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IDT74SSTVN16859PAG

D Flip-Flop, SSTV Series, 1-Func, Positive Edge Triggered, 13-Bit, True Output, PDSO64, GREEN, TSSOP-64

器件类别:逻辑    逻辑   

厂商名称:IDT (Integrated Device Technology)

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
零件包装代码
TSSOP
包装说明
TSSOP, TSSOP64,.32,20
针数
64
Reach Compliance Code
unknown
其他特性
220 MHZ FOR PC3200 OPERATION
系列
SSTV
JESD-30 代码
R-PDSO-G64
JESD-609代码
e3
长度
17 mm
逻辑集成电路类型
D FLIP-FLOP
湿度敏感等级
1
位数
13
功能数量
1
端子数量
64
最高工作温度
70 °C
最低工作温度
输出极性
TRUE
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装等效代码
TSSOP64,.32,20
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)
260
电源
2.5 V
传播延迟(tpd)
2.7 ns
认证状态
Not Qualified
座面最大高度
1.1 mm
最大供电电压 (Vsup)
2.7 V
最小供电电压 (Vsup)
2.3 V
标称供电电压 (Vsup)
2.5 V
表面贴装
YES
温度等级
COMMERCIAL
端子面层
Matte Tin (Sn) - annealed
端子形式
GULL WING
端子节距
0.5 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
30
触发器类型
POSITIVE EDGE
宽度
6.1 mm
最小 fmax
200 MHz
Base Number Matches
1
文档预览
IDT74SSTVN16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
COMMERCIAL TEMPERATURE RANGE
13-BIT TO 26-BIT REGISTERED
BUFFER WITH SSTL I/O
IDT74SSTVN16859
FEATURES:
1:2 registered output buffer
2.3V to 2.7V operation for PC1600, PC2100, and PC2700
2.5V to 2.7V operation for PC3200
Single bit propagation delay, TSSOP : 2.2ns, VFQFPN : 1.8ns
SSTL_2 Class I style data inputs/outputs
Differential CLK input
RESET
control compatible with LVCMOS levels
Latch-up performance exceeds 100mA
ESD >2000V per MIL-STD-883, Method 3015; >200V using
machine model (C = 200pF, R = 0)
• Available in 56 pin VFQFPN and 64 pin TSSOP packages
APPLICATIONS:
The SSTVN16859 is a 13-bit to 26-bit registered buffer designed for
2.3V-2.7V V
DD
for PC1600 - PC2700 and 2.5V-2.7V V
DD
for PC3200, and
supports low standby operation. All data inputs and outputs are SSTL_2
level compatible with JEDEC standard for SSTL_2.
RESET
is an LVCMOS input since it must operate predictably during the
power-up phase.
RESET,
which can be operated independent of CLK and
CLK,
must be held in the low state during power-up in order to ensure
predictable outputs (low state) before a stable clock has been applied.
RESET,
when in the low state, will disable all input receivers, reset all
registers, and force all outputs to a low state, before a stable clock has been
applied. With inputs held low and a stable clock applied, outputs will remain
low during the Low-to-High transition of
RESET.
DESCRIPTION:
