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IXFA12N80P

Power Field-Effect Transistor, 12A I(D), 800V, 1.1ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, PLASTIC PACKAGE-3

器件类别:分立半导体    晶体管   

厂商名称:Littelfuse

厂商官网:http://www.littelfuse.com

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Littelfuse
包装说明
SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code
_compli
雪崩能效等级(Eas)
1200 mJ
外壳连接
DRAIN
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
800 V
最大漏极电流 (ID)
12 A
最大漏源导通电阻
1.1 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码
TO-263AB
JESD-30 代码
R-PSSO-G2
JESD-609代码
e3
湿度敏感等级
2
元件数量
1
端子数量
2
工作模式
ENHANCEMENT MODE
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
N-CHANNEL
最大脉冲漏极电流 (IDM)
36 A
认证状态
Not Qualified
表面贴装
YES
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子位置
SINGLE
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
SWITCHING
晶体管元件材料
SILICON
文档预览
PolarHV
TM
HiPerFET
Power MOSFET
N-Channel Enhancement Mode
IXFA 12N80P
IXFH 12N80P
IXFP 12N80P
V
DSS
I
D25
R
DS(on)
t
rr
=
=
800 V
12 A
1.1
Ω
250 ns
Symbol
V
DSS
V
DGR
V
GS
V
GSM
I
D25
I
DM
I
AR
E
AR
E
AS
dv/dt
P
D
T
J
T
JM
T
stg
T
L
M
d
Weight
Test Conditions
T
J
= 25°C to 150°C
T
J
= 25°C to 150°C; R
GS
= 1 MΩ
Continuous
Tranisent
T
C
= 25°C
T
C
= 25°C, pulse width limited by T
JM
T
C
= 25°C
T
C
= 25°C
T
C
= 25°C
I
S
I
DM
, di/dt
100 A/μs, V
DD
V
DSS
,
T
J
150°C, R
G
= 4
Ω
T
C
= 25°C
Maximum Ratings
800
800
±20
±30
12
36
12
30
1.2
10
360
-55 ... +150
150
-55 ... +150
V
V
V
V
A
A
A
mJ
J
V/ns
TO-263 (IXFA)
G
S
(TAB)
TO-247 (IXFH)
(TAB)
TO-220 (IXFP)
W
°C
°C
°C
°C
°C
G
1.6 mm (0.062 in.) from case for 10 s
Plastic body for 10 s
Mounting torque
TO-247
T0-220 & TO-263
(TO-220, TO-247)
300
250
D S
(TAB)
1.13/10 Nm/lb.in.
6
4
g
g
G = Gate
S = Source
D = Drain
TAB = Drain
Features
Symbol
Test Conditions
(T
J
= 25°C, unless otherwise specified)
V
DSS
V
GS(th)
I
GSS
I
DSS
R
DS(on)
V
GS
= 0 V, I
D
= 250
μA
V
DS
= V
GS
, I
D
= 4 mA
V
GS
=
±30
V
DC
, V
DS
= 0
V
DS
= V
DSS
V
GS
= 0 V
T
J
= 125°C
Characteristic Values
Min. Typ.
Max.
800
3.0
5.0
±100
25
250
1.1
V
V
nA
μA
μA
Ω
Advantages
Easy to mount
Space savings
High power density
International standard packages
Unclamped Inductive Switching (UIS)
rated
Low package inductance
- easy to drive and to protect
V
GS
= 10 V, I
D
= 0.5 I
D25
, Note 1
© 2005 IXYS All rights reserved
DS99476E(10/05)
IXFA 12N80P
IXFH 12N80P IXFP 12N80P
Symbol
Test Conditions
Characteristic Values
(T
J
= 25°C unless otherwise specified)
Min. Typ. Max.
13
18
2800
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz
210
19
21
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= I
D25
R
G
= 5
Ω
(External)
