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IBM25PPC440GP-3CC500C

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:IBM

厂商官网:http://www.ibm.com

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器件参数
参数名称
属性值
厂商名称
IBM
零件包装代码
BGA
包装说明
BGA, BGA552,24X24,40
针数
552
Reach Compliance Code
unknown
ECCN代码
3A001.A.3
其他特性
ALSO REQUIRES 3.3V SUPPLY
地址总线宽度
64
位大小
32
边界扫描
YES
最大时钟频率
66.66 MHz
外部数据总线宽度
64
格式
FIXED POINT
集成缓存
YES
JESD-30 代码
S-CBGA-B552
长度
25 mm
低功率模式
YES
端子数量
552
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装代码
BGA
封装等效代码
BGA552,24X24,40
封装形状
SQUARE
封装形式
GRID ARRAY
电源
1.8,2.5,3.3 V
认证状态
Not Qualified
座面最大高度
3.8 mm
速度
500 MHz
最大供电电压
1.9 V
最小供电电压
1.7 V
标称供电电压
1.8 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
宽度
25 mm
uPs/uCs/外围集成电路类型
MICROPROCESSOR, RISC
Base Number Matches
1
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PowerPC 440GP Embedded Processor Data Sheet
Features
• PowerPC
440 processor core operating up to
500MHz with 32KB I- and D-caches
• On-chip 8 KB SRAM
• Selectable processor:bus clock ratios of 3:1,
4:1, 5:1, 5:2, 7:2
• Double Data Rate (DDR) Synchronous DRAM
(SDRAM) 32/64-bit interface operating up to
133MHz
• External Peripheral Bus for up to eight devices
with external mastering
• DMA support for external peripherals, internal
UART and memory
• PCI-X V1.0a interface (32 or 64 bits, up to
133MHz) with support for conventional PCI
V2.2
• Programmable Interrupt Controller supports
interrupts from a variety of sources.
• Programmable General Purpose Timers (GPT)
• Two serial ports (16750 compatible UART)
• Two IIC interfaces
• General Purpose I/O (GPIO) interface available
• JTAG interface for board level testing
• Internal Processor Local Bus (PLB) runs at
DDR SDRAM interface frequency
• PowerPC processor boot from PCI memory
• Two Ethernet 10/100Mbps half- or full-duplex
interfaces. Operational modes supported are
MII, RMII, and SMII.
Description
Designed specifically to address high-end
embedded applications, the PowerPC 440GP
(PPC440GP) provides a high-performance, low
power solution that interfaces to a wide range of
peripherals by incorporating on-chip power
management features and lower power dissipation.
This chip contains a high-performance RISC
processor core, DDR SDRAM controller,8KB
SRAM, PCI-X bus interface, Ethernet interfaces,
control for external ROM and peripherals, DMA with
scatter-gather support, serial ports, IIC interface,
and general purpose I/O.
Technology: IBM CMOS SA-27E, 0.18
µ
m
(0.11 L
eff
), 5-layer metal
Package: 25mm, 552-ball Ceramic Ball Grid Array
(CBGA)
Power (estimated): Less than 4.0W. Less than
1.0 W in sleep mode
Supply voltages required: 3.3V, 2.5V, 1.8V
4/1/03
Page 1 of 64
PowerPC 440GP Embedded Processor Data Sheet
Contents
Ordering and PVR Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Address Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
PowerPC 440 Processor Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Internal Buses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
PCI-X Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
DDR SDRAM Memory Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
On-Chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
External Peripheral Bus Controller (EBC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Ethernet Controller Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
DMA Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Serial Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
IIC Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
General Purpose Timers (GPT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
General Purpose IO (GPIO) Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Universal Interrupt Controller (UIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Signal Lists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Heat Sink Mounting Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Spread Spectrum Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
DDR SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Strapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Figures
PPC440GP Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
25mm, 552-Ball CBGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Heat Sink Attached With Spring Clip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Heat Sink Attached With Adhesive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Input Setup and Hold Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Output Delay and Float Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
DDR SDRAM Write Cycle Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
DDR SDRAM Read Cycle Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Page 2 of 64
4/1/03
PowerPC 440GP Embedded Processor Data Sheet
Tables
System Memory Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
DCR Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Signals Listed Alphabetically . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Pin Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Signal Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Package Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Recommended DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Input Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
DC Power Supply Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Clocking Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Peripheral Interface Clock Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
I/O Specifications—All Speeds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
I/O Specifications—400, 466, and 500MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Strapping Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4/1/03
Page 3 of 64
PowerPC 440GP Embedded Processor Data Sheet
Ordering and PVR Information
