首页 > 器件类别 > 存储 > 存储

K6R1016V1C-TP15

Standard SRAM, 64KX16, 15ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44

器件类别:存储    存储   

厂商名称:SAMSUNG(三星)

厂商官网:http://www.samsung.com/Products/Semiconductor/

下载文档
器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
SAMSUNG(三星)
零件包装代码
TSOP2
包装说明
TSOP2, TSOP44,.46,32
针数
44
Reach Compliance Code
unknown
ECCN代码
3A991.B.2.B
最长访问时间
15 ns
I/O 类型
COMMON
JESD-30 代码
R-PDSO-G44
JESD-609代码
e0
长度
18.41 mm
内存密度
1048576 bit
内存集成电路类型
STANDARD SRAM
内存宽度
16
功能数量
1
端子数量
44
字数
65536 words
字数代码
64000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
64KX16
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
TSOP2
封装等效代码
TSOP44,.46,32
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
3.3 V
认证状态
Not Qualified
座面最大高度
1.2 mm
最大待机电流
0.0003 A
最小待机电流
2 V
最大压摆率
0.093 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
0.8 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
10.16 mm
文档预览
K6R1016V1C-C/C-L, K6R1016V1C-I/C-P
Document Title
64Kx16 Bit High-Speed CMOS Static RAM(3.3V Operating)
Operated at Commercial and Industrial Temperature Ranges.
for AT&T
CMOS SRAM
Revision History
Rev. No.
Rev. 0.0
Rev. 1.0
History
Initial release with Preliminary.
Release to Final Data Sheet.
1.1. Delete Preliminary.
1.2. Changed DC characteristics.
Item
I
CC
12ns
15ns
20ns
Added 48-fine pitch BGA.
Changed device part name for FP-BGA.
Item
Previous
Symbol
Z
ex) K6R1016V1C-Z -> K6R1016V1C-F
Changed device ball name for FP-BGA.
Previous
I/O1 ~ I/O8
I/O9 ~ I/O16
1. Added 10ns speed for FP-BGA only.
2. Changed Standby Current.
Item
Previous
Standby Current(Isb1)
0.3mA
3. Added Data Retention Characteristics.
Draft Data
Aug. 5. 1998
Sep. 7. 1998
Remark
Preliminary
Final
Previous
85mA
83mA
80mA
Changed
95mA
93mA
90mA
Sep. 17. 1998
Nov. 5. 1998
Changed
F
Final
Final
Rev. 2.0
Rev. 2.1
Rev. 2.2
Dec. 10. 1998
Changed
I/O9 ~ I/O16
I/O1 ~ I/O8
Mar. 2. 1999
Changed
0.5mA
Final
Rev. 3.0
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any questions,
please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
Revision 3.0
March 1999
K6R1016V1C-C/C-L, K6R1016V1C-I/C-P
FEATURES
• Fast Access Time 10
*
,12,15,20ns(Max.)
• Low Power Dissipation
Standby (TTL)
: 30mA(Max.)
(CMOS) : 5mA(Max.)
0.5mA(Max.) L-ver. only
Operating
*
K6R1016V1C-10: 105mA(Max.)
K6R1016V1C-12: 95mA(Max.)
K6R1016V1C-15: 93mA(Max.)
K6R1016V1C-20: 90mA(Max.)
• Single 3.3±0.3V Power Supply
• TTL Compatible Inputs and Outputs
• Fully Static Operation
- No Clock or Refresh required
• Three State Outputs
• 2V Minimum Data Retention; L-ver. only
• Center Power/Ground Pin Configuration
• Data Byte Control: LB: I/O
1
~ I/O
8
, UB: I/O
9
~ I/O
16
• Standard Pin Configuration:
K6R1016V1C-J: 44-SOJ-400
K6R1016V1C-T: 44-TSOP2-400BF
K6R1016V1C-F: 48-Fine pitch BGA with 0.75 Ball pitch
*
FP-BGA only.
