型号 | HI1-5687V-8 | HI1-5687I-8 | HI1-5687I-2 | HI1-5687V-2 |
---|---|---|---|---|
描述 | IC,D/A CONVERTER,SINGLE,12-BIT,BIPOLAR,DIP,24PIN | IC,D/A CONVERTER,SINGLE,12-BIT,BIPOLAR,DIP,24PIN | IC,D/A CONVERTER,SINGLE,12-BIT,BIPOLAR,DIP,24PIN | IC,D/A CONVERTER,SINGLE,12-BIT,BIPOLAR,DIP,24PIN |
Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY |
JESD-30 代码 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
最大线性误差 (EL) | 0.018% | 0.018% | 0.018% | 0.018% |
位数 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP |
封装等效代码 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | 5,+-12/+-15 V | 5,+-12/+-15 V | 5,+-12/+-15 V | 5,+-12/+-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | NO | NO | NO |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 |
JESD-609代码 | e0 | - | e0 | e0 |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Base Number Matches | 1 | 1 | 1 | - |