型号
- 型号
- 关键词
| 型号 | HI1-5687I-8 | HI1-5687V-8 | HI1-5687I-2 | HI1-5687V-2 |
|---|---|---|---|---|
| 描述 | IC,D/A CONVERTER,SINGLE,12-BIT,BIPOLAR,DIP,24PIN | IC,D/A CONVERTER,SINGLE,12-BIT,BIPOLAR,DIP,24PIN | IC,D/A CONVERTER,SINGLE,12-BIT,BIPOLAR,DIP,24PIN | IC,D/A CONVERTER,SINGLE,12-BIT,BIPOLAR,DIP,24PIN |
| Reach Compliance Code | compliant | not_compliant | not_compliant | not_compliant |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY |
| JESD-30 代码 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
| 最大线性误差 (EL) | 0.018% | 0.018% | 0.018% | 0.018% |
| 位数 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5,+-12/+-15 V | 5,+-12/+-15 V | 5,+-12/+-15 V | 5,+-12/+-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | - |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
| JESD-609代码 | - | e0 | e0 | e0 |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
