5.72 ref.
Shell: copper alloy,
Plating- tin or tin/lead
over copper
Insulator: UL94V-0 rated
PBT thermoplastic
Contact Material: phosphor bronze
Contact Plating Options:
Standard - gold flash
on contact area, 120u" tin/lead
on solder tails, all over
50u" nickel underplate
-30 Option- 30u" gold
on contact area, 120u" tin/lead
on solder tails, all over
50u" nickel underplate
4-Ø0.92±0.1
5.12
pos. 4
19.30 ref.
4-Ø1.35±0.1
4
1.1
6.00
0.27 ref.
7.00
0.73
11.76 ref.
2.00
13.85 ref.
12.5
14.7
1
Rated Voltage:
30V AC (rms)
Contact Current Rating:
1A max.
Contact Resistance:
30 milliohms max.
Insulation Resistance:
1000 Megohms min.
Dielectric Withstanding:
500V AC
Operating Temperature:
-25°C to 80°C
2.00
2.72
5.44
pos. 1
3.8
9.90 ref.
2.30
11.8
7.0
Edge of Connector
Mating Force: 3.57kg max.
Unmating Force: 1.02kg min.
Recommended PCB Layout
(top view)
Part Number
7.4
KUSB-SL-AS1N-W
KUSB-SL-AS1N-W30
KUSB-SL-AS1N-B
KUSB-SL-AS1N-B30
Gold Flash (standard)
30u" Gold (30 option)
Gold Flash (standard)
30u" Gold (30 option)
White
Black
Tolerances
X.X ± 0.35
X.XX ± 0.25
Unless Stated
Otherwise
REVISION
DATE
DESCRIPTION
DRAWN BY
REV CHECK BY
UNITS
REVISED BY
REV CHECK DATE
DATE
