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HMTMS-136-56-G-D-001-002

Board Connector, 72 Contact(s), 2 Row(s), Male, Straight, 0.05 inch Pitch, Solder Terminal, Locking, Black Insulator

器件类别:连接器    连接器   

厂商名称:SAMTEC

厂商官网:http://www.samtec.com/

器件标准:

下载文档
器件参数
参数名称
属性值
是否Rohs认证
符合
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
2 POSITION OMITTED
主体宽度
0.098 inch
主体深度
0.1 inch
主体长度
1.8 inch
连接器类型
BOARD CONNECTOR
联系完成配合
AU ON NI
联系完成终止
Gold (Au) - with Nickel (Ni) barrier
触点性别
MALE
触点材料
PHOSPHOR BRONZE
触点模式
RECTANGULAR
触点样式
SQ PIN-SKT
绝缘体颜色
BLACK
绝缘体材料
LIQUID CRYSTAL POLYMER (LCP)
JESD-609代码
e4
制造商序列号
HMTMS
插接触点节距
0.05 inch
匹配触点行间距
0.1 inch
安装选项1
LOCKING
安装方式
STRAIGHT
安装类型
BOARD
连接器数
ONE
PCB行数
2
装载的行数
2
最高工作温度
125 °C
最低工作温度
-55 °C
PCB接触模式
RECTANGULAR
PCB触点行间距
2.54 mm
电镀厚度
10u inch
参考标准
UL
可靠性
COMMERCIAL
端子长度
0.12 inch
端子节距
1.27 mm
端接类型
SOLDER
触点总数
72
文档预览
F-214
MTMS–130–02–G–D–100
MTMS–110–02–G–D–100
MTMS–125–51–G–S–200
(1,27 mm) .050"
MTMS, HMTMS SERIES
MODIFIED MICRO TERMINAL
SPECIFICATIONS
For complete specifications
see www.samtec.com?MTMS
or www.samtec.com?HMTMS
Insulator Material:
Black Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Operating Temp Range:
-55°C to +105°C with Tin
-55°C to +125°C with Gold
RoHS Compliant:
Yes
Mates with:
SMS, SLM, RSM
B o a rd
Stacking
BO AR D
SP AC E
PO ST
OV ER AL L
PI N
(O AL )
TA IL
M AX
IN SE RT IO N
DE PT H
SO CK ET
PR OF ILE
BO DY
PR OF ILE
Position anywhere
in the body with
(3,05 mm) .120"
minimum tail
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
Single row
and double row
Ideal for board
stacking
applications
ALSO AVAILABLE
(MOQ Required)
• Other platings
Contact Samtec.
Note:
This Series is
non-standard, non-returnable.
TYPE
STRIP
1
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
ROW
OPTION
POST
HEIGHT
OPTION
01
thru
50
MTMS
= Modified Standard
–L
= 10µ" (0,25 µm)
Gold on post,
Matte Tin on tail
–S
= Single
Row
–“XXX”
= “B”
Dimension
(Specify Post
Height in
inches
(0,13 mm)
.005"
increments)
–“XXX”
= Polarized
Position
(Specify
position of
omitted pin)
–D
= Double
Row
Processing:
Lead-Free Solderable:
Yes
–G
= 10µ" (0,25 µm)
Gold on post,
Gold flash on tail
HMTMS
= Modified High Temp
(1,27) .050 x No. of Positions
(2,48)
.098
50
02
01
100
B
LEAD
STYLE
–01
–02
–25*
–51
–52
–53
–54
–55
–56
–57
–58
–59
–60
OAL
(11,43) .450
(8,13) .320
(8,38) .330
(10,41) .410
(10,80) .425
(12,83) .505
(14,10) .555
(15,49) .610
(15,88) .625
(16,51) .650
(17,91) .705
(19,18) .755
(20,96) .825
(Maximum
when C =
(3,05 mm) .120")
(5,84) .230
(2,54) .100
(3,18) .125
(4,83) .190
(5,21) .205
(7,24) .285
(8,51) .335
(9,91) .390
(10,29) .405
(10,92) .430
(12,32) .485
(13,59) .535
(15,37) .605
(2,54)
.100
01
99
(4,98)
.196
HMTMS –D
BODY DESIGN
B
(0,00) .000
MIN
(2,54)
.100
(0,46) .018 SQ
(1,27) .050 TYP
OAL
(3,05)
C
.120
MIN
*
(0,51)
.020
(0,51) .020 DIA
www.samtec.com
SINGLE ROW
DOUBLE ROW
Tail DIA is .020" (0,51 mm) for min .120" (3,05 mm).
Balance of tail is .018" (0,46 mm) SQ.
*Style -25 tail C = (2,67 mm) .105" min
is available.
WWW.SAMTEC.COM
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