型号
- 型号
- 关键词
Fast Page DRAM, 1MX4, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP2-26/20
厂商名称：Infineon(英飞凌)
下载文档| 型号 | HYB514400BTL-60 | HYB514400BT-60 | HYB514400BTL-70 | HYB514400BT-70 |
|---|---|---|---|---|
| 描述 | Fast Page DRAM, 1MX4, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP2-26/20 | Fast Page DRAM, 1MX4, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP2-26/20 | Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP2-26/20 | Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP2-26/20 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | TSOP | TSOP | TSOP | TSOP |
| 包装说明 | 0.300 INCH, PLASTIC, TSOP2-26/20 | 0.300 INCH, PLASTIC, TSOP2-26/20 | 0.300 INCH, PLASTIC, TSOP2-26/20 | 0.300 INCH, PLASTIC, TSOP2-26/20 |
| 针数 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | not_compliant | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| 最长访问时间 | 60 ns | 60 ns | 70 ns | 70 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN/BATTERY BACKUP REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/BATTERY BACKUP REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 17.14 mm | 17.14 mm | 17.14 mm | 17.14 mm |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| 内存宽度 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX4 | 1MX4 | 1MX4 | 1MX4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
| 封装等效代码 | TSSOP20/26,.36 | TSSOP20/26,.36 | TSSOP20/26,.36 | TSSOP20/26,.36 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 1024 | 1024 | 1024 | 1024 |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 自我刷新 | NO | NO | NO | NO |
| 最大待机电流 | 0.0002 A | 0.001 A | 0.0002 A | 0.001 A |
| 最大压摆率 | 0.11 mA | 0.11 mA | 0.1 mA | 0.1 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| 厂商名称 | Infineon(英飞凌) | - | Infineon(英飞凌) | Infineon(英飞凌) |