22
62
22
51
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= 0.5 I
D25
13
19
0.35
(TO-247)
(TO-220)
0.21
0.25
S
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
K/W
K/W
K/W
Dim.
A
A1
b
b2
c
c2
D
D1
E
E1
e
L
L1
L2
L3
L4
R
4.06
2.03
0.51
1.14
0.46
1.14
8.64
7.11
9.65
6.86
2.54
14.61
2.29
1.02
1.27
0
0.46
TO-263 (IXFA) Outline
g
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g(on)
Q
gs
Q
gd
R
thJC
R
thCK
V
DS
= 20 V; I
D
= 0.5 I
D25
, Note 1
Pins: 1 - Gate 2, 4 - Drain
3 - Source
Millimeter
Min.
Max.
4.83
2.79
0.99
1.40
0.74
1.40
9.65
8.13
10.29
8.13
BSC
15.88
2.79
1.40
1.78
0.38
0.74
Inches
Min. Max.
.160
.080
.020
.045
.018
.045
.340
.280
.380
.270
.100
.575
.090
.040
.050
0
.018
.190
.110
.039
.055
.029
.055
.380
.320
.405
.320
BSC
.625
.110
.055
.070
.015
.029
Source-Drain Diode
Symbol
I
S
I
SM
V
SD
t
rr
Q
rm
Test Conditions
V
GS
= 0 V
Repetitive
I
F
= I
S
, V
GS
= 0 V, Note 1
I
S
= 18 A, V
GS
= 0 V
-di/dt = 100 A/μs, V
R
= 100 V
Characteristic Values
(T
J
= 25°C, unless otherwise specified)
Min. Typ. Max.
12
36
1.5
200
1.0
250
A
A
V
ns
μC
TO-220 (IXFP) Outline
Note 1: Pulse test, t
300
μs,
duty cycle d
2 %
TO-247 (IXFH) Outline
Dim.
A
A
1
A
2
Millimeter
Min.
Max.
4.7
2.2
2.2
1.0
1.65
2.87
.4
20.80
15.75
5.20
19.81
3.55
5.89
4.32
6.15
5.3
2.54
2.6
1.4
2.13
3.12
.8
21.46
16.26
5.72
20.32
4.50
3.65
6.40
5.49
BSC
Inches
Min.
Max.
.185
.087
.059
.040
.065
.113
.016
.819
.610
0.205
.780
.140
0.232
.170
242
.209
.102
.098
.055
.084
.123
.031
.845
.640
0.225
.800
.177
.144
0.252
.216
BSC
1
2
3
Terminals:
1 - Gate
2 - Drain
3 - Source
Tab - Drain
b
b
1
b
2
C
D
E
e
L
L1
∅P
Q
R
S
Pins: 1 - Gate
3 - Source
2 - Drain
4 - Drain
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by 4,835,592
one or moreof the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
6,759,692
6,771,478 B2
IXFA 12N80P
IXFH 12N80P IXFP 12N80P
Fig. 1. Output Characte r is tics
@ 25
º
C
12
V
GS
= 10V
10
7V
20
24
V
GS
= 10V
7V
Fig. 2. Exte nde d Output Char acte r is tics
@ 25
º
C
I
D
- Amperes
6V
6
I
D
- Amperes
8
16
12
6V
4
8
2
5V
0
0
2
4
6
8
10
12
4
5V
0
0
3
6
9
12
15
18
21
24
27
30
V
D S
- V olts
Fig. 3. Output Char acte r is tics
@ 125
º
C
12
V
GS
= 10V
10
7V
2.6
2.4
V
GS
= 10V
V
D S
- V olts
Fig. 4. R
DS(on
)
Norm alize d to 0.5 I
D25
V alue vs . Junction Te m pe r atur e
R
D S ( o n )
- Normalized
2.2
2
1.8
1.6
1.4
1.2
1
0.8
0.6
I
D
= 6A
I
D
= 12A
I
D
- Amperes
8
6V
6
4
2
5V
0
0
4
8
12
16
20
24
-50
-25
0
25
50
75
100
125
150
V
D S
- V olts
Fig. 5. R
DS(on)
Nor m alize d to
0.5 I
D25
V alue vs . I
D
2.5
2.3
V
GS
= 10V
T
J
= 125
º
C
14
12
10
T
J
- Degrees Centigrade
Fig. 6. Dr ain Cur r e nt vs . Cas e
Te m pe r atur e
R
D S ( o n )
