Standard SRAM, 8KX8, 70ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
厂商名称:SAMSUNG(三星)
厂商官网:http://www.samsung.com/Products/Semiconductor/
下载文档型号 | KM6264BS-7 | KM6264B-12 | KM6264BS-12 | KM6264BG-12 | KM6264B-10 | KM6264BG-7 | KM6264BS-10 | KM6264B-7 |
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描述 | Standard SRAM, 8KX8, 70ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 120ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 120ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOP-28 | Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 70ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOP-28 | Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 70ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 |
厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
零件包装代码 | DIP | DIP | DIP | SOIC | DIP | SOIC | DIP | DIP |
包装说明 | DIP, DIP28,.3 | DIP, | DIP, DIP28,.3 | SOP, SOP28,.5 | DIP, | SOP, SOP28,.5 | DIP, DIP28,.3 | DIP, |
针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 70 ns | 120 ns | 120 ns | 120 ns | 100 ns | 70 ns | 100 ns | 70 ns |
JESD-30 代码 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 |
长度 | 34.415 mm | 36.325 mm | 34.415 mm | 18.29 mm | 36.325 mm | 18.29 mm | 34.415 mm | 36.325 mm |
内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bi |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
可输出 | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | SOP | DIP | SOP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 3 mm | 5.08 mm | 3 mm | 5.08 mm | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | YES | NO | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 15.24 mm | 7.62 mm | 8.38 mm | 15.24 mm | 8.38 mm | 7.62 mm | 15.24 mm |
是否无铅 | 含铅 | - | 含铅 | 含铅 | - | 含铅 | 含铅 | - |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | - | 不符合 | 不符合 | - |
I/O 类型 | COMMON | - | COMMON | COMMON | - | COMMON | COMMON | - |
JESD-609代码 | e0 | - | e0 | e0 | - | e0 | e0 | - |
封装等效代码 | DIP28,.3 | - | DIP28,.3 | SOP28,.5 | - | SOP28,.5 | DIP28,.3 | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
电源 | 5 V | - | 5 V | 5 V | - | 5 V | 5 V | - |
最大待机电流 | 0.002 A | - | 0.002 A | 0.001 A | - | 0.001 A | 0.002 A | - |
最小待机电流 | 4.5 V | - | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | - |
最大压摆率 | 0.055 mA | - | 0.045 mA | 0.045 mA | - | 0.045 mA | 0.045 mA | - |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |