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IRGSL6B60KDTRL

Insulated Gate Bipolar Transistor, 13A I(C), 600V V(BR)CES, N-Channel, TO-262AA, TO-262, 3 PIN

器件类别:分立半导体    晶体管   

厂商名称:International Rectifier ( Infineon )

厂商官网:http://www.irf.com/

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
International Rectifier ( Infineon )
零件包装代码
TO-262AA
包装说明
IN-LINE, R-PSIP-T3
针数
3
Reach Compliance Code
compliant
外壳连接
COLLECTOR
最大集电极电流 (IC)
13 A
集电极-发射极最大电压
600 V
配置
SINGLE WITH BUILT-IN DIODE
JEDEC-95代码
TO-262AA
JESD-30 代码
R-PSIP-T3
JESD-609代码
e0
元件数量
1
端子数量
3
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
IN-LINE
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
N-CHANNEL
认证状态
Not Qualified
表面贴装
NO
端子面层
TIN LEAD
端子形式
THROUGH-HOLE
端子位置
SINGLE
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
MOTOR CONTROL
晶体管元件材料
SILICON
标称断开时间 (toff)
258 ns
标称接通时间 (ton)
45 ns
Base Number Matches
1
文档预览
PD - 94381E
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
C
IRGB6B60KD
IRGS6B60KD
IRGSL6B60KD
V
CES
= 600V
I
C
= 7.0A, T
C
=100°C
Features
• Low VCE (on) Non Punch Through IGBT Technology.
• Low Diode VF.
• 10µs Short Circuit Capability.
• Square RBSOA.
• Ultrasoft Diode Reverse Recovery Characteristics.
• Positive VCE (on) Temperature Coefficient.
G
E
t
sc
> 10µs, T
J
=150°C
Benefits
• Benchmark Efficiency for Motor Control.
• Rugged Transient Performance.
• Low EMI.
• Excellent Current Sharing in Parallel Operation.
n-channel
V
CE(on)
typ. = 1.8V
TO-220AB
IRGB6B60KD
D
2
Pak
IRGS6B60KD
Max.
600
13
7.0
26
26
13
7.0
26
± 20
90
36
-55 to +150
TO-262
IRGSL6B60KD
Units
V
Absolute Maximum Ratings
Parameter
V
CES
I
C
@ T
C
= 25°C
I
C
@ T
C
= 100°C
I
CM
I
LM
I
F
@ T
C
= 25°C
I
F
@ T
C
= 100°C
I
FM
V
GE
P
D
@ T
C
= 25°C
P
D
@ T
C
= 100°C
T
J
T
STG
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current
Clamped Inductive Load Current„
Diode Continuous Forward Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
A
V
W
°C
300 (0.063 in. (1.6mm) from case)
Thermal Resistance
Parameter
R
θJC
R
θJC
R
θCS
R
θJA
R
θJA
Wt
Junction-to-Case - IGBT
Junction-to-Case - Diode
Case-to-Sink, flat, greased surface
Junction-to-Ambient, typical socket mount

Junction-to-Ambient (PCB Mount, steady state)
‚
Weight
Min.
–––
–––
–––
–––
–––
–––
Typ.
–––
–––
0.50
–––
–––
1.44
Max.
1.4
4.4
–––
62
40
–––
Units
°C/W
g
www.irf.com
1
8/18/04
IRG/B/S/SL6B60KD
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
V
(BR)CES
∆V
(BR)CES
/∆T
J
V
CE(on)
V
GE(th)
V
GE(th)
/
T
J
g
fe
I
CES
V
FM
I
GES
Parameter
Min. Typ.
Collector-to-Emitter Breakdown Voltage 600 –––
Temperature Coeff. of Breakdown Voltage ––– 0.3
Collector-to-Emitter Saturation Voltage
1.5 1.80
––– 2.20
Gate Threshold Voltage
3.5 4.5
Temperature Coeff. of Threshold Voltage ––– -10
Forward Transconductance
––– 3.0
Zero Gate Voltage Collector Current
––– 1.0
––– 200
Diode Forward Voltage Drop
––– 1.25
––– 1.20
Gate-to-Emitter Leakage Current
––– –––
Max. Units
Conditions
–––
V
V
GE
= 0V, I
C
= 500µA
––– V/°C V
GE
= 0V, I
C
= 1.0mA, (25°C-150°C)
2.20
V
I
C
= 5.0A, V
GE
= 15V
2.50
I
C
= 5.0A,V
GE
= 15V,
T
J
= 150°C
5.5
V
V
CE
= V
GE
, I
C
= 250µA
––– mV/°C V
CE
= V
GE
, I
C
= 1.0mA, (25°C-150°C)
–––
S
V
CE
= 50V, I
C
= 5.0A, PW=80µs
150
µA
V
GE
= 0V, V
CE
= 600V
500
V
GE
= 0V, V
CE
= 600V, T
J
= 150°C
1.45
I
C
= 5.0A
1.40
V
I
C
= 5.0A
T
J
= 150°C
±100 nA
V
GE
= ±20V
Ref.Fig.
5, 6,7
9,10,11
9,10,11
12
8
Switching Characteristics @ T
J
= 25°C (unless otherwise specified)
Qg
Qge
Qgc
E
on
E
off
E
tot
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
tot
t
d(on)
t
r
t
d(off)
t
f
C
ies
C
oes
C
res
RBSOA
SCSOA
Erec
t
rr
I
rr
Parameter
Total Gate Charge (turn-on)
Gate - Emitter Charge (turn-on)
Gate - Collector Charge (turn-on)
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Reverse Bias Safe Operting Area
Short Circuit Safe Operting Area
Reverse Recovery energy of the diode
Diode Reverse Recovery time
Diode Peak Reverse Recovery Current
Min.
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Ref.Fig.
Max. Units
Conditions
–––
I
C
= 5.0A
–––
nC
V
CC
= 400V
CT1
–––
V
GE
= 15V
CT4
210
µJ
I
C
= 5.0A, V
CC
= 400V
245
V
GE
= 15V,R
G
= 100Ω, L =1.4mH
455
Ls = 150nH
T
J
= 25°C
ƒ
CT4
34
I
C
= 5.0A, V
CC
= 400V
26
V
GE
= 15V, R
G
= 100Ω L =1.4mH
230
ns
Ls = 150nH, T
J
= 25°C
22
CT4
260
I
C
= 5.0A, V
CC
= 400V
13,15
300
µJ
V
GE
= 15V,R
G
= 100Ω, L =1.4mH
WF1WF2
560
Ls = 150nH
T
J
= 150°C
ƒ
14, 16
37
I
C
= 5.0A, V
CC
= 400V
CT4
26
V
GE
= 15V, R
G
= 100Ω L =1.4mH
255
ns
Ls = 150nH, T
J
= 150°C
WF1
27
WF2
–––
V
GE
= 0V
–––
pF
V
CC
= 30V
–––
f = 1.0MHz
4
T
J
= 150°C, I
C
= 26A, Vp =600V
FULL SQUARE
V
CC
= 500V, V
GE
= +15V to 0V,
R
G
= 100Ω
CT2
CT3
µs
T
J
= 150°C, Vp =600V, R
G
= 100Ω
10 ––– –––
WF4
V
CC
= 360V, V
GE
= +15V to 0V
17,18,19
––– 90 175
µJ
T
J
= 150°C
20, 21
––– 70
80
ns
V
CC
= 400V, I
F
= 5.0A, L = 1.4mH
CT4,WF3
––– 10
14
A
V
GE
= 15V,R
G
= 100Ω, Ls = 150nH
Typ.
18.2
1.9
9.2
110
135
245
25
17
215
13.2
150
190
340
28
17
240
18
290
34
10
Note:

