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IXFN50N80Q2

Power Field-Effect Transistor, 50A I(D), 800V, 0.15ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MINIBLOC-4

器件类别:分立半导体    晶体管   

厂商名称:Littelfuse

厂商官网:http://www.littelfuse.com

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Littelfuse
包装说明
FLANGE MOUNT, R-XUFM-X4
Reach Compliance Code
compliant
其他特性
AVALANCHE RATED, UL RECOGNIZED
雪崩能效等级(Eas)
5000 mJ
外壳连接
ISOLATED
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
800 V
最大漏极电流 (Abs) (ID)
50 A
最大漏极电流 (ID)
50 A
最大漏源导通电阻
0.15 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JESD-30 代码
R-XUFM-X4
元件数量
1
端子数量
4
工作模式
ENHANCEMENT MODE
最高工作温度
150 °C
封装主体材料
UNSPECIFIED
封装形状
RECTANGULAR
封装形式
FLANGE MOUNT
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
N-CHANNEL
最大功率耗散 (Abs)
890 W
最大脉冲漏极电流 (IDM)
200 A
认证状态
Not Qualified
表面贴装
NO
端子面层
Nickel (Ni)
端子形式
UNSPECIFIED
端子位置
UPPER
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
SWITCHING
晶体管元件材料
SILICON
文档预览
HiPerFET
TM
Power MOSFETs
Q-Class
N-Channel Enhancement Mode
Avalanche Rated, Low Q
g
, Low Intrinsic R
G
High dV/dt, Low t
rr
Symbol
V
DSS
V
DGR
V
GSS
V
GSM
I
D25
I
DM
I
A
E
AS
dv/dt
P
D
T
J
T
JM
T
stg
T
L
T
SOLD
V
ISOL
M
d
Weight
1.6mm (0.062 in.) from Case for 10s
Plastic Body for 10s
50/60 Hz, RMS
I
ISOL
1mA
t = 1 minute
t = 1 second
Test Conditions
T
J
= 25°C to 150°C
T
J
= 25°C to 150°C, R
GS
= 1MΩ
Continuous
Transient
T
C
= 25°C
IXFN50N80Q2
V
DSS
I
D25
R
DS(on)
t
rr
=
=
800V
50A
160mΩ
Ω
300ns
miniBLOC, SOT-227
E153432
S
Maximum Ratings
800
800
±30
±40
50
200
50
5
20
1135
-55 ... +150
150
-55 ... +150
300
260
2500
3000
1.5/13
1.3/11.5
30
V
V
V
V
A
A
A
J
V/ns
W
°C
°C
°C
°C
°C
V~
V~
Nm/lb.in.
Nm/lb.in.
g
G
S
D
G = Gate
S = Source
D = Drain
T
C
= 25°C, Pulse Width Limited by T
JM
T
C
= 25°C
T
C
= 25°C
I
S
I
DM
, V
DD
V
DSS
, T
J
150°C
T
C
= 25°C
Either Source Terminal S can be used as
the Source Terminal or the Kelvin Source
( Gate Return ) Terminal.
Features
International Standard Package
miniBLOC, with Aluminium Nitride
Isolation
Isolation Voltage 2500
V~
High Current Handling Capability
Fast Intrinsic Rectifier
Avalanche Rated
Low R
DS(on)
Advantages
Easy to Mount
Space Savings
High Power Density
Mounting Torque
Terminal Connection Torque
Symbol
Test Conditions
(T
J
= 25°C, Unless Otherwise Specified)
BV
DSS
V
GS(th)
I
GSS
I
DSS
R
DS(on)
V
GS
= 0V, I
D
= 1mA
V
DS
= V
GS
, I
D
= 8mA
V
GS
=
±30V,
V
DS
= 0V
V
DS
= V
DSS
, V
GS
= 0V
T
J
= 125°C
Characteristic Values
Min.
Typ.
Max.
800
3.0
5.5
±200
V
V
nA
Applications
Switch-Mode and Resonant-Mode
Power Supplies >500kHz Switching
DC-DC Converters
DC Choppers
Pulse Generation
Laser Drivers
50
μA
3 mA
160 mΩ
V
GS
= 10V, I
D
= 0.5 • I
D25
, Note 1
© 2010 IXYS CORPORATION, All Rights Reserved
DS99028C(01/10)
IXFN50N80Q2
Symbol
Test Conditions
(T
J
= 25°C, Unless Otherwise Specified)
g
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g(on)
Q
gs
Q
gd
R
thJC
R
thCS
0.05
V
GS
= 10V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 • I
D25
Resistive Switching Times
V
GS
= 10V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 • I
D25
R
G
= 1Ω (External)
V
GS
= 0V, V
DS
= 25V, f = 1MHz
V
DS
= 10V, I
D
= 0.5 • I
D25
, Note 1
Characteristic Values
Min.
Typ.
Max.
32
48
13.5
1180
213
26
25
60
13
260
56
120
S
nF
pF
pF
ns
ns
ns
ns
nC
nC
nC
0.11
°C/W
°C/W
(M4 screws (4x) supplied)
SOT-227B (IXFN) Outline
Source-Drain Diode
Symbol
Test Conditions
(T
J
= 25°C, Unless Otherwise Specified)
