normally open (1-Form-A) relay. It features low, 25,
maximum on-resistance, and includes integrated
current limiting.
Features
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
No Moving Parts
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
FCC Compatible
•
VDE Compatible
•
No EMI/RFI Generation
•
Small 8-Pin DIP Package
•
Machine Insertable, Wave Solderable
•
Surface Mount Tape & Reel Version Available
Approvals
•
UL recognized: File Number E76270
•
CSA Certified: File Number LR43639-10
•
EN/IEC 60950-1 compliant
Ordering Information
Part #
LAA100L
LAA100PL
LAA100PLTR
LAA100LS
LAA100LSTR
Description
8 Pin DIP (50/Tube)
8-Pin Flatpack (50/Tube)
8-Pin Flatpack (1000/Reel)
8 Pin Surface Mount (50/Tube)
8 Pin Surface Mount (1,000/Reel)
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook,
Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment—Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Pin Configuration
AC/DC Configuration
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
1
2
3
4
8
7
6
5
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Switching Characteristics of
Normally Open (Form A) Devices
Form-A
I
F
90%
I
LOAD
t
on
10%
t
off
Pb
DS-LAA100L-R02
e
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NTEGRATED
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Absolute Maximum Ratings @25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
LAA100L
Ratings
350
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @25ºC
Parameter
Output Characteristics
Load Current
Continuous
1
Peak
On-Resistance
2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance Input to Output
1
2
Conditions
Symbol
Min
Typ
Max
Units
-
10ms
I
L
=120mA
V
L
=350V
I
F
= 5mA, V
L
= 10V
V
L
= 50V, f=1MHz
I
L
= 120mA
-
I
F
= 5mA
V
R
= 5V
-
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
-
-
-
-
35
-
1.0
1.2
-
3
120
±350
25
1
5
5
-
5
-
1.4
10
-
mA
rms
/ mA
DC
mA
P
µA
ms
ms
pF
mA
mA
V
µA
pF
If both poles operate, the load current must be derated so that the package power dissipation value is not exceeded.
Measurement taken within 1 second of on-time.
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R02
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
35
30
Device Count (N)
LAA100L
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
25
20
15
10
5
0
0.15
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=120mA
DC
)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=120mA
DC
)
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
0.25
0.35 0.45 0.55
Turn-On (ms)
0.65
0.75
Device Count (N)
25
Device Count (N)
0.025
0.075
0.125
0.175
0.225
Typical I
F
for Switch Operation
(N=50, I
L
=120mA
DC
)
25
20
15
10
5
0
0.45
0.75
1.05 1.35 1.65
LED Current (mA)
1.95
2.25
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, I
L
=120mA
DC
)
35
30
Device Count (N)
25
20
15
10
5
0.45
0.75
1.05 1.35 1.65 1.95
LED Current (mA)
2.25
Typical On-Resistance Distribution
(N=50, I
F
=2mA, I
L
=120mA
DC
)
Device Count (N)
Device Count (N)
0
17.0
17.4
17.8 18.2 18.6 19.0
On-Resistance ( )
19.4
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
376.3 382.8 389.3 395.8 402.3 408.8 415.3
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
Turn-On Time (ms)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=120mA
DC
)
0.35
0.30
Turn-Off Time (ms)
0.25
0.20
0.15
0.10
0.05
0
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=120mA
DC
)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
10
15
20
25
30
35
40
45
50
0
5
LED Forward Current (mA)
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R02
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NTEGRATED
C
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D
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
60
On-Resistance ( )
50
40
30
20
10
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
LAA100L
Typical On-Resistance vs. Temperature
(I
F
=2mA, I
L
=120mA
DC
)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Typical Turn-On Time vs. Temperature
(I
L
=120mA
DC
)
Turn-Off Time (ms)
I
F
=2mA
I
F
=5mA
I
F
=10mA
I
F
=20mA
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Typical Turn-Off Time vs. Temperature
(I
F
=120mA
DC
)
Turn-On Time (ms)
I
F
=2mA
I
F
=5mA
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
3.0
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=120mA
DC
)
3.0
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=120mA
DC
)
Maximum Load Current vs. Temperature
180
160
Load Current (mA)
140
120
100
80
60
40
20
0
I
F
=10mA
I
F
=5mA
I
F
=2mA
-20
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
Typical Load Current vs. Load Voltage
(I
F
=2mA)
150
Blocking Voltage (V
P
)
Load Current (mA)
100
50
0
-50
-100
-150
-3
-2
-1
0
1
Load Voltage (V)
2
3
-40
420
410
Typical Blocking Voltage
vs. Temperature
16
14
Leakage (nA)
12
10
8
6
4
2
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
Typical Leakage vs. Temperature
Measured across Pins 4 & 6
400
390
380
370
360
-20
0
20
40
60
Temperature (ºC)
80
100
Typical Current Limiting
vs. Temperature
(I
F
=2mA)
350
300
Current (mA)
250
200
150
100
50
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
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Manufacturing Information
Moisture Sensitivity
LAA100L
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LAA100L / LAA100LS / LAA100PL
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
LAA100L / LAA100LS
LAA100PL
Maximum Temperature x Time
250ºC for 30 seconds
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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FPGA/CPLD
