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HM66AEB9405BP-50

4MX9 DDR SRAM, 0.45ns, PBGA165, PLASTIC, FBGA-165

器件类别:存储    存储   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

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器件参数
参数名称
属性值
厂商名称
Renesas(瑞萨电子)
零件包装代码
BGA
包装说明
LBGA, BGA165,11X15,40
针数
165
Reach Compliance Code
unknown
ECCN代码
3A991.B.2.A
最长访问时间
0.45 ns
最大时钟频率 (fCLK)
200 MHz
I/O 类型
SEPARATE
JESD-30 代码
R-PBGA-B165
JESD-609代码
e1
长度
17 mm
内存密度
37748736 bit
内存集成电路类型
DDR SRAM
内存宽度
9
功能数量
1
端子数量
165
字数
4194304 words
字数代码
4000000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
4MX9
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
LBGA
封装等效代码
BGA165,11X15,40
封装形状
RECTANGULAR
封装形式
GRID ARRAY, LOW PROFILE
并行/串行
PARALLEL
电源
1.5/1.8,1.8 V
认证状态
Not Qualified
座面最大高度
1.46 mm
最大待机电流
0.28 A
最小待机电流
1.7 V
最大压摆率
0.62 mA
最大供电电压 (Vsup)
1.9 V
最小供电电压 (Vsup)
1.7 V
标称供电电压 (Vsup)
1.8 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
TIN SILVER COPPER
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
宽度
15 mm
文档预览
HM66AEB36105/HM66AEB18205
HM66AEB9405
36-Mbit DDR II SRAM Separate I/O
2-word Burst
REJ03C0047-0001Z
(Previous ADE-203-1366 (Z) Rev. 0.0)
Preliminary
Rev.0.01
Apr.28.2004
Description
The HM66AEB36105 is a 1,048,576-word by 36-bit, the HM66AEB18205 is a 2,097,152-word by 18-bit,
and the HM66AEB9405 is a 4,194,304-word by 9-bit synchronous double data rate static RAM fabricated
with advanced CMOS technology using full CMOS six-transistor memory cell. It integrates unique
synchronous peripheral circuitry and a burst counter. All input registers controlled by an input clock pair
(K and
K)
and are latched on the positive edge of K and
K.
These products are suitable for applications
which require synchronous operation, high speed, low voltage, high density and wide bit configuration.
These products are packaged in 165-pin plastic FBGA package.
Preliminary: The specifications of this device are subject to change without notice. Please contact your
nearest Renesas Technology's Sales Dept. regarding specifications.
Rev.0.01, Apr.28.2004, page 1 of 28
HM66AEB36105/18205/9405
Features
1.8 V
±
0.1 V power supply for core (V
DD
)
1.4 V to V
DD
power supply for I/O (V
DDQ
)
DLL circuitry for wide output data valid window and future frequency scaling
Separate independent read and write data ports
DDR read or write operation initiated each cycle
Separate data input/output bus
Two-tick burst for low DDR transaction size
Two input clocks (K and
K)
for precise DDR timing at clock rising edges only
Two output clocks (C and
C)
for precise flight time and clock skew matching-clock and data delivered
together to receiving device
Internally self-timed write control
Clock-stop capability with
µs
restart
User programmable impedance output
Fast clock cycle time: 3.0 ns (333 MHz)/3.3 ns (300 MHz)/4.0 ns (250 MHz)/
5.0 ns (200 MHz)/6.0 ns (167 MHz)
Simple control logic for easy depth expansion
JTAG boundary scan
Ordering Information
Type No.
HM66AEB36105BP-30
HM66AEB36105BP-33
HM66AEB36105BP-40
HM66AEB36105BP-50
HM66AEB36105BP-60
HM66AEB18205BP-30
HM66AEB18205BP-33
HM66AEB18205BP-40
HM66AEB18205BP-50
HM66AEB18205BP-60
HM66AEB9405BP-30
HM66AEB9405BP-33
HM66AEB9405BP-40
HM66AEB9405BP-50
HM66AEB9405BP-60
Organization
1-M word
×
36-bit
Cycle time
3.0 ns
3.3 ns
4.0 ns
5.0 ns
6.0 ns
3.0 ns
3.3 ns
4.0 ns
5.0 ns
6.0 ns
3.0 ns
3.3 ns
4.0 ns
5.0 ns
6.0 ns
Clock frequency
333 MHz
300 MHz
250 MHz
200 MHz
167 MHz
333 MHz
300 MHz
250 MHz
200 MHz
167 MHz
333 MHz
300 MHz
250 MHz
200 MHz
167 MHz
Package
Plastic FBGA 165-pin
(BP-165A)
2-M word
×
18-bit
4-M word
×
9-bit
Rev.0.01, Apr.28.2004, page 2 of 28
HM66AEB36105/18205/9405
Pin Arrangement
(HM66AEB36105) 165PIN-BGA
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
CQ
Q27
D27
D28
Q29
Q30
D30
DOFF
D31
Q32
Q33
D33
D34
Q35
TDO
2
V
SS
Q18
Q28
D20
D29
Q21
D22
V
REF
Q31
D32
Q24
Q34
D26
D35
TCK
3
NC
D18
D19
Q19
Q20
D21
Q22
V
DDQ
D23
Q23
D24
D25
Q25
Q26
SA
4
R/W
SA
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
SA
5
BW2
BW3
SA
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
SA
SA
6
K
K
SA
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
SA
C
C
7
BW1
BW0
SA
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
SA
SA
8
LD
SA
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
SA
9
SA
D17
D16
Q16
Q15
D14
Q13
V
DDQ
D12
Q12
D11
D10
Q10
Q9
SA
10
NC
Q17
Q7
D15
D6
Q14
D13
V
REF
Q4
D3
Q11
Q1
D9
D0
TMS
11
CQ
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
(Top view)
Pin Arrangement
(HM66AEB18205) 165PIN-BGA
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
CQ
NC
NC
NC
NC
NC
NC
DOFF
NC
NC
NC
NC
NC
NC
TDO
2
V
SS
Q9
NC
D11
NC
Q12
D13
V
REF
NC
NC
Q15
NC
D17
NC
TCK
3
SA
D9
D10
Q10
Q11
D12
Q13
V
DDQ
D14
Q14
D15
D16
Q16
Q17
SA
4
R/W
SA
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