For information on the availability of the following parts, contact your local IBM sales office.
Product
Name
PPC440GP
PPC440GP
PPC440GP
PPC440GP
PPC440GP
PPC440GP
PPC440GP
PPC440GP
Notes:
Order Part Number
1
IBM25PPC440GP-3CC400C
IBM25PPC440GP-3CC400CZ
IBM25PPC440GP-3CC400E
IBM25PPC440GP-3CC400EZ
IBM25PPC440GP-3CC466C
IBM25PPC440GP-3CC466CZ
IBM25PPC440GP-3CC500C
IBM25PPC440GP-3CC500CZ
Processor
Frequency
400MHz
400MHz
400MHz
400MHz
466MHz
466MHz
500MHz
500MHz
Package
25mm, 552 CBGA
25mm, 552 CBGA
25mm, 552 CBGA
25mm, 552 CBGA
25mm, 552 CBGA
25mm, 552 CBGA
25mm, 552 CBGA
25mm, 552 CBGA
Rev
Level
C
C
C
C
C
C
C
C
PVR Value
0x40120481
0x40120481
0x40120481
0x40120481
0x40120481
0x40120481
0x40120481
0x40120481
JTAG ID
0x02052049
0x02052049
0x02052049
0x02052049
0x02052049
0x02052049
0x02052049
0x02052049
1. Z at the end of the Order Part Number indicates a tape-and-reel shipping package. Otherwise, the chips are shipped in a tray.
Each part number contains a revision code. This is the die mask revision number and is included in the part
number for identification purposes only.
The PVR (Processor Version Register) is software accessible and contains additional information about the
revision level of the part. Refer to the
PPC440GP User’s Manual
for details on the register content.
Order Part Number Key
IBM25PPC440GP-3CC500Ex
Shipping Package:
Blank = Tray
Z
= Tape and reel
IBM Part Number
Case Temperature Range
C = -40°C to +85°C
E = -40°C to +105°C
Processor Speed
Revision Level
Grade 3 Reliability
Package (CBGA)
Page 4 of 64
4/1/03
PowerPC 440GP Embedded Processor Data Sheet
PPC440GP Functional Block Diagram
Universal
Interrupt
Controller
Clock
Control
Reset
Timers
MMU
PPC440
Processor Core
JTAG
32KB
D-Cache
Trace
32KB
I-Cache
Arb
On-chip Peripheral Bus (OPB)
GP
Timers
GPIO
IIC
x2
UART
x2
Power
Mgmt
DCRs
45 internal
13 external
DCR Bus
SRAM
8KB
DMA
Controller
(4-Channel)
OPB
Bridge
Processor Local Bus (PLB)
Ethernet
x2
External
External
Bus Master
Bus
Controller
Controller
66 MHz max
32-bit addr
32-bit data
MAL
DDR SDRAM
Controller
133MHz max
13-bit addr
32/64-bit data
PCI-X
Bridge
133 MHz max
1 MII
or
2 RMII
or
2 SMII
The PPC440GP is designed using the IBM Microelectronics Blue Logic
methodology in which major
functional blocks are integrated together to create an application-specific product (ASIC). This approach
provides a consistent way to create complex ASICs using IBM CoreConnect Bus
Architecture.
Note:
IBM CoreConnect buses provide:
• 128-bit PLB interfaces up to 133.33MHz, 2.1GB/s
• 32-bit OPB interfaces up to 66.66MHz, 266MB/s
Address Maps
The PPC440GP incorporates two address maps. The first is a fixed processor system memory address map.
This address map defines the possible contents of various address regions which the processor can access.
The second address map is for Device Configuration Registers (DCRs). The DCRs are accessed by software
running on the PPC440GP processor through the use of
mtdcr
and
mfdcr
instructions.
4/1/03
Page 5 of 64
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参数对比
与IBM25PPC440GP-3CC500C相近的元器件有:IBM25PPC440GP-3CC400EZ、IBM25PPC440GP-3CC500CZ、IBM25PPC440GP-3CC466C、IBM25PPC440GP-3CC466CZ、IBM25PPC440GP-3CC400E。描述及对比如下:
型号 IBM25PPC440GP-3CC500C IBM25PPC440GP-3CC400EZ IBM25PPC440GP-3CC500CZ IBM25PPC440GP-3CC466C IBM25PPC440GP-3CC466CZ IBM25PPC440GP-3CC400E
描述 RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552 RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552 RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552 RISC Microprocessor, 32-Bit, 466MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552 RISC Microprocessor, 32-Bit, 466MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552 RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552
厂商名称 IBM IBM IBM IBM IBM IBM
零件包装代码 BGA BGA BGA BGA BGA BGA
包装说明 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40 BGA, BGA552,24X24,40
针数 552 552 552 552 552 552
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN代码 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
其他特性 ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
地址总线宽度 64 64 64 64 64 64
位大小 32 32 32 32 32 32
边界扫描 YES YES YES YES YES YES
最大时钟频率 66.66 MHz 66.66 MHz 66.66 MHz 66.66 MHz 66.66 MHz 66.66 MHz
外部数据总线宽度 64 64 64 64 64 64
格式 FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
集成缓存 YES YES YES YES YES YES
JESD-30 代码 S-CBGA-B552 S-CBGA-B552 S-CBGA-B552 S-CBGA-B552 S-CBGA-B552 S-CBGA-B552
长度 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm
低功率模式 YES YES YES YES YES YES
端子数量 552 552 552 552 552 552
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 BGA BGA BGA BGA BGA BGA
封装等效代码 BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40 BGA552,24X24,40
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
电源 1.8,2.5,3.3 V 1.8,2.5,3.3 V 1.8,2.5,3.3 V 1.8,2.5,3.3 V 1.8,2.5,3.3 V 1.8,2.5,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.8 mm 3.8 mm 3.8 mm 3.8 mm 3.8 mm 3.8 mm
速度 500 MHz 400 MHz 500 MHz 466 MHz 466 MHz 400 MHz
最大供电电压 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
最小供电电压 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
标称供电电压 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
端子形式 BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
宽度 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm
uPs/uCs/外围集成电路类型 MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1 1 1 1 1
最高工作温度 85 °C - 85 °C 85 °C 85 °C -
最低工作温度 -40 °C - -40 °C -40 °C -40 °C -
温度等级 INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL -
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DAC161P997类芯片实现了数字信号转换成电流4~20mA传输(两线制供电),是否有一种方案或...
sxbo99 电源技术
mcsdk edma3_lld 编译出错
我使用的是mcsdk_1_01_00_02,当进入目录edma3_lld_02_11_09_08/e...
倚楼、听风雨 DSP 与 ARM 处理器
RenamePartition(...) 编译错误
使用RenamePartition函数想给某个partition改个名字,编译总是通不过,错误如下:...
zzy360 嵌入式系统
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