for AT&T
CMOS SRAM
64K x 16 Bit High-Speed CMOS Static RAM(3.3V Operating)
GENERAL DESCRIPTION
The K6R1016V1C is a 1,048,576-bit high-speed Static Random
Access Memory organized as 65,536 words by 16 bits. The
K6R1016V1C uses 16 common input and output lines and has
at output enable pin which operates faster than address access
time at read cycle. Also it allows that lower and upper byte
access by data byte control (UB, LB). The device is fabricated
using SAMSUNG′s advanced CMOS process and designed for
high-speed circuit technology. It is particularly well suited for
use in high-density high-speed system applications. The
K6R1016V1C is packaged in a 400mil 44-pin plastic SOJ or
TSOP2 forward or 48-Fine pitch BGA.
FUNCTIONAL BLOCK DIAGRAM
Clk Gen.
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
I/O
1
~I/O
8
I/O
9
~I/O
16
ORDERING INFORMATION
K6R1016V1C-C10/C12/C15/C20
Commercial Temp.
Industrial Temp.
K6R1016V1C-I10/I12/I15/I20
Pre-Charge Circuit
Row Select
Memory Array
512 Rows
128x16 Columns
PIN FUNCTION
Pin Name
Data
Cont.
Data
Cont.
Gen.
CLK
A
9
A
10
A
11
A
12
A
13
A
14
A
15
Pin Function
Address Inputs
Write Enable
Chip Select
Output Enable
Lower-byte Control(I/O
1
~I/O
8
)
Upper-byte Control(I/O
9
~I/O
16
)
Data Inputs/Outputs
Power(+3.3V)
Ground
No Connection
I/O Circuit &
Column Select
A
0
- A
15
WE
CS
OE
LB
UB
I/O
1
~ I/O
16
WE
OE
UB
LB
CS
V
CC
V
SS
N.C
-2-
Revision 3.0
March 1999
K6R1016V1C-C/C-L, K6R1016V1C-I/C-P
PIN CONFIGURATION(TOP
VIEW)
1
2
3
for AT&T
CMOS SRAM
4
5
6
A
0
A
1
A
2
A
3
A
4
CS
I/O
1
I/O
2
I/O
3
1
2
3
4
5
6
7
8
9
44 A
15
43 A
14
42 A
13
41 OE
40 UB
39 LB
38 I/O
16
37 I/O
15
36 I/O
14
D
Vss
I/O4
N.C
A7
I/O12
Vcc
C
I/O2
I/O3
A5
A6
I/O11
I/O10
B
I/O1
UB
A3
A4
CS
I/O9
A
LB
OE
A0
A1
A2
N.C
I/O
4
10
Vcc 11
Vss 12
I/O
5
13
I/O
6
14
I/O
7
15
I/O
8
16
WE 17
A
5
18
A
6
19
A
7
20
A
8
21
N.C 22
SOJ/
TSOP2
35 I/O
13
34 Vss
33 Vcc
32 I/O
12
31 I/O
11
30 I/O
10
29 I/O
9
28 N.C
27 A
12
26 A
11
25 A
10
24 A
9
23 N.C
H
N.C
A8
A9
A10
A11
N.C
G
I/O8
N.C
A12
A13
WE
I/O16
F
I/O7
I/O6
A14
A15
I/O14
I/O15
E
Vcc
I/O5
N.C
N.C
I/O13
Vss
48-CSP
ABSOLUTE MAXIMUM RATINGS*
Parameter
Voltage on Any Pin Relative to V
SS
Voltage on V
CC
Supply Relative to V
SS
Power Dissipation
Storage Temperature
Operating Temperature
Commercial
Industrial
Symbol
V
IN
, V
OUT
V
CC
P
d
T
STG
T
A
T
A
Rating
-0.5 to 4.6
-0.5 to 4.6
1
-65 to 150
0 to 70
-40 to 85
Unit
V
V
W
°C
°C
°C
*
Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS*
(T
A
= to 70°C)
Parameter
Supply Voltage
Ground
Input High Voltage
Input Low Voltage
Symbol
V
CC
V
SS
V
IH
V
IL
Min
3.0
0
2.0
-0.5**
Typ
3.3
0
-
-
Max
3.6
0
V
CC
+0.5***
0.8
Unit
V
V
V
V
* The above parameters are also guaranteed at industrial temperature range.
