MASK ROM, 2MX16, 150ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48
厂商名称:SAMSUNG(三星)
厂商官网:http://www.samsung.com/Products/Semiconductor/
下载文档型号 | K3P6S1000D-YE | K3P6U1000D-YC | K3P6S1000D-YC | K3P6U1000D-YE | K3P6V1000D-YE | K3P6V1000D-YC |
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描述 | MASK ROM, 2MX16, 150ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | MASK ROM, 2MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | MASK ROM, 2MX16, 150ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | MASK ROM, 2MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | MASK ROM, 2MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | MASK ROM, 2MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 |
厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
零件包装代码 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 |
包装说明 | TSOP1, | TSOP1, | 12 X 18 MM, TSOP1-48 | TSOP1, | TSOP1, | TSOP1, |
针数 | 48 | 48 | 48 | 48 | 48 | 48 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 150 ns | 100 ns | 150 ns | 100 ns | 100 ns | 100 ns |
备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
长度 | 16.4 mm | 16.4 mm | 16.4 mm | 16.4 mm | 16.4 mm | 16.4 mm |
内存密度 | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 48 | 48 | 48 | 48 | 48 | 48 |
字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
组织 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 2.7 V | 3.3 V | 2.7 V | 3.3 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.3 V | 2.7 V | 2.3 V | 2.7 V | 3 V | 3 V |
标称供电电压 (Vsup) | 2.5 V | 3 V | 2.5 V | 3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | COMMERCIAL | COMMERCIAL | OTHER | OTHER | COMMERCIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm |