ISP1302
Lite V4.2 Bluetooth Low Energy Module
with MCU and Antenna
This ultra-small LGA module, 8 x 8 x 1 mm, is based on
the nRF51822 Chip. Its powerful Cortex™ M0 CPU, flash
and RAM memory combined with an optimized antenna
offers the perfect solution for Bluetooth connectivity.
The solution is best in class for RF performance and low
power consumption. Multiple digital and analogue
interfaces give optimum flexibility for sensor
integration.
Key Features
Single Mode BLE V4.2 Compliant
IPv6 Connectivity
ECDH Encryption
Based on Nordic Semiconductor nRF51
2.4GHz low energy RF Transceiver
32bit ARM Cortex M0 CPU
128 kB or 256 kB Flash
16 kB SRAM
16 GPIOs including 5 ADC inputs & 1 ADC
reference
Ultra Low Power Consumption
Single 1.8 to 3.6 V supply
Very small size 8.0 x 8.0 x 1.0 mm
Temperature -40 to +85 °C
Fully integrated RF matching and Antenna
Integrated 16 MHz Clock
Possibility to connect external 32.768 kHz
Possibility to enable DC-DC converter by
adding external passive components
Applications
High volume BLE applications
Connected sensors for medical devices,
healthcare, sport, fitness, industrial …
IoT applications, connected objects
Wearable technology
Home automation
BLE connectivity for any
existing application
Beacons
Certifications
Bluetooth SIG certified QDL listing
Fully CE certified module
Fully FCC certified module
Fully IC certified module
Fully IMOC certified module
Fully TELEC certified module
RoHS compliant
January 23, 2018
Document Ref: isp_ble_DS1302_R5.docx
Page 1/24
Insight SiP
– Green Sid e – 400 aven ue Rou m anille – B P 309 – 06906 So phia - Antip olis Ce dex – Fra nce –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
BLE MODULE
ISP1302
Contents
1.
2.
2.1.
2.2.
2.3.
2.4.
2.5.
2.6.
2.7.
3.
4.
4.1.
4.2.
4.3.
5.
5.1.
5.2.
5.3.
5.4.
6.
6.1.
6.2.
7.
7.1.
7.2.
7.3.
7.4.
7.5.
8.
8.1.
8.2.
8.3.
9.
9.1.
9.2.
9.3.
9.4.
9.5.
Block Diagram .......................................................................................................................................................... 3
Specifications ........................................................................................................................................................... 4
Important Notice ...........................................................................................................................................4
Absolute Maximum Ratings ...........................................................................................................................4
Operating Conditions ....................................................................................................................................4
Power Consumption......................................................................................................................................5
Clock Sources...............................................................................................................................................5
Radio Specifications......................................................................................................................................5
Electrical Schematic ......................................................................................................................................8
Pin Description ....................................................................................................................................................... 10
Mechanical Outlines............................................................................................................................................... 12
Mechanical Dimensions .............................................................................................................................. 12
SMT Assembly Guidelines .......................................................................................................................... 13
Antenna Keep-Out Zone ............................................................................................................................. 13
Product Development Tools ................................................................................................................................. 14
Hardware .................................................................................................................................................... 14
Firmware .................................................................................................................................................... 14
Development Tools ..................................................................................................................................... 15
Serialization API ......................................................................................................................................... 15
Reference Designs ................................................................................................................................................. 16
Sensor Board Design .................................................................................................................................. 16
Beacon Design ........................................................................................................................................... 17
Packaging & Ordering information ...................................................................................................................... 18
Marking....................................................................................................................................................... 18
Prototype Packaging ................................................................................................................................... 18
Jedec Trays ................................................................................................................................................ 18
Tape and Reel ............................................................................................................................................ 19
Ordering Information ................................................................................................................................... 20
Storage & Soldering information .......................................................................................................................... 21
Storage and Handling ................................................................................................................................. 21
Moisture Sensitivity ..................................................................................................................................... 21
Soldering information .................................................................................................................................. 22
Quality & User information.................................................................................................................................... 23
Certifications ............................................................................................................................................... 23
USA – User information .............................................................................................................................. 23
Canada – User Information ......................................................................................................................... 23
Discontinuity ............................................................................................................................................... 24
Disclaimer ................................................................................................................................................... 24
January 23, 2018
Document Ref: isp_ble_DS1302_R5.docx
Page 2/24
Insight SiP
– Green Sid e – 400 aven ue Rou m anille – B P 309 – 06906 So phia- Antip olis Ce dex – Fra nce –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
BLE MODULE
ISP1302
1. Block Diagram
This module is based on nRF51822 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC)
integrating a 2.4 GHz transceiver, a 32-bit ARM Cortex™-M0 CPU, a flash memory, a RAM and analog
and digital peripherals.