**
V
IL
(Min) = -2.0V a.c(Pulse Width
8ns) for I
20mA.
***
V
IH
(Max) = V
CC +
2.0V a.c(Pulse Width
8ns) for I
20mA
-3-
Revision 3.0
March 1999
K6R1016V1C-C/C-L, K6R1016V1C-I/C-P
for AT&T
CMOS SRAM
DC AND OPERATING CHARACTERISTICS*
(T
A
=0 to 70°C, Vcc=3.3±0.3V, unless otherwise specified)
Parameter
Input Leakage Current
Output Leakage Current
Operating Current
Symbol
I
LI
I
LO
I
CC
Test Conditions
V
IN
=V
SS
to V
CC
CS=V
IH
or OE=V
IH
or WE=V
IL
V
OUT
=V
SS
to V
CC
Min. Cycle, 100% Duty
CS=V
IL,
V
IN
= V
IH
or V
IL,
I
OUT
=0mA
10ns
**
12ns
15ns
20ns
Standby Current
I
SB
I
SB1
Min. Cycle, CS=V
IH
f=0MHz, CS
≥V
CC
-0.2V,
V
IN
≥V
CC
-0.2V or V
IN
≤0.2V
I
OL
=8mA
I
OH
=-4mA
Normal
L-Ver.
Min
-2
-2
-
-
-
-
-
-
-
-
2.4
Max
2
2
105
95
93
90
30
5
0.5
0.4
-
V
V
mA
mA
Unit
µA
µA
mA
Output Low Voltage Level
Output High Voltage Level
V
OL
V
OH
* The above parameters are also guaranteed at industrial temperature range.
** FP-BGA only.
CAPACITANCE*
(T
A
=25°C, f=1.0MHz)
Item
Input/Output Capacitance
Input Capacitance
* Capacitance is sampled and not 100% tested.
Symbol
C
I/O
C
IN
Test Conditions
V
I/O
=0V
V
IN
=0V
MIN
-
-
Max
8
6
Unit
pF
pF
AC CHARACTERISTICS
(T
A
=0 to 70°C, V
CC
=3.3±0.3V, unless otherwise noted.)
TEST CONDITIONS*
Parameter
Input Pulse Levels
Input Rise and Fall Times
Input and Output timing Reference Levels
Output Loads
* The above test conditions are also applied at industrial temperature range.
Value
0V to 3V
3ns
1.5V
See below
Output Loads(A)
Output Loads(B)
for t
HZ
, t
LZ
, t
WHZ
, t
OW
, t
OLZ
& t
OHZ
R
L
= 50Ω
+3.3V
D
OUT
V
L
= 1.5V
Z
O
= 50Ω
30pF*
D
OUT
319Ω
353
5pF*
* Capacitive Load consists of all components of the
test environment.
