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K4S640832H-UC750

Synchronous DRAM, 8MX8, 5.4ns, CMOS, PDSO54, LEAD FREE, TSOP2-54

器件类别:存储    存储   

厂商名称:SAMSUNG(三星)

厂商官网:http://www.samsung.com/Products/Semiconductor/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
SAMSUNG(三星)
零件包装代码
TSOP2
包装说明
TSOP2,
针数
54
Reach Compliance Code
compliant
ECCN代码
EAR99
访问模式
FOUR BANK PAGE BURST
最长访问时间
5.4 ns
其他特性
AUTO/SELF REFRESH
JESD-30 代码
R-PDSO-G54
长度
22.22 mm
内存密度
67108864 bit
内存集成电路类型
SYNCHRONOUS DRAM
内存宽度
8
湿度敏感等级
2
功能数量
1
端口数量
1
端子数量
54
字数
8388608 words
字数代码
8000000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
8MX8
封装主体材料
PLASTIC/EPOXY
封装代码
TSOP2
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度)
260
认证状态
Not Qualified
座面最大高度
1.2 mm
自我刷新
YES
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
GULL WING
端子节距
0.8 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
宽度
10.16 mm
参数对比
与K4S640832H-UC750相近的元器件有:K4S641632H-UL700、320820054、K4S641632H-UL600、K4S641632H-UC600、K4S641632H-UC700、K4S641632H-UC750、K4S640432H-UL750、K4S640432H-UC750、K4S641632H-UC75T。描述及对比如下:
型号 K4S640832H-UC750 K4S641632H-UL700 320820054 K4S641632H-UL600 K4S641632H-UC600 K4S641632H-UC700 K4S641632H-UC750 K4S640432H-UL750 K4S640432H-UC750 K4S641632H-UC75T
描述 Synchronous DRAM, 8MX8, 5.4ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 Synchronous DRAM, 4MX16, 6ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 Induktive Sensoren Synchronous DRAM, 4MX16, 5ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 Synchronous DRAM, 4MX16, 5ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 Synchronous DRAM, 4MX16, 6ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 Synchronous DRAM, 4MX16, 5.4ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 Synchronous DRAM, 16MX4, 5.4ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 Synchronous DRAM, 16MX4, 5.4ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 Synchronous DRAM, 4MX16, 5.4ns, CMOS, PDSO54, LEAD FREE, TSOP2-54
是否Rohs认证 符合 符合 - 符合 符合 符合 符合 符合 符合 -
厂商名称 SAMSUNG(三星) SAMSUNG(三星) - SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星)
零件包装代码 TSOP2 TSOP2 - TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2
包装说明 TSOP2, TSOP2, - TSOP2, TSOP2, TSOP2, TSOP2, TSOP2, TSOP2, TSOP2,
针数 54 54 - 54 54 54 54 54 54 54
Reach Compliance Code compliant compliant - compliant compliant compliant compliant compliant compliant unknown
ECCN代码 EAR99 EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 FOUR BANK PAGE BURST FOUR BANK PAGE BURST - FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
最长访问时间 5.4 ns 6 ns - 5 ns 5 ns 6 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns
其他特性 AUTO/SELF REFRESH AUTO/SELF REFRESH - AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 代码 R-PDSO-G54 R-PDSO-G54 - R-PDSO-G54 R-PDSO-G54 R-PDSO-G54 R-PDSO-G54 R-PDSO-G54 R-PDSO-G54 R-PDSO-G54
长度 22.22 mm 22.22 mm - 22.22 mm 22.22 mm 22.22 mm 22.22 mm 22.22 mm 22.22 mm 22.22 mm
内存密度 67108864 bit 67108864 bit - 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
内存集成电路类型 SYNCHRONOUS DRAM SYNCHRONOUS DRAM - SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
内存宽度 8 16 - 16 16 16 16 4 4 16
湿度敏感等级 2 3 - 3 2 3 2 3 3 -
功能数量 1 1 - 1 1 1 1 1 1 1
端口数量 1 1 - 1 1 1 1 1 1 1
端子数量 54 54 - 54 54 54 54 54 54 54
字数 8388608 words 4194304 words - 4194304 words 4194304 words 4194304 words 4194304 words 16777216 words 16777216 words 4194304 words
字数代码 8000000 4000000 - 4000000 4000000 4000000 4000000 16000000 16000000 4000000
工作模式 SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C - 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 8MX8 4MX16 - 4MX16 4MX16 4MX16 4MX16 16MX4 16MX4 4MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP2 TSOP2 - TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2
封装形状 RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE - SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度) 260 260 - 260 260 260 260 260 260 -
认证状态 Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm - 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
自我刷新 YES YES - YES YES YES YES YES YES YES
最大供电电压 (Vsup) 3.6 V 3.6 V - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V - 3 V 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES - YES YES YES YES YES YES YES
技术 CMOS CMOS - CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL - COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 GULL WING GULL WING - GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.8 mm 0.8 mm - 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 DUAL DUAL - DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 40 NOT SPECIFIED - NOT SPECIFIED 40 NOT SPECIFIED 40 NOT SPECIFIED NOT SPECIFIED -
宽度 10.16 mm 10.16 mm - 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm
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