I
S
I
SM
V
SD
t
rr
Q
RM
I
RM
V
GS
= 0V
Repetitive, Pulse Width Limited by T
JM
I
F
= 50A, V
GS
= 0V, Note 1
I
F
= 25A, V
GS
= 0V
-di/dt = 100A/μs
V
R
= 100V
1.1
8.0
Characteristic Values
Min. Typ.
Max.
50
200
1.5
A
A
V
300 ns
μC
A
Note 1. Pulse test, t
300μs, duty cycle, d
2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXFN50N80Q2
Fig. 1. Output Characteristics @ T
J
= 25ºC
50
45
40
35
6V
30
25
20
15
10
5
0
0
1
2
3
4
5
6
7
8
5V
V
GS
= 10V
7V
100
90
80
70
V
GS
= 10V
7V
Fig. 2. Extended Output Characteristics @ T
J
= 25ºC
I
D
- Amperes
I
D
- Amperes
60
50
40
30
20
10
0
0
3
6
9
6V
5V
12
15
18
21
24
27
30
V
DS
- Volts
V
DS
- Volts
Fig. 3. Output Characteristics @ T
J
= 125ºC
50
V
GS
= 10V
45
2.8
40
35
6V
3.2
Fig. 4. R
DS(on)
Normalized to I
D
= 25A Value vs.
Junction Temperature
V
GS
= 10V
R
DS(on)
- Normalized
2.4
I
D
- Amperes
I
D
= 50A
I
D
= 25A
30
25
20
15
10
5V
2.0
1.6
1.2
0.8
5
0
0
2
4
6
8
10
12
14
16
18
20
0.4
-50
-25
0
25
50
75
100
125
150
V
DS
- Volts
T
J
- Degrees Centigrade
Fig. 5. R
DS(on)
Normalized to I
D
= 25A Value vs.
Drain Current
2.8
2.6
2.4
V
GS
= 10V
T
J
= 125ºC
50
60
Fig. 6. Maximum Drain Current vs.
Case Temperature
R
DS(on)
- Normalized
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0
10
20
30
40
50
60
70
80
90
100
110
T
J
= 25ºC
40
I
D
- Amperes
30
20
10
0
-50
-25
0
25
50
75
100
125
150
I
D
- Amperes
T
C
- Degrees Centigrade
© 2010 IXYS CORPORATION, All Rights Reserved
IXFN50N80Q2
Fig. 7. Input Admittance
100
90
80
100
90
80
T
J
= - 40ºC
Fig. 8. Transconductance
g
f s
- Siemens
70
70
25ºC
60
50
125ºC
40
30
20
10
0
I
D
- Amperes
60
50
40
30
20
10
0
2.5
3.0
3.5
4.0
4.5
T
J
= 125ºC
25ºC
- 40ºC
5.0
5.5
6.0
6.5
0
10
20
30
40
50
60
70
80
90
100
V
GS
- Volts
I
D
- Amperes
Fig. 9. Forward Voltage Drop of
Intrinsic Diode
160
140
120
7
10
9
8
V
DS
= 400V
I
D
= 25A
I
G
= 10mA
Fig. 10. Gate Charge
I
S
- Amperes
V
GS
- Volts
T
J
= 125ºC
T
J
= 25ºC
100
80
60
40
20
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
6
5
4
3
2
1
0
0
Fig.
40
Maximum Transient Thermal Impedance
12.
80
120
160
200
240
Q
G
- NanoCoulombs
V
SD
- Volts
1.000
Fig. 11. Capacitance
100,000
Fig. 12. Maximum Transient Thermal Impedance
0.200
f
= 1 MHz
0.100
Capacitance - PicoFarads
Ciss
10,000
Coss
1,000
Z
(th)JC
- ºC / W
30
35
40
0.010
Crss
100
0
5
10
15
20
25
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
V
DS
- Volts
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS REF:F_50N80Q2(95)1-18-10-C
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at
www.littelfuse.com/disclaimer-electronics.
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参数对比
与IXFN50N80Q2相近的元器件有:。描述及对比如下:
型号 IXFN50N80Q2
描述 Power Field-Effect Transistor, 50A I(D), 800V, 0.15ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MINIBLOC-4
是否Rohs认证 符合
厂商名称 Littelfuse
包装说明 FLANGE MOUNT, R-XUFM-X4
Reach Compliance Code compliant
其他特性 AVALANCHE RATED, UL RECOGNIZED
雪崩能效等级(Eas) 5000 mJ
外壳连接 ISOLATED
配置 SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 800 V
最大漏极电流 (Abs) (ID) 50 A
最大漏极电流 (ID) 50 A
最大漏源导通电阻 0.15 Ω
FET 技术 METAL-OXIDE SEMICONDUCTOR
JESD-30 代码 R-XUFM-X4
元件数量 1
端子数量 4
工作模式 ENHANCEMENT MODE
最高工作温度 150 °C
封装主体材料 UNSPECIFIED
封装形状 RECTANGULAR
封装形式 FLANGE MOUNT
峰值回流温度(摄氏度) NOT SPECIFIED
极性/信道类型 N-CHANNEL
最大功率耗散 (Abs) 890 W
最大脉冲漏极电流 (IDM) 200 A
认证状态 Not Qualified
表面贴装 NO
端子面层 Nickel (Ni)
端子形式 UNSPECIFIED
端子位置 UPPER
处于峰值回流温度下的最长时间 NOT SPECIFIED
晶体管应用 SWITCHING
晶体管元件材料 SILICON
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