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IXTA6N50P

Power Field-Effect Transistor, 6A I(D), 500V, 1.1ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, TO-263, 3 PIN

器件类别:分立半导体    晶体管   

厂商名称:IXYS

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
IXYS
零件包装代码
D2PAK
包装说明
TO-263, 3 PIN
针数
4
Reach Compliance Code
not_compliant
其他特性
AVALANCHE RATED
雪崩能效等级(Eas)
250 mJ
外壳连接
DRAIN
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
500 V
最大漏极电流 (ID)
6 A
最大漏源导通电阻
1.1 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码
TO-263AB
JESD-30 代码
R-PSSO-G2
JESD-609代码
e3
湿度敏感等级
2
元件数量
1
端子数量
2
工作模式
ENHANCEMENT MODE
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
N-CHANNEL
最大脉冲漏极电流 (IDM)
15 A
认证状态
Not Qualified
表面贴装
YES
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子位置
SINGLE
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
SWITCHING
晶体管元件材料
SILICON
文档预览
PolarHV
TM
Power MOSFET
N-Channel Enhancement Mode
Avalanche Rated
IXTA 6N50P
IXTP 6N50P
V
DSS
= 500 V
I
D25
=
6 A
R
DS(on)
1.1
Symbol
V
DSS
V
DGR
V
GSS
V
GSM
I
D25
I
DM
I
AR
E
AR
E
AS
dv/dt
P
D
T
J
T
JM
T
stg
T
L
T
SOLD
M
d
Weight
Test Conditions
T
J
= 25° C to 150° C
T
J
= 25° C to 150° C; R
GS
= 1 MΩ
Continuous
Transient
T
C
= 25° C
T
C
= 25° C, pulse width limited by T
JM
T
C
= 25° C
T
C
= 25° C
T
C
= 25° C
I
S
I
DM
, di/dt
100 A/µs, V
DD
V
DSS
,
T
J
150° C, R
G
= 18
T
C
= 25° C
Maximum Ratings
500
500
±
30
±
40
6
15
6
20
250
10
100
-55 ... +150
150
-55 ... +150
V
V
V
V
A
A
A
mJ
mJ
V/ns
W
°C
°C
°C
°C
°C
TO-263 (IXTA)
G
S
(TAB)
TO-220 (IXTP)
G
D S
(TAB)
G = Gate
S = Source
D = Drain
TAB = Drain
1.6 mm (0.062 in.) from case for 10 s
Plastic body for 10 s
Mounting torque
TO-220
TO-263
(TO-220)
300
260
1.13/10 Nm/lb.in.
4
3
g
g
Features
l
l
l
Symbol
Test Conditions
(T
J
= 25° C, unless otherwise specified)
BV
DSS
V
GS(th)
I
GSS
I
DSS
R
DS(on)
V
GS
= 0 V, I
D
= 250
µA
V
DS
= V
GS
, I
D
= 50µA
V
GS
=
±30
V, V
DS
= 0V
V
DS
= V
DSS
V
GS
= 0 V
T
J
= 125° C
Characteristic Values
Min. Typ.
Max.
500
3.0
5.0
±100
5
50
1.1
V
V
nA
µA
µA
International standard packages
Unclamped Inductive Switching (UIS)
rated
Low package inductance
- easy to drive and to protect
Advantages
l
l
l
Easy to mount
Space savings
High power density
V
GS
= 10 V, I
D
= 0.5 I
D25
Pulse test, t
300
µs,
duty cycle d
2 %
© 2006 IXYS All rights reserved
DS99447E(04/06)
IXTA 6N50P
IXTP 6N50P
Symbol
Test Conditions
Characteristic Values
(T
J
= 25° C, unless otherwise specified)
Min.
Typ.
Max.
3.5
5.5
740
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz
85
8
26
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= 0.5 I
D25
R
G
= 18
(External)
28
65
26
14.6
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= 0.5 I
D25
4.8
5.6
S
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
1.25° C/W
(TO-220)
0.25
°
C/W
TO-263 (IXTA) Outline
g
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g(on)
Q
gs
Q
gd
R
thJC
R
thCS
V
DS
= 20 V; I
D
= 0.5 I
D25
, pulse test
Source-Drain Diode
Symbol
I
S
I
SM
V
SD
t
rr
Test Conditions
V
GS
= 0 V
Repetitive
Characteristic Values
(T
J
= 25° C unless otherwise specified)
Min.
Typ.
Max.
6
18
1.5
400
A
A
V
ns
TO-220 (IXTP) Outline
I
F
= I
S
, V
GS
= 0 V, -di/dt = 100 A/µs
Pulse test, t
300
µs,
duty cycle d
2 %
Pins: 1 - Gate
3 - Source
2 - Drain
4 - Drain
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by 4,835,592
one or moreof the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
6,759,692
6,771,478 B2
IXTA 6N50P
IXTP 6N50P
Fig. 1. Output Characte ris tics
@ 25
º
C
6
V
GS =