• Ideally suited for stacked DIMM DDR registered applications
• Along with CSPT857C/D, Zero Delay PLL Clock buffer, provides
complete solution for DDR1 DIMMs
FUNCTIONAL BLOCK DIAGRAM
RESET
51
CLK
CLK
48
49
V
REF
D
1
45
35
1D
C1
R
32
Q
1B
16
Q
1A
TO 12 OTHER CHANNELS
COMMERCIAL TEMPERATURE RANGE
1
c
2004 Integrated Device Technology, Inc.
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
JANUARY 2004
DSC-6836/14
IDT74SSTVN16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
COMMERCIAL TEMPERATURE RANGE
PIN CONFIGURATIONS
V
DDQ
V
DDQ
56 Q
8A
GND
Q
13A
V
DD
D
12
V
DDQ
Q
10A
Q
11A
Q
12A
Q
9A
D
13
43 D
11
Q
13A
Q
12A
Q
11A
Q
10A
Q
9A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
V
DDQ
GND
D
13
D
12
V
DD
V
DDQ
GND
D
11
D
10
D
9
GND
D
8
D
7
RESET
GND
CLK
CLK
V
DDQ
V
DD
V
REF
D
6
GND
D
5
D
4
D
3
GND
V
DDQ
V
DD
D
2
D
1
GND
V
DDQ
Q
7A
1
Q
6A
Q
5A
Q
4A
Q
3A
Q
2A
Q
1A
Q
13B
V
DDQ
Q
12B
Q
11B
Q
10B
Q
9B
Q
8B
14
GND
42 D
10
D
9
D
8
D
7
RESET
GND
CLK
CLK
V
DDQ
V
DD
V
REF
D
6
D
5
29 D
4
V
DDQ
GND
Q
8A
Q
7A
Q
6A
Q
5A
Q
4A
Q
3A
Q
2A
GND
Q
1A
Q
13B
V
DDQ
Q
12B
Q
7B
15
V
DDQ
V
DDQ
V
DDQ
Q
6B
Q
5B
Q
4B
Q
3B
Q
2B
Q
1B
V
DD
D
3
28
Q
11B
Q
10B
Q
9B
D
1
D
2
VFQFPN
TOP VIEW
Q
8B
Q
7B
Q
6B
GND
V
DDQ
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
V
DD
or V
DDQ
V
I
(2)
V
O
(3)
I
IK
I
OK
I
O
V
DD
T
STG
Description
Supply Voltage Range
Input Voltage Range
Output Voltage Range
Input Clamp Current, V
I
< 0
Output Clamp Current,
V
O
< 0 or V
O
> V
DDQ
Continuous Output Current,
V
O
= 0 to V
DDQ
Continuous Current through each
V
DD
, V
DDQ
or GND
Storage Temperature Range
–65 to +150
°C
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. The input and output negative voltage ratings may be exceeded if the ratings of the
I/P and O/P clamp current are observed.
3. The output current will flow if the following conditions are observed:
a) Output in HIGH state
b) V
O
= V
DDQ
Q
5B
Q
4B
Max.
–0.5 to 3.6
–0.5 to V
DD
+0.5
–0.5 to V
DDQ
+0.5
–50
±50
±50
±100
Unit
V
V
V
mA
mA
mA
mA
RESET
H
H
H
L
Q
3B
Q
2B
Q
1B
TSSOP
TOP VIEW
FUNCTION TABLE
(1)
Input
CLK
L or H
X
CLK
L or H
X
D
L
H
X
X
Q Outputs
L
H
Qo
(2)
L
NOTES:
1. H = HIGH Voltage Level
L = LOW Voltage Level
X = Don’t Care
= LOW to HIGH
= HIGH to LOW
2. Qo = Output level before the indicated steady-state conditions were established.
2
IDT74SSTVN16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
COMMERCIAL TEMPERATURE RANGE
PIN DESCRIPTION
Pin Names
Q
1
- Q
13
GND
V
DDQ
V
DD
RESET
V
REF
CLK
CLK
D
1
- D
13
Center PAD
Description
Data Output
Ground
Output-stage drain power voltage
Logic power voltage
Asynchronous reset input - resets registers and disables data and clock differential input recievers
Input reference voltage
Positive master clock input
Negative master clock input
Data Input - clocked in on the crossing of the rising edge of CLK and the falling edge of
CLK
Ground (MLF package only)
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE FOR PC1600 -
PC2700
Following Conditions Apply Unless Otherwise Specified:
Operating Condition: T
A
= 0°C to +70°C, V
DD
= 2.5V ±0.2V, V
DDQ
= 2.5V ±0.2V
Symbol
V
IK
V
OH
V
OL
I
I
I
DD
All Inputs
Static Standby
Static Operating
Dynamic Operating (Clock Only)
I
DDD
Dynamic Operating
(Per Each Data Input)
Data Inputs
C
I
CLK and
CLK
RESET
(1)
Parameter
Control Inputs
Test Conditions
V
DD
= 2.3V, I
I
=
−18mA
V
DD
= 2.3V to 2.7V, I
OH
= -100μA
V
DD
= 2.3V, I
OH
= -8mA
V
DD
= 2.3V to 2.7V, I
OL
= 100μA
V
DD
= 2.3V, I
OL
= 8mA
V
DD
= 2.7V,VI = V
DD
or GND
I
O
= 0, V
DD
= 2.7V,
RESET
= GND
I
O
= 0, V
DD
= 2.7V,
RESET
= V
DD
, V
I
= V
IH (AC)
or V
IL (AC)
I
O
= 0, V
DD
= 2.7V,
RESET
= V
DD
, V
I
= V
IH (AC)
or V
IL (AC)
,
CLK and
CLK
Switching 50% Duty Cycle.
I
O
= 0, V
DD
= 2.7V,
RESET
= V
DD
, V
I
= V
IH (AC)
or V
IL (AC)
,
CLK and
CLK
Switching 50% Duty Cycle. One Data Input
Switching at Half Clock Frequency, 50% Duty Cycle.
V
DD
= 2.5V, V
I
= V
REF
±
310mV
V
ICR
= 1.25V, V
I (PP)
= 360mV
V
I
= V
DD
or GND
Min.
V
DD
– 0.2
1.95
Typ.
6
43
Max.
