型号
- 型号
- 关键词
EDO DRAM, 1MX4, 50ns, CMOS, PDSO24
厂商名称：SAMSUNG(三星)
厂商官网：http://www.samsung.com/Products/Semiconductor/
下载文档| 型号 | KM44C1005CT-L5 | KM44C1005CJ-L6 | KM44C1005CJ-L7 | KM44C1005CT-L6 | KM44C1005CT-L7 | KM44C1005CJ-L5 |
|---|---|---|---|---|---|---|
| 描述 | EDO DRAM, 1MX4, 50ns, CMOS, PDSO24 | EDO DRAM, 1MX4, 60ns, CMOS, PDSO24 | EDO DRAM, 1MX4, 70ns, CMOS, PDSO24 | EDO DRAM, 1MX4, 60ns, CMOS, PDSO24 | EDO DRAM, 1MX4, 70ns, CMOS, PDSO24 | EDO DRAM, 1MX4, 50ns, CMOS, PDSO24 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Objectid | 1164773569 | 1164773567 | 1164773568 | 1164773570 | 1164773571 | 1164773566 |
| 包装说明 | TSOP, TSOP24/26,.36 | SOJ, SOJ24/26,.34 | SOJ, SOJ24/26,.34 | TSOP, TSOP24/26,.36 | TSOP, TSOP24/26,.36 | SOJ, SOJ24/26,.34 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 50 ns | 60 ns | 70 ns | 60 ns | 70 ns | 50 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-G24 | R-PDSO-J24 | R-PDSO-J24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-J24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP | SOJ | SOJ | TSOP | TSOP | SOJ |
| 封装等效代码 | TSOP24/26,.36 | SOJ24/26,.34 | SOJ24/26,.34 | TSOP24/26,.36 | TSOP24/26,.36 | SOJ24/26,.34 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
| 自我刷新 | YES | YES | YES | YES | YES | YES |
| 最大待机电流 | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A |
| 最大压摆率 | 0.085 mA | 0.075 mA | 0.065 mA | 0.075 mA | 0.065 mA | 0.085 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | J BEND | J BEND | GULL WING | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 |