10V
5
7V
12
10
14
V
GS
= 10V
8V
Fig. 2. Exte nde d Output Characte ris tics
@ 25
º
C
I
D
- Amperes
4
7V
I
D
- Amperes
8
6
6V
4
2
5V
0
0
3
6
9
12
3
2
6V
1
0
0
1
2
3
4
5V
5
6
7
V
D S
- V olts
Fig. 3. Output Characte ris tics
@ 125
º
C
6
V
GS
= 10V
5
4
6V
3
2
5V
1
0
0
2
4
6
8
10
12
14
7V
2.6
2.4
2.2
V
D S
- V olts
15
18
21
24
27
30
Fig. 4. R
DS(on
)
Norm alize d to 0.5 I
D25
V alue vs . Junction Te m pe ratur e
V
GS
= 10V
R
D S ( o n )
- Normalized
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
-50
-25
0
25
50
75
100
125
150
I
D
= 3A
I
D
= 6A
I
D
- Amperes
V
D S
- V olts
Fig. 5. R
DS(on)
Nor m alize d to
3
2.8
2.6
T
J
- Degrees Centigrade
Fig. 6. Dr ain Curr e nt vs . Cas e
Te m pe r ature
7
6
5
0.5 I
D25
V alue vs . I
D
V
GS
= 10V
T
J
= 125
º
C
R
D S ( o n )
- Normalized
2.4
I
D
- Amperes
T
J
= 25
º
C
2.2
2
1.8
1.6
1.4
1.2
1
0.8
0
2
4
6
8
10
12
14
4
3
2
1
0
-50
-25
0
25
50
75
100
125
150
I
D
- A mperes
T
C
- Degrees Centigrade
© 2006 IXYS All rights reserved
IXTA 6N50P
IXTP 6N50P
Fig. 7. Input Adm ittance
8
7
6
10
9
8
T
J
= -40
º
C
25
º
C
125
º
C
Fig. 8. Tr ans conductance
I
D
- Amperes
5
4
3
2
1
0
4
4.5
5
5.5
6
6.5
T
J
= 125
º
C
25
º
C
-40
º
C
- Siemens
7
6
5
4
3
2
1
0
0
g
fs
1
2
3
4
5
6
7
8
V
G S
- V olts
Fig. 9. Source Cur r e nt vs .
Sour ce -To-Dr ain V oltage
18
16
14
10
9
8
7
V
DS
= 250V
I
D
= 3A
I
G
= 10m A
I
D
- A mperes
Fig. 10. Gate Char ge
I
S
- Amperes
12
V
G S
- Volts
T
J
= 25
º
C
0.8
0.9
1
10
8
6
4
2
0
0.4
0.5
0.6
0.7
T
J
= 125
º
C
6
5
4
3
2
1
0
0
2
4
6
8
10
12
14
16
V
S D
- V olts
Fig. 11. Capacitance
10000
f = 1MH z
100
Q
G
- nanoCoulombs
Fig. 12. For w ar d-Bias
Safe Ope r ating Ar e a
T
J
= 1
º
C
50
R
DS(on)
Lim it
C iss
T
C
= 25
º
C
Capacitance - picoFarads
1000
I
D
- Amperes
10
25µs
1
00µs
1 s
m
DC
1 s
0m
100
C oss
10
C rss
1
0
5
10
15
20
25
30
35
40
1
0.1
10
100
1000
V
D S
- V olts
IXYS reserves the right to change limits, test conditions, and dimensions.
V
D S
- V olts
IXTA 6N50P
IXTP 6N50P
Fig. 13. Maxim um Transient Therm al Resistance
10.00
R
( t h ) J C
-
º
C / W
1.00
0.10
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - milliseconds
© 2006 IXYS All rights reserved
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参数对比
与IXTA6N50P相近的元器件有:IXTP6N50P。描述及对比如下:
型号 IXTA6N50P IXTP6N50P
描述 Power Field-Effect Transistor, 6A I(D), 500V, 1.1ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, TO-263, 3 PIN Power Field-Effect Transistor, 6A I(D), 500V, 1.1ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, TO-220, 3 PIN
是否无铅 不含铅 不含铅
是否Rohs认证 符合 符合
厂商名称 IXYS IXYS
零件包装代码 D2PAK TO-220AB
包装说明 TO-263, 3 PIN TO-220, 3 PIN
针数 4 3
Reach Compliance Code not_compliant compli
其他特性 AVALANCHE RATED AVALANCHE RATED
雪崩能效等级(Eas) 250 mJ 250 mJ
外壳连接 DRAIN DRAIN
配置 SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 500 V 500 V
最大漏极电流 (ID) 6 A 6 A
最大漏源导通电阻 1.1 Ω 1.1 Ω
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码 TO-263AB TO-220AB
JESD-30 代码 R-PSSO-G2 R-PSFM-T3
JESD-609代码 e3 e3
元件数量 1 1
端子数量 2 3
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 150 °C 150 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE FLANGE MOUNT
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
极性/信道类型 N-CHANNEL N-CHANNEL
最大脉冲漏极电流 (IDM) 15 A 15 A
认证状态 Not Qualified Not Qualified
表面贴装 YES NO
端子面层 Matte Tin (Sn) Matte Tin (Sn)
端子形式 GULL WING THROUGH-HOLE
端子位置 SINGLE SINGLE
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
晶体管应用 SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON
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