It can support BLE and a range of proprietary 2.4 GHz protocols, such as Gazell from Nordic
Semiconductor. The ANT protocol can be handled on request.
Fully qualified BLE stacks for nRF51822 are implemented in the S100 series of SoftDevices which can be
freely downloaded. ISP1302 can then be used in Central, Peripheral or both roles for BLE and for both
ends of other proprietary protocols.
Ultra low power consumption and advanced power management enables battery lifetimes up to several
years on a coin cell battery. Even though its very small size 8 x 8 x 1mm, the module integrates decoupling
capacitors, 16 MHz crystal, RF matching circuit and antenna in addition to the wireless SoC. It is also
possible to connect external DC-DC converter passive components and 32 kHz crystal.
Only the addition of a suitable DC power source is necessary for BLE connectivity. Sensor applications
require the further addition of appropriate sensors. The antenna was designed to be optimized with several
standard ground plane sizes.
January 23, 2018
Document Ref: isp_ble_DS1302_R5.docx
Page 3/24
Insight SiP
– Green Sid e – 400 aven ue Rou m anille – B P 309 – 06906 So phia- Antip olis Ce dex – Fra nce –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
BLE MODULE
ISP1302
2. Specifications
2.1. Important Notice
The electrical specifications of the module are directly related to the Nordic Semiconductor specifications
for the nRF51822 chipset. Bellow information is only a summary of the main parameters. For more detailed
information, especially about current consumption, please refer to the up-to-date specification of the
chipset available on Nordic Semi website.
2.2. Absolute Maximum Ratings
Parameter
Supply Voltage respect to ground - VCC
IO Pin Voltage
Storage Temperature
Moisture Sensitivity Level
ESD Human Body Model
ESD Charged Device Model
Flash Endurance
Min
-0.3
-0.3
-40
Typ
Max
3.9
VCC + 0.3
+125
5
4000
500
20000
Unit
V
V
°C
-
V
V
cycles
ATTENTION
CONSERVE PRECAUTION FOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
2.3. Operating Conditions
Parameter
Operating Supply Voltage, internal LDO setup
Operating Supply Voltage, DCDC converter setup
Extended Industrial Operating Temperature Range
(1)
(2)
Min
1.8
(1)
1.9
(2)
2.1
-40
Typ
3.0
3.0
+25
Max
3.6
3.6
+85
Unit
V
V
°C
Minimum Supply Voltage Specification for Standard Operating Temperature Range -25°C to +75°C only
Minimum Supply Voltage Specification for Extended Industrial Operating Temperature Range -40°C to +85°C
January 23, 2018
Document Ref: isp_ble_DS1302_R5.docx
Page 4/24
Insight SiP
– Green Sid e – 400 aven ue Rou m anille – B P 309 – 06906 So phia- Antip olis Ce dex – Fra nce –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
BLE MODULE
ISP1302
2.4. Power Consumption
Parameter
Peak current, Receiver active (supply at 2.1V)
Peak current, Transmitter active +4 dBm Output Power
Peak current, Transmitter active 0 dBm Output Power
Current drain, Connection-less state, no RAM retention
Current drain, Between connection events
Min
Typ
12.6
16
10.5
0.6
2.6
Max
Unit
mA
mA
mA
µA
µA
2.5. Clock Sources
Parameter
Internal High Frequency Clock for RF Stability:
16 MHz Crystal Frequency Tolerance
(1)
Internal Low Frequency Clock for BLE Synchronization:
RC Oscillator
(2)
RF Frequency tolerance:
For BLE operation Channels 0 to 39
(1)
(2)
including initial tolerance, drift, aging, and frequency pulling
with calibration interval of 4 sec
Min
Typ
Max
+/- 40
+/- 250
+/- 40
Unit
ppm
ppm
ppm
2.6. Radio Specifications
Parameter
Frequency Range
Channel 0 to 39 Spacing
Output Power Channels 0 to 39
Rx sensitivity Level for BER <0,1% ideal Tx
Antenna Gain
EIRP
Range Open field @1m height
Data Rate
-19.4
100
250 / 1000 / 2000
-20
-93
0.6
4.6
Min
2402
2
+4
Typ
Max
2480
Unit
Mhz
Mhz
dBm
dBm
dBi
dBm
m
kbps
January 23, 2018
Document Ref: isp_ble_DS1302_R5.docx
Page 5/24
Insight SiP
– Green Sid e – 400 aven ue Rou m anille – B P 309 – 06906 So phia- Antip olis Ce dex – Fra nce –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