SA
5
BW1
NC
SA
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
SA
SA
6
K
K
SA
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
SA
C
C
7
NC
BW0
SA
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
SA
SA
8
LD
SA
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
SA
9
SA
NC
NC
NC
NC
NC
NC
V
DDQ
NC
NC
NC
NC
NC
NC
SA
10
NC
NC
Q7
NC
D6
NC
NC
V
REF
Q4
D3
NC
Q1
NC
D0
TMS
11
CQ
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
(Top view)
Rev.0.01, Apr.28.2004, page 3 of 28
HM66AEB36105/18205/9405
Pin Arrangement
(HM66AEB9405) 165PIN-BGA
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
CQ
NC
NC
NC
NC
NC
NC
DOFF
NC
NC
NC
NC
NC
NC
TDO
2
V
SS
NC
NC
D5
NC
NC
D6
V
REF
NC
NC
Q7
NC
D8
NC
TCK
3
SA
NC
NC
NC
Q5
NC
Q6
V
DDQ
NC
NC
D7
NC
NC
Q8
SA
4
R/W
SA
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
SA
5
NC
NC
SA
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
SA
SA
6
K
K
SA
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
SA
C
C
7
NC
BW
SA
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
SA
SA
8
LD
SA
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
SA
9
SA
NC
NC
NC
NC
NC
NC
V
DDQ
NC
NC
NC
NC
NC
NC
SA
10
SA
NC
NC
NC
D3
NC
NC
V
REF
Q2
NC
NC
NC
NC
D0
TMS
11
CQ
Q4
D4
NC
Q3
NC
NC
ZQ
D2
NC
Q1
D1
NC
Q0
TDI
(Top view)
Notes on Usage
Power-on initialization cycles are required for all operations, including JTAG functions, to become
normal.
Clock recovery initialization cycles are required for read/write operations to become normal.
Output buffer impedance can be programmed by terminating the ZQ ball to V
SS
through a precision
resistor (RQ). The value of RQ is five times the output impedance desired. The allowable range of RQ
to guarantee impedance matching with a tolerance of 10% is 250
typical. The total external
capacitance of ZQ ball must be less than 7.5 pF.
Rev.0.01, Apr.28.2004, page 4 of 28
HM66AEB36105/18205/9405
Pin Descriptions
Name
SA
I/O type Descriptions
Input
Synchronous address inputs: These inputs are registered and must meet the setup and
hold times around the rising edge of K. All transactions operate on a burst-of-two words
(one clock period of bus activity). These inputs are ignored when device is deselected.
Synchronous load: This input is brought low when a bus cycle sequence is to be
defined. This definition includes address and READ / WRITE direction. All transactions
operate on a burst-of-two data (one clock period of bus activity).
Synchronous read / write Input: When
LD
is low, this input designates the access type
(READ when R/W is high, WRITE when R/W is low) for the loaded address. R/W must
meet the setup and hold times around the rising edge of K.
Synchronous byte writes: When low, these inputs cause their respective byte to be
registered and written during WRITE cycles. These signals must meet setup and hold
times around the rising edges of K and
K
for each of the two rising edges comprising the
WRITE cycle. See Byte Write Truth Table for signal to data relationship.
Input clock: This input clock pair registers address and control inputs on the rising edge
of K, and registers data on the rising edge of K and the rising edge of
K. K
is ideally 180
degrees out of phase with K. All synchronous inputs must meet setup and hold times
around the clock rising edges. These balls cannot remain V
REF
level.
Output clock: This clock pair provides a user-controlled means of tuning device output
data. The rising edge of
C
is used as the output timing reference for first output data.
The rising edge of C is used as the output timing reference for second output data.
Ideally,
C
is 180 degrees out of phase with C. C and
C
may be tied high to force the use
of K and
K
as the output reference clocks instead of having to provide C and
C
clocks. If
tied high, C and
C
must remain high and not to be toggled during device operation.
These balls cannot remain V
REF
level.
DLL disable: When low, this input causes the DLL to be bypassed for stable, low
frequency operation.
Output impedance matching input: This input is used to tune the device outputs to the
system data bus impedance. Q and CQ output impedance are set to 0.2
×
RQ, where
RQ is a resistor from this ball to ground. This ball can be connected directly to V
DDQ
,
which enables the minimum impedance mode. This ball cannot be connected directly to
V
SS
or left unconnected.
IEEE1149.1 test inputs: 1.8 V I/O levels. These balls may be left not connected if the
JTAG function is not used in the circuit.
IEEE1149.1 clock input: 1.8 V I/O levels. This ball must be tied to V
SS
if the JTAG
function is not used in the circuit.
LD
Input
R/W
Input
BW
BWn
Input
K,
K
Input
C,
C
Input
DOFF
ZQ
Input
Input
TMS
TDI
TCK
Input
Input
Rev.0.01, Apr.28.2004, page 5 of 28
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