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HUF76113T3ST

4.7A, 30V, 0.038ohm, N-CHANNEL, Si, POWER, MOSFET

器件类别:分立半导体    晶体管   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
Reach Compliance Code
not_compliant
ECCN代码
EAR99
Is Samacsys
N
其他特性
ULTRA-LOW RESISTANCE
外壳连接
DRAIN
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
30 V
最大漏极电流 (Abs) (ID)
4.7 A
最大漏极电流 (ID)
4.7 A
最大漏源导通电阻
0.038 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JESD-30 代码
R-PDSO-G4
JESD-609代码
e0
元件数量
1
端子数量
4
工作模式
ENHANCEMENT MODE
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
极性/信道类型
N-CHANNEL
最大功率耗散 (Abs)
1.1 W
认证状态
Not Qualified
表面贴装
YES
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子位置
DUAL
晶体管应用
SWITCHING
晶体管元件材料
SILICON
Base Number Matches
1
文档预览
HUF76113T3ST
TM
Data Sheet
June 2000
File Number
4388.3
4.7A, 30V, 0.031 Ohm, N-Channel, Logic
Level UltraFET Power MOSFET
This N-Channel power MOSFET is
®
manufactured using the innovative
UltraFET process. This advanced
process technology achieves the
lowest possible on-resistance per silicon area, resulting in
outstanding performance. This device is capable of
withstanding high energy in the avalanche mode and the
diode exhibits very low reverse recovery time and stored
charge. It was designed for use in applications where power
efficiency is important, such as switching regulators, switching
converters, motor drivers, relay drivers, low-voltage bus
switches, and power management in portable and battery-
operated products.
Formerly developmental type TA76113.
Features
• Logic Level Gate Drive
• 4.7A, 30V
• Ultra Low On-Resistance, r
DS(ON)
= 0.031Ω
• Temperature Compensating PSPICE
®
Model
• Temperature Compensating SABER™ Model
• Thermal Impedance SPICE Model
• Thermal Impedance SABER Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, “Guidelines for Soldering Surface Mount
Components to PC Boards”
Ordering Information
PART NUMBER
HUF76113T3ST
PACKAGE
SOT-223
76113
BRAND
Symbol
D
NOTE: HUF76113T3ST is available only in tape and reel.
G
S
Packaging
SOT-223
DRAIN
(FLANGE)
SOURCE
DRAIN
GATE
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
UltraFET® is a registered trademark of Intersil Corporation.
PSPICE® is a registered trademark of MicroSim Corporation. SABER™ is a trademark of Analogy, Inc.
1-888-INTERSIL or 321-724-7143
|
Intersil and Design is a trademark of Intersil Corporation.
|
Copyright
©
Intersil Corporation 2000
HUF76113T3ST
Absolute Maximum Ratings
T
A
= 25
o
C, Unless Otherwise Specified
HUF76113T3ST
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DSS
Drain to Gate Voltage (R
GS
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Drain Current
Continuous (T
A
= 25
o
C, V
GS
= 10V) (Figure 2) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
A
= 100
o
C, V
GS
= 5V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
A
= 100
o
C, V
GS
= 4.5V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
AS
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Derate Above 25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
J
, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
L
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
pkg
30
30
±16
4.7
2.7
2.6
Figure 4
Figure 6
1.1
0.0091
-55 to 150
300
260
UNITS
V
V
V
A
A
A
W
W/
o
C
o
C
o
C
o
C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. T
J
= 25
o
C to 150
o
C.
