Standard SRAM, 128KX8, 17ns, CMOS, CDIP32, 0.400 INCH, CERAMIC, DIP-32
厂商名称:IDT (Integrated Device Technology)
下载文档型号 | IDT71024S17DB | IDT71024S25DB | IDT71024S15DB | IDT71024S20P | IDT71024S17P | IDT71024S15P | IDT71024S20DB |
---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 128KX8, 17ns, CMOS, CDIP32, 0.400 INCH, CERAMIC, DIP-32 | Standard SRAM, 128KX8, 25ns, CMOS, CDIP32, 0.400 INCH, CERAMIC, DIP-32 | Standard SRAM, 128KX8, 15ns, CMOS, CDIP32, 0.400 INCH, CERAMIC, DIP-32 | Standard SRAM, 128KX8, 20ns, CMOS, PDIP32, 0.400 INCH, PLASTIC, DIP-32 | Standard SRAM, 128KX8, 17ns, CMOS, PDIP32, 0.400 INCH, PLASTIC, DIP-32 | Standard SRAM, 128KX8, 15ns, CMOS, PDIP32, 0.400 INCH, PLASTIC, DIP-32 | Standard SRAM, 128KX8, 20ns, CMOS, CDIP32, 0.400 INCH, CERAMIC, DIP-32 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
包装说明 | 0.400 INCH, CERAMIC, DIP-32 | 0.400 INCH, CERAMIC, DIP-32 | 0.400 INCH, CERAMIC, DIP-32 | 0.400 INCH, PLASTIC, DIP-32 | 0.400 INCH, PLASTIC, DIP-32 | 0.400 INCH, PLASTIC, DIP-32 | 0.400 INCH, CERAMIC, DIP-32 |
针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A001.A.2.C |
最长访问时间 | 17 ns | 25 ns | 15 ns | 20 ns | 17 ns | 15 ns | 20 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-GDIP-T32 | R-GDIP-T32 | R-GDIP-T32 | R-PDIP-T32 | R-PDIP-T32 | R-PDIP-T32 | R-GDIP-T32 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | - | - | - | -55 °C |
组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
可输出 | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP32,.4 | DIP32,.4 | DIP32,.4 | DIP32,.4 | DIP32,.4 | DIP32,.4 | DIP32,.4 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.015 A | 0.015 A | 0.015 A | 0.01 A | 0.01 A | 0.01 A | 0.015 A |
最小待机电流 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
最大压摆率 | 0.17 mA | 0.145 mA | 0.18 mA | 0.14 mA | 0.15 mA | 0.155 mA | 0.16 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | - | - | 38535Q/M;38534H;883B |