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KMB050N60PU/P

Power Field-Effect Transistor, 50A I(D), 60V, 0.022ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, TO-220AB, 3 PIN

器件类别:分立半导体    晶体管   

厂商名称:KEC

厂商官网:http://www.keccorp.com/

下载文档
器件参数
参数名称
属性值
厂商名称
KEC
包装说明
FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code
unknown
ECCN代码
EAR99
雪崩能效等级(Eas)
493 mJ
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
60 V
最大漏极电流 (ID)
50 A
最大漏源导通电阻
0.022 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码
TO-220AB
JESD-30 代码
R-PSFM-T3
元件数量
1
端子数量
3
工作模式
ENHANCEMENT MODE
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
FLANGE MOUNT
极性/信道类型
N-CHANNEL
最大脉冲漏极电流 (IDM)
200 A
表面贴装
NO
端子形式
THROUGH-HOLE
端子位置
SINGLE
晶体管应用
SWITCHING
晶体管元件材料
SILICON
文档预览
SEMICONDUCTOR
TECHNICAL DATA
General Description
This planar stripe MOSFET has better characteristics, such as fast
switching time, low on resistance, low gate charge and excellent
avalanche characteristics. It is mainly suitable for active power factor
correction , electronic lamp ballasts based on half bridge topology and
switching mode power supplies.
KMB050N60P
N CHANNEL MOS FIELD
EFFECT TRANSISTOR
FEATURES
・V
DSS
= 60V, I
D
= 50A
・Drain-Source
ON Resistance :
R
DS(ON)
=0.022Ω @V
GS
= 10V
・Qg(typ.)
= 32nC
・Improved
dv/dt capacity, high Ruggedness
・Maximum
Junction Temperature Range (175℃)
MAXIMUM RATING (Tc=25℃)
CHARACTERISTIC
Drain-Source Voltage
Gate-Source Voltage
@T
C
=25℃
Drain Current
@T
C
=100℃
Pulsed (Note1)
Single Pulsed Avalanche Energy
(Note 2)
Repetitive Avalanche Energy
(Note 1)
Peak Diode Recovery dv/dt
(Note 3)
Drain Power
Dissipation
Tc=25℃
Derate above 25℃
T
j
T
stg
I
DP
E
AS
E
AR
dv/dt
P
D
0.8
175
-55½175
W/℃
SYMBOL
V
DSS
V
GSS
I
D
35
200
493
12
7.0
120
mJ
mJ
V/ns
W
A
RATING
60
±20
50
UNIT
V
V
Maximum Junction Temperature
Storage Temperature Range
Thermal Characteristics
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink
Thermal Resistance, Junction-to-
Ambient
R
thJC
R
thCS
R
thJA
1.24
0.5
62.5
℃/W
℃/W
℃/W
2006. 4. 24
Revision No : 1
1/6
KMB050N60P
ELECTRICAL CHARACTERISTICS (Tc=25℃)
CHARACTERISTIC
SYMBOL
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
Static
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature Coefficient
Drain Cut-off Current
Gate Threshold Voltage
Gate Leakage Current
Drain-Source ON Resistance
BV
DSS
ΔBV
DSS
/ΔT
j
I
DSS
V
th
I
GSS
R
DS(ON)
I
D
=250μ V
GS
=0V
A,
I
D
=250μ Referenced to 25℃
A,
V
DS
=60V, V
GS
=0V,
V
DS
=V
GS
, I
D
=250μ
A
V
GS
=±20V, V
DS
=0V
V
GS
=10V, I
D
=25A
60
-
-
2.0
-
-
-
0.07
-
-
-
0.018
-
-
10
4.0
±100
0.022
V
V/℃
μ
A
V
nA
Dynamic
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-on Delay time
Turn-on Rise time
Turn-off Delay time
Turn-off Fall time
Input Capacitance
Reverse Transfer Capacitance
Output Capacitance
Source-Drain Diode Ratings
Continuous Source Current
Pulsed Source Current
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
I
S
V
GS
<V
th
I
SP
V
SD
t
rr
Q
rr
I
S
=50A, V
GS
=0V
I
S
=50A, V
GS
=0V,
s
dIs/dt=100A/μ
-
-
-
-
-
-
50
70
200
1.5
-
-
V
ns
μ
C
-
-
50
A
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
rss
C
oss
V
DS
=25V, V
GS
=0V, f=1.0MHz
V
DD
= 30V
I
D
=25A
R
G
= 25Ω
(Note4,5)
-
-
-
-
-
80
85
1050
70
460
170
180
1365
90
600
pF
V
DS
= 48V, I
D
= 50A
V
GS
=10V
(Note4,5)
-
-
-
-
-
32
8
12
20
100
42
-
-
50
210
ns
nC
Note 1) Repetivity rating : Pulse width limited by junction temperature.
Note 2) L=230mH, I
S
=50A, V
DD
=25V, R
G
=25Ω, Starting T
j
=25℃.
Note 3) I
S
≤50A,
dI/dt≤300A/㎲, V
DD
≤BV
DSS
, Starting T
j
=25℃.
Note 4) Pulse Test : Pulse width
≤300㎲,
Duty Cycle
≤2%.
Note 5) Essentially independent of operating temperature.
2006. 4. 24
Revision No : 1
2/6
KMB050N60P
2006. 4. 24
Revision No : 1
3/6
KMB050N60P
2006. 4. 24
Revision No : 1
4/6
KMB050N60P
2006. 4. 24
Revision No : 1
5/6
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