Electrical Specifications
PARAMETER
OFF STATE SPECIFICATIONS
T
A
= 25
o
C, Unless Otherwise Specified
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Drain to Source Breakdown Voltage
Zero Gate Voltage Drain Current
BV
DSS
I
DSS
I
D
= 250µA, V
GS
= 0V (Figure 12)
V
DS
= 25V, V
GS
= 0V
V
DS
= 25V, V
GS
= 0V, T
C
= 150
o
C
30
-
-
-
-
-
-
-
-
1
250
±100
V
µA
µA
nA
Gate to Source Leakage Current
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage
Drain to Source On Resistance
I
GSS
V
GS
=
±16V
V
GS(TH)
r
DS(ON)
V
GS
= V
DS
, I
D
= 250µA (Figure 11)
I
D
= 4.7A, V
GS
= 10V (Figure 9, 10)
I
D
= 2.7A, V
GS
= 5V (Figure 9)
I
D
= 2.6A, V
GS
= 4.5V (Figure 9)
1
-
-
-
-
0.027
0.033
0.035
3
0.031
0.038
0.040
V
W
W
W
THERMAL SPECIFICATIONS
Thermal Resistance Junction to Ambient
R
θJA
Pad Area = 0.173 in
2
(Note 2)
Pad Area = 0.068 in
2
(See TB377)
Pad Area = 0.026 in
2
(See TB377)
SWITCHING SPECIFICATIONS
(V
GS
= 4.5V)
Turn-On Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-Off Time
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
V
DD
= 15V, I
D
2.6A,
R
L
= 5.8Ω, V
GS
=
4.5V,
R
GS
= 18Ω
(Figure 15)
-
-
-
-
-
-
-
12
46
31
31
-
90
-
-
-
-
95
ns
ns
ns
ns
ns
ns
-
-
-
-
-
-
110
133
157
o
C/W
o
C/W
o
C/W
2
HUF76113T3ST
Electrical Specifications
PARAMETER
T
A
= 25
o
C, Unless Otherwise Specified
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
SWITCHING SPECIFICATIONS
(V
GS
= 10V)
Turn-On Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-Off Time
GATE CHARGE SPECIFICATIONS
Total Gate Charge
Gate Charge at 5V
Threshold Gate Charge
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
CAPACITANCE SPECIFICATIONS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
NOTES:
2. Rated with R
θJA
=110
o
C/W measured using FR-4 board with 0.173 in
2
copper at 1000 seconds.
C
ISS
C
OSS
C
RSS
V
DS
= 25V, V
GS
= 0V,
f = 1MHz
(Figure 13)
-
-
-
625
310
60
-
-
-
pF
pF
pF
Q
g(TOT)
Q
g(5)
Q
g(TH)
Q
gs
Q
gd
V
GS
= 0V to 10V
V
GS
= 0V to 5V
V
GS
= 0V to 1V
V
DD
= 15V, I
D
2.7A,
R
L
= 5.5Ω
I
g(REF)
= 1.0mA
(Figure 14)
-
-
-
-
-
17.0
9.5
0.73
1.50
4.30
20.5
11.5
0.90
-
-
nC
nC
nC
nC
nC
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
V
DD
= 15V, I
D
4.7A,
R
L
= 3.2Ω, V
GS
=
10V,
R
GS
= 9.1Ω
(Figure 16)
-
-
-
-
-
-
-
4
21
31
25
-
40
-
-
-
-
85
ns
ns
ns
ns
ns
ns
Source to Drain Diode Specifications
PARAMETER
Source to Drain Diode Voltage
SYMBOL
V
SD
I
SD
= 4.7A
I
SD
= 2.7A
Reverse Recovery Time
Reverse Recovered Charge
t
rr
Q
RR
I
SD
= 2.7A, dI
SD
/dt = 100A/µs
I
SD
= 2.7A, dI
SD
/dt = 100A/µs
TEST CONDITIONS
MIN
-
-
-
-
TYP
-
-
-
-
MAX
1.25
1.00
44
46
UNITS
V
V
ns
nC
Typical Performance Curves
1.2
POWER DISSIPATION MULTIPLIER
1.0
0.8
0.6
0.4
0.2
0
0
25
50
75
100
125
150
T
A
, AMBIENT TEMPERATURE (
o
C)
I
D
, DRAIN CURRENT (A)
5
V
GS
= 10V, R
θJA
= 110
o
C/W
4
3
V
GS
= 4.5V, R
θJA
= 110
o
C/W
2
1
0
25
50
75
100
125
150
T
A
, AMBIENT TEMPERATURE (
o
C)
FIGURE 1. NORMALIZED POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
