE No.
ADE-702-247
ADE-702-037
ADE-702-201
ADE-702-231
Application Note:
Manual Title
H8/300H for CPU Application Note
H8/300H On-Chip Supporting Modules Application Note
H8/300H Technical Q&A
ADE No.
ADE-502-033
ADE-502-035
ADE-502-038
Comparison of H8/3062 Series Product Specifications
There are 11 members of the H8/3062 Series: the H8/3062F-ZTAT, H8/3062F-ZTAT R-mask
version, H8/3062F-ZTAT B-mask version, and H8/3064F-ZTAT B-mask version (all with on-chip
flash memory), and the H8/3062 mask ROM version, H8/3061 mask ROM version, H8/3060 mask
ROM version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version,
H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version.
The specifications of these products are compared below.
H8/3062 Mask
ROM Version,
H8/3061 Mask
ROM Version,
H8/3060 Mask
ROM Version
Mask ROM
version
H8/3064 Mask ROM
B-Mask Version,
H8/3062 Mask ROM
H8/3064F-ZTAT H8/3062F-ZTAT B-Mask Version,
B-Mask Version B-Mask Version H8/3061 Mask ROM
B-Mask Version,
H8/3060 Mask ROM
B-Mask Version
On-chip large-
capacity single-
power-supply
flash memory
Internal step-
down circuit
Product
code
HD64F3062
HD64F3062R
HD6433062
HD6433061
HD6433060
HD64F3064B
HD64F3062B
HD6433064B
HD6433062B
HD6433061B
HD6433060B
H8/3064 mask ROM
B-mask version,
H8/3062 mask ROM
B-mask version,
H8/3061 mask ROM
B-mask version, and
H8/3060 mask ROM
B-mask version have
V
CL
pin, and require
connection of
external capacitor
See figures 1.4
and 1.5, Pin
Arrangement, in
section 1
RAM size
4 kbytes
H8/3062:
4 kbytes
H8/3061:
4 kbytes
H8/3060:
2 kbytes
8 kbytes
4 kbytes
H8/3064B:
8 kbytes
H8/3062B:
4 kbytes
H8/3061B:
4 kbytes
H8/3060B:
2 kbytes
H8/3062F-ZTAT Mask ROM version
high-speed
operation version
H8/3062F-ZTAT
H8/3062F-ZTAT
R-Mask Version
Product
specifica-
tions
On-chip single-
power-supply
flash memory
H8/3062F-ZTAT
version with
address output
functions added
Pin arrange- See figures 1.2 and 1.3, Pin Arrangement, in section 1 H8/3064F-ZTAT
ment
B-mask version
has V
CL
pin, and
requires
connection of
external
capacitor
See figures 1.4
and 1.5, Pin
Arrangement, in
section 1
H8/3062F-ZTAT
B-mask version
has V
CL
pin, and
requires
connection of
external
capacitor
See figures 1.4
and 1.5, Pin
Arrangement, in
section 1
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