–1.2
0.2
0.35
±5
0.01
20
Unit
V
V
V
μA
mA
μA/Clock
MHz
μA/Clock
MHz/Data
Input
2
2
2
3
3
3
pF
NOTE:
1. Power dissipation levels will allow operation at DDR333 speeds without excessive die temperature.
3
IDT74SSTVN16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
COMMERCIAL TEMPERATURE RANGE
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE FOR PC3200
Following Conditions Apply Unless Otherwise Specified:
Operating Condition: T
A
= 0°C to +70°C, V
DD
= 2.6V ±0.1V, V
DDQ
= 2.6V ±0.1V
Symbol
V
IK
V
OH
V
OL
I
I
I
DD
All Inputs
Static Standby
Static Operating
Dynamic Operating (Clock Only)
I
DDD
Dynamic Operating
(Per Each Data Input)
(1)
Data Inputs
C
I
CLK and
CLK
RESET
Parameter
Control Inputs
Test Conditions
V
DD
= 2.5V, I
I
=
−18mA
V
DD
= 2.5V to 2.7V, I
OH
= -100μA
V
DD
= 2.5V, I
OH
= -8mA
V
DD
= 2.5V to 2.7V, I
OL
= 100μA
V
DD
= 2.5V, I
OL
= 8mA
V
DD
= 2.7V,VI = V
DD
or GND
I
O
= 0, V
DD
= 2.7V,
RESET
= GND
I
O
= 0, V
DD
= 2.7V,
RESET
= V
DD
, V
I
= V
IH (AC)
or V
IL (AC)
I
O
= 0, V
DD
= 2.7V,
RESET
= V
DD
, V
I
= V
IH (AC)
or V
IL (AC)
,
CLK and
CLK
Switching 50% Duty Cycle.
I
O
= 0, V
DD
= 2.7V,
RESET
= V
DD
, V
I
= V
IH (AC)
or V
IL (AC)
,
CLK and
CLK
Switching 50% Duty Cycle. One Data Input
Switching at Half Clock Frequency, 50% Duty Cycle.
V
DD
= 2.6V, V
I
= V
REF
±
310mV
V
ICR
= 1.3V, V
I (PP)
= 360mV
V
I
= V
DD
or GND
2
2
2
3
3
3
pF
43
Min.
V
DD
– 0.2
1.95
Typ.
6
Max.
–1.2
0.2
0.35
±5
0.01
20
μA/Clock
MHz
μA/Clock
MHz/Data
Input
μA
mA
V
Unit
V
V
NOTE:
1. Power dissipation levels will allow operation at DDR400 speeds without excessive die temperature.
OPERATING CHARACTERISTICS, T
A
= 25ºC
(1)
Symbol
V
DD
V
DDQ
V
REF
V
TT
V
I
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
ICR
V
I (PP)
I
OH
I
OL
T
A
NOTE:
1.
The
RESET
input of the device must be held at V
DD
or GND to ensure proper device operation.
Parameter
Supply Voltage
Output Supply Voltage
Reference Voltage (V
REF
= V
DDQ
/2)
Termination Voltage
Input Voltage
AC High-Level Input Voltage
AC Low-Level Input Voltage
DC High-Level Input Voltage
DC Low-Level Input Voltage
High-Level Input Voltage
Low-Level Input Voltage
Common-Mode Input Range
Peak-to-Peak Input Voltage
High-Level Output Current
Low-Level Output Current
Operating Free-Air Temperature
Data Inputs
Data Inputs
Data Inputs
Data Inputs
RESET
RESET
CLK,
CLK
CLK,
CLK
PC1600 - PC12700
PC3200
PC1600 - PC2700
PC3200
Min.
V
DDQ
2.3
2.5
1.15
1.25
V
REF
– 40mV
0
V
REF
+ 310mV
V
REF
+ 150mV
1.7
0.97
360
0
Typ.
(1)
2.5
2.6
1.25
1.3
V
REF
Max.
2.7
2.7
2.7
1.35
1.35
V
REF
+ 40mV
V
DD
V
REF
– 310mV
V
REF
– 150mV
0.7
1.53
– 16
16
+70
Unit
V
V
V
V
V
V
V
V
V
V
V
V
mV
mA
°C
4
IDT74SSTVN16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
COMMERCIAL TEMPERATURE RANGE
TIMING REQUIREMENTS OVER RECOMMENDED OPERATING FREE-AIR
TEMPERATURE RANGE
PC1600 - PC2700
Symbol
CLOCK
PC3200
Min.
2.5
0.65
0.75
0.65
0.8
Max.
220
22
22
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
Parameter
Clock Frequency
Pulse Duration, CLK,
CLK
HIGH or LOW
Differential Inputs Active Time
(1)
Differential Inputs Inactive Time
(2)
Setup Time, Fast Slew Rate
(3, 5)
Setup Time, Slow Slew Rate
(4, 5)
Min.
