PD - 9.1323B
IRL3303S/L
l
l
l
l
l
l
l
Logic-Level Gate Drive
Advanced Process Technology
Surface Mount (IRL3303S)
Low-profile through-hole (IRL3303L)
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
HEXFET
®
Power MOSFET
D
V
DSS
= 30V
R
DS(on)
= 0.026Ω
G
I
D
= 38A
S
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The D
2
Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
2
Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRL3303L) is available for low-
profile applications.
D 2 Pak
T O -2 6 2
Absolute Maximum Ratings
Parameter
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
A
= 25°C
P
D
@T
C
= 25°C
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Max.
38
27
140
3.8
68
0.45
±16
130
20
6.8
5.0
-55 to + 175
300 (1.6mm from case )
Units
A
W
W
W/°C
V
mJ
A
mJ
V/ns
°C
Thermal Resistance
Parameter
R
θJC
R
θJA
Junction-to-Case
Junction-to-Ambient ( PCB Mounted,steady-state)**
Typ.
–––
–––
Max.
2.2
40
Units
°C/W
8/25/97
IRL3303S/L
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter
V
(BR)DSS
Drain-to-Source Breakdown Voltage
∆V
(BR)DSS
/∆T
J
Breakdown Voltage Temp. Coefficient
R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
S
C
iss
C
oss
C
rss
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Source Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Min.
30
–––
–––
–––
1.0
12
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
0.035
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
7.4
200
14
36
Max. Units
Conditions
–––
V
V
GS
= 0V, I
D
= 250µA
––– V/°C Reference to 25°C, I
D
= 1mA
0.026
V
GS
= 10V, I
D
= 20A
Ω
0.040
V
GS
= 4.5V, I
D
= 17A
T
J
= 150°C
V
V
DS
= V
GS
, I
D
= 250µA
–––
S
V
DS
= 25V, I
D
= 20A
25
V
DS
= 30V, V
GS
= 0V
µA
250
V
DS
= 24V, V
GS
= 0V, T
J
= 150°C
100
V
GS
= 16V
nA
-100
V
GS
= -16V
26
I
D
= 20A
8.8
nC
V
DS
= 24V
15
V
GS
= 4.5V, See Fig. 6 and 13
–––
V
DD
= 15V
–––
I
D
= 20A
–––
R
G
= 6.5Ω
–––
R
D
= 0.7Ω, See Fig. 10
Between lead,
7.5 –––
nH
and center of die contact
870 –––
V
GS
= 0V
340 –––
pF
V
DS
= 25V
170 –––
ƒ = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
D
MOSFET symbol
––– ––– 38
showing the
A
G
integral reverse
––– ––– 140
p-n junction diode.
S
––– ––– 1.3
V
T
J
= 25°C, I
S
= 20A, V
GS
= 0V
––– 72 110
ns
T
J
= 25°C, I
F
= 20A
––– 180 280
µC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
I
SD
≤
20A, di/dt
≤
140A/µs, V
DD
≤
V
(BR)DSS
,
T
J
≤
175°C
V
DD
= 15V, starting T
J
= 25°C, L = 470µH
R
G
= 25Ω, I
AS
= 20A. (See Figure 12)
Pulse width
≤
300µs; duty cycle
≤
2%.
Uses IRL3303 data and test conditions.
** When mounted on 1" square PCB ( FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
IRL3303S/L
1000
VGS
15V
12V
10V
8.0V
6.0V
4.0V
3.0V
BOT TOM 2.5V
TOP
1000
I
D
, D ra in -to -S o u rc e C u rre n t (A )
I
D
, D ra in -to -S o u rc e C u rre n t (A )
100
100
VGS
15V
12V
10V
8.0V
6.0V
4.0V
3.0V
BOTT OM 2.5V
TOP
10
10
2.5V
1
1
2 .5V
0.1
0.1
2 0µ s PU LSE W ID TH
T
J
= 25 °C
1
10
100
A
0.1
0.1
20 µ s PU LSE W ID TH
T
J
= 1 75°C
1
10
100
A
V
D S
, Drain-to-S ource V oltage (V)
V
D S
, Drain-to-Source V oltage (V )
Fig 1.