* Including Scope and Jig Capacitance
-4-
Revision 3.0
March 1999
K6R1016V1C-C/C-L, K6R1016V1C-I/C-P
READ CYCLE*
Parameter
Read Cycle Time
Address Access Time
Chip Select to Output
Output Enable to Valid Output
UB, LB Access Time
Chip Enable to Low-Z Output
UB, LB Enable to Low-Z Output
Output Enable to Low-Z Output
Chip Disable to High-Z Output
Output Disable to High-Z Output
UB, LB Disable to High-Z Output
Output Hold from Address Change
Chip Selection to Power Up Time
Chip Selection to Power DownTime
Symbol
t
RC
t
AA
t
CO
t
OE
t
BA
t
LZ
t
BLZ
t
OLZ
t
HZ
t
OHZ
t
BHZ
t
OH
t
PU
t
PD
K6R1016V1C-10**
Min
10
-
-
-
-
3
0
0
0
0
0
3
0
-
Max
-
10
10
5
5
-
-
-
5
5
5
-
-
10
K6R1016V1C-12
Min
12
-
-
-
-
3
0
0
0
0
0
3
0
-
Max
-
12
12
6
6
-
-
-
6
6
6
-
-
12
for AT&T
CMOS SRAM
K6R1016V1C-15
Min
15
-
-
-
-
3
0
0
-
-
-
3
0
-
Max
-
15
15
7
7
-
-
-
7
7
7
-
-
15
K6R1016V1C-20
Min
20
-
-
-
-
3
0
0
-
-
-
3
0
-
Max
-
20
20
9
9
-
-
-
9
9
9
-
-
20
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
* The above parameters are also guaranteed at industrial temperature range.
**
FP-BGA only.
WRITE CYCLE*
Parameter
Write Cycle Time
Chip Select to End of Write
Address Set-up Time
Address Valid to End of Write
Write Pulse Width(OE High)
Write Pulse Width(OE Low)
UB, LB Valid to End of Write
Write Recovery Time
Write to Output High-Z
Data to Write Time Overlap
Data Hold from Write Time
End Write to Output Low-Z
Symbol
t
WC
t
CW
t
AS
t
AW
t
WP
t
WP1
t
BW
t
WR
t
WHZ
t
DW
t
DH
t
OW
K6R1016V1C-10**
Min
10
7
0
7
7
10
7
0
0
5
0
3
Max
-
-
-
-
-
-
-
-
5
-
-
-
K6R1016V1C-12
Min
12
8
0
8
8
12
8
0
0
6
0
3
Max
-
-
-
-
-
-
-
-
6
-
-
-
K6R1016V1C-15
Min
15
9
0
9
9
15
9
0
0
7
0
3
Max
-
-
-
-
-
-
-
-
7
-
-
-
K6R1016V1C-20
Min
20
10
0
10
10
20
10
0
0
8
0
3
Max
-
-
-
-
-
-
-
-
9
-
-
-
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
* The above parameters are also guaranteed at industrial temperature range.
** FP-BGA only.
TIMMING DIAGRAMS
TIMING WAVEFORM OF READ CYCLE(1)
(Address Controlled
,
CS=OE=V
IL
, WE=V
IH
, UB, LB=V
IL
t
RC
Address
t
OH
Data Out
Previous Valid Data
t
AA
Valid Data
-5-
Revision 3.0
March 1999
查看更多>
恩智浦荣获2011中国RFID行业十大最有影响力国际品牌奖
本帖最后由 jameswangsynnex 于 2015-3-3 20:00 编辑 恩智浦 智...
Semiconductors 移动便携
最后几小时啦:求助电源专家Vicor+脉冲负载电源设计方法白皮书下载有礼
没错,今天是Vicor家白皮书有奖下载的最后一天(4月25日),想提问的和了解脉冲电源设计方案的,...
EEWORLD社区 电源技术
集成电路测试方法
在传统的 IC 设计中,每一个电路的设计几乎都是从零开始,所谓的复用也仅仅局限于标准单元库中的...
xiaoxin1 测试/测量
LM3S8962资料总结
1: 中文手册 LM3S8962资料总结 2:例程 有了 下来看看 帮顶~~ 驱动说明: 什么...
daicheng 微控制器 MCU
请教,FPGA中提示 has multiple drivers due to the non-tri-state driver
我在FPGA中自定义了一个FIFO,一个RAM,两者都与DSP的总线XD(16位)相连,错误提示...
wangsunhust FPGA/CPLD
不错的单片机模拟软件
对于学习51单片机系列的模拟有很好的实现方式,有很好的学习效果 不错的单片机模拟软件 比proteu...
oxygenkun 单片机
热门器件
热门资源推荐
器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
需要登录后才可以下载。
登录取消