2.5
Data Before CLK↑, CLK↓
Data Before CLK↑, CLK
0.65
0.75
0.75
0.9
Max.
200
22
22
tw
t
ACT
t
INACT
t
SU
t
H
Hold Time, Fast Slew Rate
(3,5)
Hold Time, Slow Slew Rate
(2,5)
NOTES:
1. Data inputs must be low a minimum time of t
ACT
max., after
RESET
is taken HIGH.
2. Data and clock inputs must be held at valid levels (not floating) a minimum time of t
INACT
max., after
RESET
is taken LOW.
3. For data signal input slew rate is
≥1V/ns.
4. For data signal input slew rate is
≥0.5V/ns
and <1V/ns.
5. CLK,
CLK
signal input slew rates are
≥1V/ns.
SWITCHING CHARACTERISTICS OVER RECOMMENDED FREE-AIR OPERATING
RANGE (UNLESS OTHERWISE NOTED)
PC1600 - PC2700
Symbol
f
MAX
t
PDM
t
PDMSS
t
PHL
Parameter
CLK and
CLK
to Q
CLK and
CLK
to Q (simultaneous switching)
RESET
to Q
Package
TSSOP, VFQFPN
TSSOP
VFQFPN
TSSOP
VFQFPN
TSSOP, VFQFPN
Min.
200
1.1
1.1
Max.
2.4
2.2
2.7
2.5
5
PC3200
Min.
220
1.1
1.1
Max.
2.2
1.8
2.5
((TBD))
5
ns
ns
Unit
MHz
ns
5
查看更多>
参数对比
与IDT74SSTVN16859PAG相近的元器件有:IDT74SSTVN16859PAG8、IDT74SSTVN16859NLG、IDT74SSTVN16859NLG8。描述及对比如下:
型号 IDT74SSTVN16859PAG IDT74SSTVN16859PAG8 IDT74SSTVN16859NLG IDT74SSTVN16859NLG8
描述 D Flip-Flop, SSTV Series, 1-Func, Positive Edge Triggered, 13-Bit, True Output, PDSO64, GREEN, TSSOP-64 D Flip-Flop, SSTV Series, 1-Func, Positive Edge Triggered, 13-Bit, True Output, PDSO64, GREEN, TSSOP-64 D Flip-Flop, SSTV Series, 1-Func, Positive Edge Triggered, 13-Bit, True Output, PQCC56, GREEN, PLASTIC, VFQFN-56 D Flip-Flop, SSTV Series, 1-Func, Positive Edge Triggered, 13-Bit, True Output, PQCC56, GREEN, PLASTIC, VFQFN-56
是否Rohs认证 符合 符合 符合 符合
零件包装代码 TSSOP TSSOP QFN QFN
包装说明 TSSOP, TSSOP64,.32,20 TSSOP, TSSOP64,.32,20 GREEN, PLASTIC, VFQFN-56 GREEN, PLASTIC, VFQFN-56
针数 64 64 56 56
Reach Compliance Code unknown unknown unknown unknown
其他特性 220 MHZ FOR PC3200 OPERATION 220 MHZ FOR PC3200 OPERATION 220 MHZ FOR PC3200 OPERATION 220 MHZ FOR PC3200 OPERATION
系列 SSTV SSTV SSTV SSTV
JESD-30 代码 R-PDSO-G64 R-PDSO-G64 S-PQCC-N56 S-PQCC-N56
JESD-609代码 e3 e3 e3 e3
长度 17 mm 17 mm 8 mm 8 mm
逻辑集成电路类型 D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
湿度敏感等级 1 1 3 3
位数 13 13 13 13
功能数量 1 1 1 1
端子数量 64 64 56 56
最高工作温度 70 °C 70 °C 70 °C 70 °C
输出极性 TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP TSSOP VQCCN VQCCN
封装等效代码 TSSOP64,.32,20 TSSOP64,.32,20 LCC56,.31SQ,20 LCC56,.31SQ,20
封装形状 RECTANGULAR RECTANGULAR SQUARE SQUARE
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE
峰值回流温度(摄氏度) 260 260 260 260
电源 2.5 V 2.5 V 2.5 V 2.5 V
传播延迟(tpd) 2.7 ns 2.7 ns 2.5 ns 2.5 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.1 mm 1.1 mm 1 mm 1 mm
最大供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V
最小供电电压 (Vsup) 2.3 V 2.3 V 2.3 V 2.3 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
端子形式 GULL WING GULL WING NO LEAD NO LEAD
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 DUAL DUAL QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30 30
触发器类型 POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
宽度 6.1 mm 6.1 mm 8 mm 8 mm
最小 fmax 200 MHz 200 MHz 200 MHz 200 MHz
Base Number Matches 1 1 1 1
厂商名称 - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
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器件捷径:
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
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