INTEL-82945PM

Memory Controller, CMOS, PBGA1466

厂商官网：http://www.intel.com/

器件参数

参数名称

属性值

厂商名称

Intel(英特尔)

包装说明

FBGA, BGA1466,41X41,32

Reach Compliance Code

compliant

JESD-30 代码

S-PBGA-B1466

端子数量

1466

封装主体材料

PLASTIC/EPOXY

封装代码

FBGA

封装等效代码

BGA1466,41X41,32

封装形状

SQUARE

封装形式

GRID ARRAY, FINE PITCH

电源

1.5,2.5,3.3 V

认证状态

Not Qualified

表面贴装

YES

技术

CMOS

端子形式

BALL

端子节距

0.8 mm

端子位置

BOTTOM

参数对比

与INTEL-82945PM相近的元器件有：INTEL-82945GU、INTEL-82945GT、INTEL-82945GME、INTEL-82945GMS。描述及对比如下：

型号	INTEL-82945PM	INTEL-82945GU	INTEL-82945GT	INTEL-82945GME	INTEL-82945GMS
描述	Memory Controller, CMOS, PBGA1466	Memory Controller, CMOS, PBGA1249	Memory Controller, CMOS, PBGA1466	Memory Controller, CMOS, PBGA1466	Memory Controller, CMOS, PBGA988
厂商名称	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)
包装说明	FBGA, BGA1466,41X41,32	FBGA, BGA1249,50X50,32	FBGA, BGA1466,41X41,32	FBGA, BGA1466,41X41,32	FBGA, BGA988,33X33,32
Reach Compliance Code	compliant	compliant	compliant	compliant	compli
JESD-30 代码	S-PBGA-B1466	S-PBGA-B1249	S-PBGA-B1466	S-PBGA-B1466	S-PBGA-B988
端子数量	1466	1249	1466	1466	988
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	FBGA	FBGA	FBGA	FBGA	FBGA
封装等效代码	BGA1466,41X41,32	BGA1249,50X50,32	BGA1466,41X41,32	BGA1466,41X41,32	BGA988,33X33,32
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH
电源	1.5,2.5,3.3 V	1.5,2.5,3.3 V	1.5,2.5,3.3 V	1.5,2.5,3.3 V	1.5,2.5,3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
表面贴装	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS
端子形式	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM