Synchronous Graphics RAM, 256KX32, 8ns, CMOS, PQFP100, 14 X 20 MM, 3 MM HEIGHT, 0.65 MM PITCH, PLASTIC, QFP-100
厂商名称:SAMSUNG(三星)
厂商官网:http://www.samsung.com/Products/Semiconductor/
下载文档型号 | KM4132G271BQ-12 | KM4132G271BTQ-12 | KM4132G271BTQ-H | KM4132G271BQ-H |
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描述 | Synchronous Graphics RAM, 256KX32, 8ns, CMOS, PQFP100, 14 X 20 MM, 3 MM HEIGHT, 0.65 MM PITCH, PLASTIC, QFP-100 | Synchronous Graphics RAM, 256KX32, 8ns, CMOS, PQFP100, 14 X 20 MM, 1.20 MM HEIGHT, 0.65 MM PITCH, TQFP-100 | Synchronous Graphics RAM, 256KX32, 6ns, CMOS, PQFP100, 14 X 20 MM, 1.20 MM HEIGHT, 0.65 MM PITCH, TQFP-100 | Synchronous Graphics RAM, 256KX32, 6ns, CMOS, PQFP100, 14 X 20 MM, 3 MM HEIGHT, 0.65 MM PITCH, PLASTIC, QFP-100 |
厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
零件包装代码 | QFP | QFP | QFP | QFP |
包装说明 | QFP, | TQFP, | TQFP, | QFP, |
针数 | 100 | 100 | 100 | 100 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST |
最长访问时间 | 8 ns | 8 ns | 6 ns | 6 ns |
其他特性 | AUTO REFRESH/SELF REFRESH | AUTO REFRESH/SELF REFRESH | AUTO REFRESH/SELF REFRESH | AUTO REFRESH/SELF REFRESH |
JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
长度 | 20 mm | 20 mm | 20 mm | 20 mm |
内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
内存集成电路类型 | SYNCHRONOUS GRAPHICS RAM | SYNCHRONOUS GRAPHICS RAM | SYNCHRONOUS GRAPHICS RAM | SYNCHRONOUS GRAPHICS RAM |
内存宽度 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 |
端子数量 | 100 | 100 | 100 | 100 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | TQFP | TQFP | QFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK, THIN PROFILE | FLATPACK, THIN PROFILE | FLATPACK |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3 mm | 1.2 mm | 1.2 mm | 3 mm |
自我刷新 | YES | YES | YES | YES |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
宽度 | 14 mm | 14 mm | 14 mm | 14 mm |