AMBIENT TEMPERATURE
3
HUF76113T3ST
Typical Performance Curves
2
1
THERMAL IMPEDANCE
Z
θ
JA
, NORMALIZED
(Continued)
0.1
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.02
0.01
P
DM
R
θ
JA
= 110
o
C/W
0.01
SINGLE PULSE
t
1
t
2
NOTES:
DUTY FACTOR: D = t
1
/t
2
PEAK T
J
= P
DM
x Z
θ
JA
x R
θ
JA
+ T
A
10
-1
10
0
10
1
10
2
10
3
0.001
10
-5
10
-4
10
-3
10
-2
t, RECTANGULAR PULSE DURATION (s)
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
500
R
θ
JA
= 110
o
C/W
I
DM
, PEAK CURRENT (A)
100
V
GS
= 5V
V
GS
= 10V
T
C
= 25
o
C
FOR TEMPERATURES
ABOVE 25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
I
=
I
25
150 - T
A
125
10
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
1
10
-5
10
-4
10
-3
10
-2
10
-1
t, PULSE WIDTH (s)
10
0
10
1
10
2
10
3
FIGURE 4. PEAK CURRENT CAPABILITY
200
100
I
D
, DRAIN CURRENT (A)
40
I
AS
, AVALANCHE CURRENT (A)
T
J
= MAX RATED
T
A
= 25
o
C
If R = 0
t
AV
= (L)(I
AS
)/(1.3*RATED BV
DSS
- V
DD
)
If R
0
t
AV
= (L/R)ln[(I
AS
*R)/(1.3*RATED BV
DSS
- V
DD
) +1]
STARTING T
J
= 25
o
C
100µs
10
10
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
DS(ON)
V
DSS(MAX)
= 30V
1
10
1ms
STARTING T
J
= 150
o
C
10ms
1
1
100
0.01
0.1
1
10
100
t
AV
, TIME IN AVALANCHE (ms)
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
NOTE: Refer to Intersil Application Notes AN9321 and AN9322.
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING
CAPABILITY
4
HUF76113T3ST
Typical Performance Curves
30
25
20
15
10
150
o
C
5
25
o
C
0
0
1
2
3
4
V
GS
, GATE TO SOURCE VOLTAGE (V)
5
-55
o
C
0
0
1
2
3
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
4
(Continued)
I
D
, DRAIN CURRENT (A)
I
D
, DRAIN CURRENT (A)
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
V
DD
= 15V
30
25
20
15
10
5
V
GS
= 3V
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
T
A
= 25
o
C
V
GS
= 10V
V
GS
= 5V
V
GS
= 4V
V
GS
= 3.5V
FIGURE 7. TRANSFER CHARACTERISTICS
FIGURE 8. SATURATION CHARACTERISTICS
80
r
DS(ON)
, DRAIN TO SOURCE
ON RESISTANCE (mΩ)
70
60
I
D
= 4.7A
50
40
I
D
= 0.5A
30
20
2
4
6
1.8
NORMALIZED DRAIN TO SOURCE
ON RESISTANCE
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
1.6
1.4
1.2
1.0
0.8
0.6
8
10
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
V
GS
= 10V, I
D
= 4.7A
-80
-40
0
40
80
120
160
V
GS
, GATE TO SOURCE VOLTAGE (V)
T
J
, JUNCTION TEMPERATURE (
o
C)
FIGURE 9. DRAIN TO SOURCE ON RESISTANCE vs GATE
VOLTAGE AND DRAIN CURRENT
1.2
1.1
NORMALIZED GATE
THRESHOLD VOLTAGE
1.0
0.9
0.8
0.7
0.6
-80
-40
0
40
80
120
160
T
J
, JUNCTION TEMPERATURE (
o
C)
FIGURE 10. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
1.2
NORMALIZED DRAIN TO SOURCE
BREAKDOWN VOLTAGE
V
GS
= V
DS
, I
D
= 250µA
I
D
= 250µA
1.1
1.0
0.9
-80
-40
0
40
80
120
160
T
J
, JUNCTION TEMPERATURE (
o
C)
FIGURE 11. NORMALIZED GATE THRESHOLD VOLTAGE vs
JUNCTION TEMPERATURE
FIGURE 12. NORMALIZED DRAIN TO SOURCE BREAKDOWN
VOLTAGE vs JUNCTION TEMPERATURE
5
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