High Temperature
Thick Film Chip Resistors
HTC Series
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•
•
•
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Operation to 200°C
Excellent high temperature stability
Improved working voltage ratings
Pb-free wrap-around terminations
Standard chip sizes available from 1206 to 2512
Electrical Data
Characteristic
Resistance Range
150°C Power Rating
Max Voltage Rating
Absolute TCR
Operating Temperature
Pad/Trace Area
1
Termination
80mm
2
200mW
200V
1206
2010
1W to 10MW; ±1%, ±5%
10W to 1MW; ±0.5%, ±5%, ±1%
500mW
400V
± 100ppm/°C
-55°C to +200°C
200mm
2
Wrap-around Pb-free with leach resistant Ni barrier
300mm
2
750mW
500V
2512
Note
1
: Recommended minimum pad and adjacent trace area for each termination for rated power on
FR4 PCB.
Environmental Data
Test
Load Life
High Temperature Exposure
Short Time Overload
Moisture Resistance
Thermal Shock
Resistance to Soldering Heat
Solderability
Note
2
: 0.01W added for all resistance values <10W.
General Note
Method
MIL-STD-202 Method 108
(Rated Power for 1000hrs @ 150°C)
1000 hours @ 200°C
MIL-PRF-55342H
(6.25X rated power for 5secs)
MIL-STD-202 Method 106G
MIL-STD-202 Method 107G Condition B
MIL-STD-202 Method 210F
MIL-STD-202 Method 208
(245°C, 5 seconds)
Specification
Maximum
2
1.00%
1.00%
1.00%
1.00%
0.25%
0.25%
Typical
0.25%
0.20%
0.10%
0.25%
0.05%
0.05%
>95% Coverage
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TTelectronics plc
HTC Series Issue July 2009
High Temperature
Thick Film Chip Resistors
Physical Data
L
A
C
Overglaze
(Stability Enhancer)
Protective Overcoat
Sn Plating
Ni Barrier Layer
W
High Reliability
Resistance Element
B
Alumina Substrate
Conductor
T
Part Type
1206
2010
2512
L (mm)
3.2±0.4
5.1±0.3
6.5±0.3
W (mm)
1.6±0.2
2.5±0.2
3.2±0.2
T max (mm)
0.7
0.8
0.8
A (mm)
0.4±0.15
0.6±0.25
0.6±0.25
B min (mm)
0.4±0.2
0.6±0.3
0.6±0.3
C (mm)
1.7
3.0
4.4
Weight (grams)
0.020
0.036
0.055
Construction:
Thick film resistor material, overglaze and organic protection are screen printed on a 96% alumina substrate. Wrap-around
terminations have an electroplated Ni barrier and pure Sn matte finish, ensuring excellent `leach´ resistance properties and
solderability.
Marking:
Components are not marked. Reels are marked with type, value, tolerance, date code and quantity.
Solvent resistance:
The body protection is resistant to all normal industrial cleaning solvents suitable for printed circuits.
Power Derating Data
100
Ordering Data
Prefix
TKC - HTC - 2512LF - 100R - F
Chip Type
HTC (High Temperature Chip)
% Of Rated P ower
Chip Size and Termination
50
1206LF = 100% Tin (pb-free) termination
2010LF = 100% Tin (pb-free) termination
2512LF = 100% Tin (pb-free) termination
Resistance Value (4 Digit Code)
Ex. 1R00 = 1W; 100R = 100W; 10K0 =10KW; 1M50 = 1.5MW
10
Tolerance Code
150°
200°
J = ±5%; F = ±1%; D = ±0.5%
For additional information or to discuss your specific requirements,
please contact our Applications Team using the contact details below.
Temperature in °C
Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
HTC Series Issue July 2009
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