Typical Output Characteristics
Fig 2.
Typical Output Characteristics
1000
2.0
100
R
D S (o n )
, D ra in -to -S o u rc e O n R e si sta n ce
(N o rm a li ze d )
I
D
= 3 4A
I
D
, D r ain- to-S ourc e C urre nt (A )
1.5
T
J
= 2 5 °C
T
J
= 1 75 °C
10
1.0
1
0.5
0.1
2
3
4
5
6
V
DS
= 1 5 V
2 0µ s PU L SE W ID TH
7
8
9
10
A
0.0
-60
-40 -20
0
20
40
60
80
V
G S
= 10 V
100 120 140 160 180
A
V
G S
, G ate-to -S ource V olta ge (V )
T
J
, Junction T em perature (°C )
Fig 3.
Typical Transfer Characteristics
Fig 4.
Normalized On-Resistance
Vs. Temperature
IRL3303S/L
1600
1400
1200
1000
800
600
V
G S
, G a te -to -S o u rce V o lta g e (V )
V
GS
C
is s
C
rss
C
is s C
oss
= 0 V,
f = 1M H z
= C
gs
+ C
gd
, C
ds
SH OR TE D
= C
gd
= C
d s
+ C
gd
15
I
D
= 2 0A
V
D S
= 24 V
V
D S
= 15 V
12
C , C a p a c ita n c e (p F )
C
os s
9
6
C
rss
400
200
0
1
10
100
3
A
0
0
10
20
FOR TE ST C IR CU IT
SE E FIG U RE 13
30
40
A
V
D S
, D rain-to-S ource Voltage (V )
Q
G
, Total Gate Charge (nC)
Fig 5.
Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 6.
Typical Gate Charge Vs.
Gate-to-Source Voltage
1000
1000
I
S D
, R e v e rse D ra in C u rre n t (A )
OPE R ATIO N IN TH IS A RE A LIMITE D
BY R
D S(o n)
I
D
, D ra in C u rre n t (A )
100
100
10µ s
T
J
= 1 75 °C
T
J
= 25 °C
10
100 µs
10
1m s
1
0.0
0.5
1.0
1.5
V
G S
= 0 V
2.0
A
2.5
1
1
T
C
= 25 °C
T
J
= 17 5°C
S ing le Pulse
10
10m s
A
100
V
S D
, S ource-to-Drain Voltage (V )
V
D S
, Drain-to-Source Voltage (V)
Fig 7.
Typical Source-Drain Diode
Forward Voltage
Fig 8.
Maximum Safe Operating Area
IRL3303S/L
40
V
DS
V
GS
R
G
D.U.T.
+
I
D
, Drain Current (A)
30
-
V
DD
4.5V
20
Pulse Width
≤ 1
µs
Duty Factor
≤ 0.1 %
Fig 10a.
Switching Time Test Circuit
10
V
DS
90%
0
25
50
75
100
125
150
175
T
C
, Case Temperature
( ° C)
10%
V
GS
t
d(on)
t
r
t
d(off)
t
f
Fig 9.
Maximum Drain Current Vs.
Case Temperature
Fig 10b.
Switching Time Waveforms
10
(Z
thJC
)
1
D = 0.50
0.20
0.10
0.05
P
DM
SINGLE PULSE
(THERMAL RESPONSE)
t
1
t
2
Notes:
1. Duty factor D = t
1
/ t
2
2. Peak T
J
= P
DM
x Z
thJC
+ T
C
0.0001
0.001
0.01
0.1
Thermal Response
0.1
0.02
0.01
0.01
0.00001
t
1
, Rectangular Pulse Duration (sec)
Fig 11.
Maximum Effective Transient Thermal Impedance, Junction-to-Case