- Normalized
2.1
1.9
1.7
1.5
1.3
1.1
0.9
0
2
4
6
8
10
12
I
D
- Amperes
T
J
= 25
º
C
14
16
18
20
22
24
8
6
4
2
0
-50
-25
0
25
50
75
100
125
150
I
D
- A mperes
T
C
- Degrees Centigrade
© 2005 IXYS All rights reserved
IXFA 12N80P
IXFH 12N80P IXFP 12N80P
Fig. 7. Input Adm ittance
16
14
12
24
21
18
T
J
= -40
º
C
25
º
C
125
º
C
15
12
9
6
3
0
4
4.5
5
5.5
6
6.5
0
2
4
6
8
10
12
14
16
18
Fig. 8. Tr ans conductance
I
D
- Amperes
10
8
6
4
2
0
T
J
= 125
º
C
25
º
C
-40
º
C
V
G S
- V olts
Fig. 9. Sour ce Cur r e nt vs .
Sour ce -To-Dr ain V oltage
35
30
8
25
7
10
9
V
DS
= 400V
I
D
= 6A
I
G
= 10m A
g
fs
- Siemens
I
D
- A mperes
Fig. 10. Gate Char ge
I
S
- Amperes
V
G S
- Volts
T
J
= 25
º
C
0.9
1
1.1
20
T
J
= 125
º
C
15
10
5
6
5
4
3
2
1
0
0.4
0.5
0.6
0.7
0.8
0
0
5
10
15
20
G
25
30
35
40
45
50
55
V
S D
- V olts
Q
- nanoCoulombs
Fig. 11. Capacitance
10000
f = 1MH z
C iss
Capacitance - picoFarads
1000
C oss
100
C rss
10
0
5
10
15
20
25
30
35
40
V
D S
- V olts
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by 4,835,592
one or moreof the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
6,759,692
6,771,478 B2
IXFA 12N80P
IXFH 12N80P IXFP 12N80P
Fig. 12. Maximum Transient Thermal Resistance
1.000
R
( t h ) J C
-
º
C / W
0.100
0.010
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2005 IXYS All rights reserved
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参数对比
与IXFA12N80P相近的元器件有:IXFP12N80P。描述及对比如下:
型号 IXFA12N80P IXFP12N80P
描述 Power Field-Effect Transistor, 12A I(D), 800V, 1.1ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, PLASTIC PACKAGE-3 Power Field-Effect Transistor, 12A I(D), 800V, 1.1ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, PLASTIC PACKAGE-3
是否Rohs认证 符合 符合
厂商名称 Littelfuse Littelfuse
包装说明 SMALL OUTLINE, R-PSSO-G2 FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code _compli compli
雪崩能效等级(Eas) 1200 mJ 1200 mJ
外壳连接 DRAIN DRAIN
配置 SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 800 V 800 V
最大漏极电流 (ID) 12 A 12 A
最大漏源导通电阻 1.1 Ω 1.1 Ω
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码 TO-263AB TO-220AB
JESD-30 代码 R-PSSO-G2 R-PSFM-T3
JESD-609代码 e3 e3
元件数量 1 1
端子数量 2 3
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 150 °C 150 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE FLANGE MOUNT
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
极性/信道类型 N-CHANNEL N-CHANNEL
最大脉冲漏极电流 (IDM) 36 A 36 A
认证状态 Not Qualified Not Qualified
表面贴装 YES NO
端子面层 Matte Tin (Sn) Matte Tin (Sn)
端子形式 GULL WING THROUGH-HOLE
端子位置 SINGLE SINGLE
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
晶体管应用 SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON
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