to
„
are on page 15
2
www.irf.com
IRG/B/S/SL6B60KD
15
100
90
80
10
Ptot (W)
IC (A)
70
60
50
40
30
20
10
5
0
0
20
40
60
80
100 120 140 160
T C (°C)
0
0
20
40
60
80
100 120 140 160
T C (°C)
Fig. 1
- Maximum DC Collector Current vs.
Case Temperature
Fig. 2
- Power Dissipation vs. Case
Temperature
100
100
10
10 µs
IC (A)
IC A)
10
1
100 µs
DC
1ms
0.1
1
10
100
VCE (V)
1000
10000
1
0
10
100
1000
VCE (V)
Fig. 3
- Forward SOA
T
C
= 25°C; T
J
150°C
Fig. 4
- Reverse Bias SOA
T
J
= 150°C; V
GE
=15V
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3
IRG/B/S/SL6B60KD
20
18
16
14
ICE (A)
20
VGE
VGE
VGE
VGE
VGE
= 18V
= 15V
= 12V
= 10V
= 8.0V
ICE (A)
18
16
14
12
10
8
6
4
2
0
12
10
8
6
4
2
0
0
VGE
VGE
VGE
VGE
VGE
= 18V
= 15V
= 12V
= 10V
= 8.0V
1
2
3
VCE (V)
4
5
6
0
1
2
3
VCE (V)
4
5
6
Fig. 5
- Typ. IGBT Output Characteristics
T
J
= -40°C; tp = 80µs
Fig. 6
- Typ. IGBT Output Characteristics
T
J
= 25°C; tp = 80µs
20
18
16
14
ICE (A)
30
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
IF (A)
25
20
15
10
5
-40°C
25°C
150°C
12
10
8
6
4
2
0
0
0
1
2
3
VCE (V)
4
5
6
0.0
0.5
1.0
VF (V)
1.5
2.0
Fig. 7
- Typ. IGBT Output Characteristics
T
J
= 150°C; tp = 80µs
Fig. 8
- Typ. Diode Forward Characteristics
tp = 80µs
4
www.irf.com
IRG/B/S/SL6B60KD
20
18
16
14
VCE (V)
VCE (V)
20
18
16
14
ICE = 3.0A
ICE = 5.0A
ICE = 10A
12
10
8
6
4
2
0
5
10
VGE (V)
15
20
5
10
VGE (V)
15
20
ICE = 3.0A
ICE = 5.0A
ICE = 10A
12
10
8
6
4
2
0
Fig. 9
- Typical V
CE
vs. V
GE
T
J
= -40°C
Fig. 10
- Typical V
CE
vs. V
GE
T
J
= 25°C
20
18
16
14
VCE (V)
40
35
30
ICE = 3.0A
ICE = 5.0A
ICE = 10A
T J = 25°C
T J = 150°C
10
8
6
4
2
0
5
10
VGE (V)
ICE (A)
12
25
20
15
10
5
T J = 150°C
T J = 25°C
0
5
10
VGE (V)
15
20
15
20
0
Fig. 11
- Typical V
CE
vs. V
GE
T
J
= 150°C
Fig. 12
- Typ. Transfer Characteristics
V
CE
= 50V; tp = 10µs
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